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Thermal insulation board and preparation method thereof

A thermal insulation and integrated technology, applied in the direction of chemical instruments and methods, other household appliances, household components, etc., can solve the problems of airgel powder dropping, airgel brittleness, high thermal conductivity, etc., and achieve excellent impact resistance compressive properties, improve mechanical properties, and expand the effect of applications

Active Publication Date: 2020-08-11
GONG YI VAN-RES INNOVATION COMPOSITE MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Insulation mortar has the following disadvantages: high density, the weight of the insulation layer will easily bring difficulties to the construction, and increase the load-bearing burden of the building skeleton; high thermal conductivity, meet the national energy-saving standard, thick thickness; high hygroscopicity, easily lead to excessive weight, Falling off; Affected by construction factors, the strength changes greatly
However, due to the structural characteristics of airgel, airgel has disadvantages such as high brittleness and poor flexibility. At the same time, due to its preparation method, SiO 2 During the transportation, construction and use of airgel blankets, it is common for airgel powder to fall off from the felt body. The powder loss not only brings inconvenience to the construction, but also poses a threat to the health of the construction workers, and also reduces air condensation. The performance of the rubber felt itself greatly limits the application range of the airgel felt
Using airgel as the core material of the composite board can solve the problem of airgel powder dropping, but in view of the disadvantages of airgel's poor mechanical properties, it cannot meet the use requirements in some occasions that require high mechanical properties.

Method used

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  • Thermal insulation board and preparation method thereof
  • Thermal insulation board and preparation method thereof
  • Thermal insulation board and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0042] Such as Figure 1~3 As shown, a heat insulation board includes a first panel layer 1, a second panel layer 2, a sandwich layer, and a skeleton support layer 4, and the sandwich layer is arranged between the first panel layer 1 and the second panel layer 2 In between, the sandwich layer is formed by splicing several cuboid fiber-reinforced airgel composite felts 3, between the sandwich layer and the first panel layer 1, between the sandwich layer and the second panel layer 2, and around the edges of the sandwich layer (front, back, left, right) and any two adjacent fiber-reinforced airgel composite mats 3 in the sandwich layer are integrally cured and filled with a skeleton support layer 4, and the skeleton support layer 4 is connected with the first panel layer 1 and the second panel Layer 2 is integrally cured and molded;

[0043] The first panel layer 1, the second panel layer 2 and the skeleton support layer 4 are glass fiber reinforced unsaturated polyester composi...

Embodiment 2

[0053] A kind of thermal insulation board, structure such as figure 1 , figure 2 and Figure 4 As shown, that is, the difference from Example 1 is: the implementation of the flow guide and the injection part is shown in Figure 4 , the injection part also includes a main injection tube 62, all branch injection tubes 61 are connected to the main injection tube 62, and the other end of the main injection tube 62 is used as the injection port 8; the preparation steps are the same as in Example 1.

[0054] The density of the thermal insulation board prepared in this embodiment is 0.28 g / cm 3 , the compressive strength is 3.2 Mpa.

Embodiment 3

[0056] A kind of thermal insulation board, structure such as figure 1 , figure 2 and Figure 5 As shown, that is, the difference from Example 1 is: the implementation of the flow guide and the injection part is shown in Figure 4 , the guide part is a guide tube 5, and the glue injection part is a glue injection tube 7; the guide tube 5 is formed by spirally winding a plastic tape (which can be purchased through the commercially available "used for accommodating electric wires or network cable winding tube "), the diversion tube 5 is continuously and evenly laid on the surface of the first diversion net in a U shape, and one end of the diversion tube 5 is connected with the injection tube 7, and the other end of the injection tube 7 is used as the injection port 8 ; The preparation steps are the same as in Example 1.

[0057] The density of the thermal insulation board prepared in this embodiment is 0.33 g / cm 3 , the compressive strength is 3.8 Mpa.

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Abstract

The invention belongs to the technical field of thermal insulation materials, and discloses a thermal insulation board and a preparation method thereof. The thermal insulation board comprises a firstpanel layer, a second panel layer, a sandwich layer and framework supporting layers. The sandwich layer is arranged between the first panel layer and the second panel layer; the sandwich layer is formed by splicing a plurality of fiber reinforced aerogel composite felts; the framework supporting layers are integrally formed and fill between the sandwich layer and the first panel layer and betweenthe sandwich layer and the second panel layer, the peripheral edges of the sandwich layer and splicing seams of any two adjacent fiber reinforced aerogel composite felts in the sandwich layer, and theframework supporting layers, the first panel layer and the second panel layer are integrally formed. The preparation method comprises the following steps: laying, sealing, preparing a glue solution,injecting glue, curing and demolding to obtain the thermal insulation board. An integral curing molding method is adopted, the fiber reinforced resin composite panel is obtained, and meanwhile, the framework supporting layers are formed between the fiber reinforced aerogel composite felts so that the prepared thermal insulation board is light in weight, thermal-insulating and greatly improved in mechanical property.

Description

technical field [0001] The invention belongs to the technical field of thermal insulation materials, and in particular relates to a thermal insulation board and a preparation method thereof. Background technique [0002] At present, the development of new energy, the improvement of the utilization rate of existing energy and the conservation of energy have attracted great attention from all countries. my country is an energy-poor country, therefore, rational use of energy and energy conservation are of great significance to the sustainable development of our society. Adopting new technologies and processes to develop environmentally friendly heat insulation materials is one of the most effective and economical measures to save energy. [0003] The commonly used thermal insulation materials in construction are mostly thermal insulation mortar, which is a kind of ready-mixed mortar made of various lightweight materials as aggregates, cement as cementitious material, mixed wit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/36B32B27/06B32B27/12B32B3/08B32B3/14B32B27/26B32B27/18B32B27/04B32B7/12B32B33/00B29C70/36B29C70/54B29L31/30
CPCB29C70/36B29C70/54B29L2031/30B32B3/085B32B3/14B32B27/08B32B27/12B32B27/18B32B27/26B32B27/36B32B33/00B32B2250/40B32B2260/021B32B2260/046B32B2266/0235B32B2266/0285B32B2307/30B32B2307/304B32B2307/558
Inventor 董会娜姚栋嘉余启勇张继承刘光亚李帅帅陈帅杨红霞吴恒张东生
Owner GONG YI VAN-RES INNOVATION COMPOSITE MATERIAL CO LTD
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