Thermal insulation board and preparation method thereof
A thermal insulation and integrated technology, applied in the direction of chemical instruments and methods, other household appliances, household components, etc., can solve the problems of airgel powder dropping, airgel brittleness, high thermal conductivity, etc., and achieve excellent impact resistance compressive properties, improve mechanical properties, and expand the effect of applications
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Embodiment 1
[0042] Such as Figure 1~3 As shown, a heat insulation board includes a first panel layer 1, a second panel layer 2, a sandwich layer, and a skeleton support layer 4, and the sandwich layer is arranged between the first panel layer 1 and the second panel layer 2 In between, the sandwich layer is formed by splicing several cuboid fiber-reinforced airgel composite felts 3, between the sandwich layer and the first panel layer 1, between the sandwich layer and the second panel layer 2, and around the edges of the sandwich layer (front, back, left, right) and any two adjacent fiber-reinforced airgel composite mats 3 in the sandwich layer are integrally cured and filled with a skeleton support layer 4, and the skeleton support layer 4 is connected with the first panel layer 1 and the second panel Layer 2 is integrally cured and molded;
[0043] The first panel layer 1, the second panel layer 2 and the skeleton support layer 4 are glass fiber reinforced unsaturated polyester composi...
Embodiment 2
[0053] A kind of thermal insulation board, structure such as figure 1 , figure 2 and Figure 4 As shown, that is, the difference from Example 1 is: the implementation of the flow guide and the injection part is shown in Figure 4 , the injection part also includes a main injection tube 62, all branch injection tubes 61 are connected to the main injection tube 62, and the other end of the main injection tube 62 is used as the injection port 8; the preparation steps are the same as in Example 1.
[0054] The density of the thermal insulation board prepared in this embodiment is 0.28 g / cm 3 , the compressive strength is 3.2 Mpa.
Embodiment 3
[0056] A kind of thermal insulation board, structure such as figure 1 , figure 2 and Figure 5 As shown, that is, the difference from Example 1 is: the implementation of the flow guide and the injection part is shown in Figure 4 , the guide part is a guide tube 5, and the glue injection part is a glue injection tube 7; the guide tube 5 is formed by spirally winding a plastic tape (which can be purchased through the commercially available "used for accommodating electric wires or network cable winding tube "), the diversion tube 5 is continuously and evenly laid on the surface of the first diversion net in a U shape, and one end of the diversion tube 5 is connected with the injection tube 7, and the other end of the injection tube 7 is used as the injection port 8 ; The preparation steps are the same as in Example 1.
[0057] The density of the thermal insulation board prepared in this embodiment is 0.33 g / cm 3 , the compressive strength is 3.8 Mpa.
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