Electrolytic copper foil surface treatment technology

Abstract

The invention discloses an electrolytic copper foil surface treatment technology. The technology comprises the follow steps of carrying out pretreatment; carrying out roughening, wherein roughening treatment is carried out on original foil subjected to pretreatment in a solution containing copper sulfate, sulphuric acid, sodium silicate and stannous sulfate; carrying out curing, wherein one layerof dense metallic copper is deposited in a gap between every two adjacent nodular particles of the copper foil subjected to roughening; carrying out electroplating of dissimilar metal, wherein in an inert gas atmosphere, the copper foil is heated to form a brass layer and then is subjected to antioxidant treatment, and antioxidant liquid is prepared by dissolving chromium trioxide and a glucose solution into water; soaking the obtained copper foil into the antioxidant liquid for one second to four seconds; carrying out coating, wherein a silane coupling agent is sprayed to the surface of the copper foil after the copper foil is subjected to antioxidant treatment, and then the copper foil is dried in an air-blowing manner; and carrying out oven drying. According to the electrolytic copper foil surface treatment technology, because the tin sulfate is added in an electroplating dissimilar metal technology to serve as an additive instead of arsenic in a traditional technology, the electrolytic copper foil surface treatment technology is friendly to the environment, and accords with the concept of green development.

Description

technical field [0001] The invention relates to the technical field of electrolytic copper foil treatment technology, in particular to a surface treatment technology of electrolytic copper foil. Background technique [0002] Copper foil refers to the extremely thin material of copper. It is customary to call copper and copper alloy sheets and strips with a thickness of less than 100um copper foil. Electrolytic copper foil is an important material for printed circuit boards, mainly used in electronic computers, industrial control, aerospace and all electrical fields. In recent years, the domestic electronic information industry has developed rapidly, and the demand for copper foil for printed circuit boards and its upstream products has also increased. In recent years, with the continuous development of my country's economy and the great progress made in science and technology, my country has become a major exporter of printed circuit boards. The importance of electrolytic ...

AI Technical Summary

Problems solved by technology

At present, when domestic enterprises carry out surface treatment on electrolytic copper foil, the barrier layer treatment mainly adopts galvanized layer. The copper foil prepared by this method will undergo side erosion when it is used in the circuit corrosion process of printed circuit, resulting in The bonding force with the insulator matrix decreases. In severe cases, the copper foil may even fall off from the insulating matrix. The galvanized copper foil is also prone to oxidation problems when stored at room temperature. These are the electrolytic copper foils of domestic enterprises and foreign high-end electrolytic copper foils. Important reasons for the large gap in performance

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