A kind of substrate hybrid film multilayer wiring manufacturing method

Abstract

The invention discloses a method for manufacturing a substrate mixed thin-film multilayer wiring. The manufacturing method comprises the following steps: providing a substrate, depositing an aluminum composite film layer on the thin film, performing selective anodic oxidation of aluminum, and forming aluminum wiring insulation in a porous alumina structure layer, the chip heat dissipation structure and the metal aluminum column array are formed in the aluminum film; the thin film deposition aluminum film is performed again, and the aluminum selective anodic oxidation is performed, and repeated in sequence to prepare the Al 2 O 3 / Al thin film multi-layer wiring layer; deposit a copper composite film layer on it, use photolithography to make copper film conduction strips, and make BCB dielectric film through holes; then use thin film deposition and photolithography to make top film conduction strips and soldering disc to prepare a BCB / Cu thin film multilayer wiring layer. Overcome the problems such as the inability to increase the number of thin-film wiring layers, poor interconnect reliability caused by the accumulation of BCB stress, and difficulty in assembling soft substrates, and high-density wiring interconnection on the substrate can meet the miniaturization of high-power chips and large-scale integrated circuits. , High reliability integration requirements.

Description

technical field [0001] The invention belongs to the field of microelectronic encapsulation, and in particular relates to a method for fabricating a substrate hybrid film multilayer wiring. Background technique [0002] The rapid development of modern electronic technology requires electronic systems to develop in the direction of miniaturization, high performance and high reliability. Especially in the aerospace field and civil electronic products, the demand for system integration is more urgent. With the development of VLSI and the increasing complexity of the electrical functions of the integrated objects, system-in-package technology that can integrate multiple functions has become a research hotspot. [0003] System-in-package can integrate active devices such as digital circuits, analog circuits and microwave circuits, as well as various passive devices. The increase of its system complexity leads to a sharp increase in the number of active and passive devices in the...

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a substrate mixed thin film multilayer wiring manufacturing method to overcome problems such as the inability to increase the number of thin film wiring layers, poor interconnection reliability caused by BCB stress accumulation, and difficulty in assembling soft substrates.

Images