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Multi-enclosure and multi-layer circuit wiring connection structure

A connection structure and multi-layer circuit technology, which is applied in the direction of electrical connection of printed components, printed circuits, printed circuits, etc., can solve the problems of complex circuit wiring structure, inconvenient practical use, cumbersome wiring operation steps, etc.

Pending Publication Date: 2021-07-06
深圳市信望电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing circuit wiring structure is complicated, and the wiring operation steps are relatively cumbersome, which is not convenient for practical use

Method used

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  • Multi-enclosure and multi-layer circuit wiring connection structure
  • Multi-enclosure and multi-layer circuit wiring connection structure
  • Multi-enclosure and multi-layer circuit wiring connection structure

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Such as figure 1 As shown, a multi-layer circuit wiring connection structure includes a multi-layer circuit board body 1, a contact point area circuit board body 2 and a connection point area multilayer circuit board assembly, and the connection point area multilayer circuit board assembly is set On the multi-layer circuit board body 1, a number of contact points 7 are provided on the circuit board body 2 in the contact point area, and a number of connection points 8 are provided on the multilayer circuit board assembly in the connection point area, and the contact points 7 are connected to the corresponding connection points. The points 8 are connected by connecting lines 9, and two adjacent rows of connecting points 8 are arranged obliquely.

[0022] In this embodiment, the connection point region multilayer circuit board includes a first connection point region multilayer circuit board body 3, a second connection point region multilayer circuit board body 4, a third ...

Embodiment 2

[0029] Such as figure 2 As shown, a multi-layer circuit wiring connection structure includes a multi-layer circuit board body 1, a contact point area circuit board body 2 and a connection point area multilayer circuit board assembly, and the connection point area multilayer circuit board assembly is set On the multi-layer circuit board body 1, a number of contact points 7 are provided on the circuit board body 2 in the contact point area, and a number of connection points 8 are provided on the multilayer circuit board assembly in the connection point area, and the contact points 7 are connected to the corresponding connection points. The points 8 are connected by connecting lines 9, and two adjacent rows of connecting points 8 are arranged obliquely.

[0030] In this embodiment, the connection point region multilayer circuit board includes a first connection point region multilayer circuit board body 3 , a second connection point region multilayer circuit board body 4 and a t...

Embodiment 3

[0033] Such as image 3 As shown, a multi-layer circuit wiring connection structure includes a multi-layer circuit board body 1, a contact point area circuit board body 2 and a connection point area multilayer circuit board assembly, and the connection point area multilayer circuit board assembly is set On the multi-layer circuit board body 1, a number of contact points 7 are provided on the circuit board body 2 in the contact point area, and a number of connection points 8 are provided on the multilayer circuit board assembly in the connection point area, and the contact points 7 are connected to the corresponding connection points. The points 8 are connected by connecting lines 9, and two adjacent rows of connecting points 8 are arranged in parallel.

[0034] It should be noted that the present invention is a multi-layer circuit wiring connection structure. According to actual needs, two adjacent rows of connection points 8 can be arranged in parallel, and the contact points...

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PUM

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Abstract

The invention discloses a multi-enclosure and multi-layer circuit wiring connection structure, which comprises a multi-enclosure and multi-layer circuit board body, a contact point area circuit board body and a connection point area multi-layer circuit board assembly. The connection point area multi-layer circuit board assembly is arranged on the multi-enclosure and multi-layer circuit board body; the contact point area circuit board body is provided with a plurality of contact points. The invention relates to a multi-enclosure and multi-layer circuit wiring connection structure, and belongs to the technical field of circuit wiring. The structure can simultaneously distribute circuits in multiple directions, and can change the large, small and complex problems into simple problems due to multiple points, thereby effectively improving the wiring quantity and wiring speed, improving the utilization rate and saving the space. The peripheral connecting points penetrate through all the layers and can be connected with the contact points on the contact point area circuit board body, the contact points and the connecting points can be connected with each other, and the positions, sizes, shapes and arrangement modes of the contact points and the connecting points can be set according to requirements.

Description

technical field [0001] The invention relates to the technical field of circuit wiring, in particular to a multi-layer circuit wiring connection structure. Background technique [0002] At present, my country's circuit board wiring structure device industry is developing rapidly, and there are various devices used for circuit board wiring structure, but it still faces challenges in many aspects, and needs to find solutions to meet customers. The existing circuit wiring structure is complicated, and the wiring operation steps are cumbersome, which is not convenient for practical use. Contents of the invention [0003] The main purpose of the present invention is to provide a multi-layer circuit wiring connection structure, which can effectively solve the problems in the background technology. [0004] In order to achieve the above object, the technical scheme that the present invention takes is: [0005] A multi-layer circuit wiring connection structure, comprising a multi...

Claims

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Application Information

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IPC IPC(8): H05K1/09H05K1/11
CPCH05K1/09H05K1/111H05K2201/0335
Inventor 张展
Owner 深圳市信望电子有限公司
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