Manufacturing method of package substrate

Abstract

A production method of a package substrate includes that expansive materials are embedded into a pre-opened area of the package substrate; cutting is performed on the pre-opened area to enable a heat source to be transmitted to the expansive materials at positions of cutting gaps and the expansive materials are expanded after being heated; and the expansive materials and materials which are arranged on the expansive materials are removed together to form an opening. The expansive materials are arranged on the pre-opened area, so that occupation of wiring space of the package substrate is avoided and the number of wiring is increased to improve electrical functions of products.

Description

technical field [0001] The invention relates to a method for manufacturing a packaging substrate, in particular to a method for manufacturing a packaging substrate with openings. Background technique [0002] With the vigorous development of the electronic industry, electronic products are gradually moving towards the trend of multi-function and high performance. Currently, semiconductor packaging structures have developed different packaging types. [0003] see Figure 1A and Figure 1B , which is the manufacturing method of the conventional packaging substrate 1 . Such as Figure 1A As shown, a circuit board 10 with a through hole 100 at the bottom is provided first, and a pre-opening area A is defined on the circuit board 10, and then cutting is performed along the edge of the pre-opening area A (cutting imaginary line L). [0004] Next, the thimble 11 is passed through the through hole 100 to remove the material in the pre-opening area A. As shown in FIG. [0005] Su...

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Problems solved by technology

[0006] However, in the existing manufacturing method of the packaging substrate 1, since the material in the pre-opening area A needs to be removed by the ejector pin 11, a through hole 100 communicating with the bottom of the opening 12 needs to be designed in the circuit board 10 for the ejector pin 11. As a result, the area B around the through hole 100 cannot be routed, resulting in the need for the circuit board 10 to reduce the number of wiring lines or to increase the wiring space, resulting in the reduction of the electrical function of the circuit board 10 or the inability to meet the miniaturization requirements.

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