SIP packaging structure based on embedded integrated pull-up and pull-down resistor IPD

A packaging structure and embedded technology, which is applied in the direction of printed circuits, circuits, printed circuits, etc. connected with non-printed electrical components, can solve the problems of miniaturization, light weight, and generalization of the SIP system.

Pending Publication Date: 2021-12-07
CHINA KEY SYST & INTEGRATED CIRCUIT
View PDF4 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a SIP packaging structure based on embedded integrated pull-up and pull-down resistor IPD, to solve the problem that it is more and more difficult to realize the miniaturization, light weight and generalization of the current SIP system

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • SIP packaging structure based on embedded integrated pull-up and pull-down resistor IPD
  • SIP packaging structure based on embedded integrated pull-up and pull-down resistor IPD
  • SIP packaging structure based on embedded integrated pull-up and pull-down resistor IPD

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] The present invention provides a packaging structure for a SIP based on the pull-down resistor embedded integrated IPD, which is a cross-sectional side view of a figure 1 , It includes a package substrate 100, chip 140 and the printed circuit board. The interior of the package substrate 100 is fitted with an embedded integrated pull-up and pull-down function pull-down resistor IPD 120, to complete a plurality of different levels; the chip is mounted on top of the package substrate 100; the printed circuit board 140 is mounted 100 in the package base substrate. The pull-down resistor on the integrated embedded IPD 120 may be implemented on the circuit chip pull port, pull-down bias, the port power supply terminal of the chip, interconnected to the end, may be different for specific design requirements, the connection can not be secured after Change.

[0024] like figure 2 Shows a cross-sectional side view of a multi-chip package, when manufacturing the package substrate 100 ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses an SIP packaging structure based on an embedded integrated pull-up and pull-down resistor IPD, and belongs to the field of packaging integration. The structure comprises a packaging substrate, a chip and a printed circuit board. An embedded integrated pull-up and pull-down resistor IPD is embedded in the packaging substrate to complete pull-up and pull-down functions of various different levels; the chip is mounted at the top of the packaging substrate; the printed circuit board is installed at the bottom of the packaging substrate. According to the embedded integrated pull-up and pull-down resistor IPD, pull-up and pull-down bias of a chip circuit port can be realized, the port of the chip is interconnected with a power supply end and a ground end, special design can be carried out according to different requirements, and the connection mode cannot be changed after being fixed. According to the SIP packaging structure based on the embedded integrated pull-up and pull-down resistor IPD, linear pressure can be reduced to a great extent, and the number of wiring layers is reduced; meanwhile, the size of the pull-up resistor and the pull-down resistor in the SIP is almost reduced, and the requirements for miniaturization, light weight and generalization of the SIP are well met.

Description

Technical field [0001] The present invention relates to a package integration technology, and particularly relates to a packaging structure for a SIP based on the pull-down resistor embedded integrated the IPD. Background technique [0002] As integrated circuit manufacturing technology to smaller process node development, and functional requirements of the system toward a more powerful development, design of the entire system on a single integrated circuit chip becomes more challenging, SiP is becoming an alternative. [0003] In order to meet the growing requirements of system functions, integrated into the SiP in the bare number of chips is also rising, the number of pull-down resistor matching is also increasing, to the SiP traces and miniaturization has brought more pressure . Inventive content [0004] Object of the present invention is to provide a pull-down resistor based SIP package IPD embedded integrated on to address the current SIP systems increasingly difficult to ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H01L25/16H01L23/498H01L23/64H05K1/18
CPCH01L25/16H01L23/49838H01L23/647H05K1/181H01L2224/16225H01L2924/15311H01L2224/18H01L2924/15192
Inventor 王金刚王璟瑞武亚恒
Owner CHINA KEY SYST & INTEGRATED CIRCUIT
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap