Patterning method, etching method, manufacturing method of display panel and display panel

Abstract

The invention discloses a patterning method, an etching method, a manufacturing method of a display panel and the display panel. The patterning method comprises: forming a reflection block in at leastone to-be-exposed area of a to-be-etched film layer; forming a photoresist layer on the to-be-etched film layer, wherein the photoresist layer covers the to-be-etched film layer and wraps the reflection block at the same time; and performing exposure processing on the photoresist layer, wherein the surface of the reflection block at least comprises two reflection areas with different light emitting directions, and the reflection areas are used for reflecting incident light in the same direction to the photoresist layer in different directions. In this way, the exposure precision can be improved.

Description

technical field [0001] The present application relates to the field of display technology, in particular to patterning, etching, a method for manufacturing a display panel and a display panel. Background technique [0002] Etching (Etch) is a technology that removes materials by means of chemical reaction or physical impact, and is often used in semiconductor manufacturing processes. Generally, the pattern is transferred to the dielectric layer through exposure, plate making and development, and then the part to be removed is etched by chemical solution or ion impact. see figure 1 , figure 1 It is a schematic diagram of the graphic method in the existing method. With the development of micro-manufacturing technology, the graphic structure to be produced is more precise, and the graphic gap in the dense area is getting smaller and smaller, and the problems of poor exposure and poor development often occur. Causes exposure edge roughness, film residue, etc. With the contin...

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Problems solved by technology

see figure 1 , figure 1 It is a schematic diagram of the graphic method in the existing method. With the development of micro-manufacturing technology, the graphic structure to be produced is more precise, and the graphic gap in the dense area is getting smaller and smaller, and the problems of poor exposure and poor development often occur. Rough exposure edges, film residue, etc.

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