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Preparation method of adhesive for compounding mirror surface substrate

An adhesive and substrate technology, applied in the direction of adhesive types, polyurea/polyurethane adhesives, polymer adhesive additives, etc. The surface cannot be smoothed, which affects the laser effect of the card, and achieves the effect of good initial adhesion at room temperature, easy to flatten, and smooth surface.

Inactive Publication Date: 2020-05-08
JIANGSU HUAXIN NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] At present, the adhesives used for laminating mirror substrates have better initial adhesion at room temperature, but the peel strength cannot reach the standard after hot pressing; if the peel strength is better after hot pressing, the laser surface of the mirror substrate cannot be as smooth as the mirror surface, which affects the finished product. The laser laser effect of the card is difficult to achieve the expected goal of personalized smart cards

Method used

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  • Preparation method of adhesive for compounding mirror surface substrate

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preparation example Construction

[0048] A preparation method of an adhesive for mirror substrate composite, comprising the steps of:

[0049] (1) Prepare the polyurethane prepolymer of modified end-NCO

[0050]Dry polytetramethylene ether glycol in vacuum at 80-90°C for 1-2 hours, cool down to 50-60°C, add dicyclohexylmethane diisocyanate to form a raw material mixture, in which dicyclohexylmethane diisocyanate and poly The mass ratio of tetramethylene ether glycol is 1:(1.5~2.0), and then the temperature is gradually raised to 80~85°C, after 1.5~2 hours of reaction, the temperature is lowered to 40~50°C, and organic bismuth catalyst, hydrophilic expansion chain agent, cross-linking agent and epoxy resin, gradually heat up to 60-65°C, then add acetone accounting for 20%-30% of the mass of the raw material mixture, react for 3-4 hours, cool down to 40-50°C, add methyl ethyl ketone oxime, Keeping the reaction at this temperature for 0.5-1 hour, raising the temperature to 65-70°C and continuing the reaction for...

Embodiment 1

[0066] Add 120 g of polytetramethylene ether glycol into a 500 ml four-neck flask, place it in a vacuum drying oven at 90° C. for 1 hour, and then cool it down to 50° C. and remove it from the drying oven. Under the protection of dry nitrogen, 80g of dicyclohexylmethane diisocyanate was added to the above-mentioned four-necked flask to form a raw material mixture, and then the temperature was gradually raised to 80°C. After 1.5 hours of reaction, the temperature was lowered to 40°C, and 0.4g of bismuth-zinc composite catalyst was added. , Hydrophilic chain extender dimethylol butyric acid 8.0g, crosslinking agent 1,4-butanediol 4.0g, trimethylolpropane 1.6g, epoxy resin 6.0g, gradually increase the temperature to 60°C, and then add 50.0g of acetone, continued to react for 3 hours. Cool down to 40°C, add 12.0g of methyl ethyl ketone oxime, keep the reaction at this temperature for 0.5 hours, raise the temperature to 65°C and continue the reaction for 1.5 hours, then cool down t...

Embodiment 2

[0075] Add 160 g of polytetramethylene ether glycol into a 500 ml four-necked flask, place it in a vacuum drying oven at 80° C. for 2 hours, and then cool it down to 60° C. and remove it from the drying oven. Under the protection of dry nitrogen, 80g of dicyclohexylmethane diisocyanate was added to the above-mentioned four-necked flask to form a raw material mixture, and then the temperature was gradually raised to 85°C. After 2.0 hours of reaction, the temperature was lowered to 50°C, and 0.96g of bismuth-zinc composite catalyst was added. , Hydrophilic chain extender dimethylol butyric acid 12.0g, crosslinking agent 1,4-butanediol 9.6g, trimethylolpropane 2.4g, epoxy resin 12.0g, gradually increase the temperature to 65°C, and then add 72.0g of acetone, continued to react for 4 hours. Cool down to 50°C, add 19.2g of methyl ethyl ketoxime, keep the reaction at this temperature for 1.0 hours, raise the temperature to 70°C and continue the reaction for 2.5 hours, then cool down...

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Abstract

The invention provides a preparation method of an adhesive for compounding a mirror surface substrate. The preparation method comprises the following steps: carrying out polymerization reaction on dicyclohexylmethane diisocyanate and polytetramethylene ether glycol; adding a proper amount of epoxy resin into the reaction system for block modification; employing methyl ethyl ketoxime as a sealing agent to seal terminal-NCO, and preparing a modified polyurethane prepolymer with a hydrophilic chain extender; adding triethylamine to neutralize the reaction product, adding water to emulsify the reaction product, then carrying out chain extension again by using hydrazine hydrate, and finally carrying out defoaming, thickening, leveling, anti-sticking and the like treatment, so as to obtain the adhesive for compounding the mirror surface substrate. The adhesive obtained by the method has good initial adhesion when a mirror surface substrate is compounded at normal temperature, so that the mirror surface substrate is good in laser effect and high in peel strength after hot pressing and clamping.

Description

technical field [0001] The invention belongs to the technical field of adhesives, and in particular relates to a method for preparing an adhesive for compounding mirror substrates. Background technique [0002] The development of science and technology and social economy makes the information technology industry prosper rapidly, and also brings new opportunities and platforms for the smart card industry, and its application fields are becoming more and more extensive. At present, it has been developed and applied on a large scale in security documents, transportation, finance, communications, social security, medical health, education, e-government, etc., which has greatly improved the convenience of people's work and life. With the continuous development of the smart card industry, card technology has been improved, not only the content of information has increased, but also the appearance has undergone tremendous changes. Personalized cards with special appearance are favo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/08C09J11/04C09J11/06C09J11/08C08G18/12C08G18/66C08G18/48C08G18/34C08G18/32C08G18/75C08G18/30C08G18/58
CPCC08G18/12C08G18/286C08G18/3206C08G18/348C08G18/4854C08G18/58C08G18/6674C08G18/6677C08G18/6685C08G18/6692C08G18/758C08L2205/035C09J11/04C09J11/06C09J11/08C09J175/08C08L71/02C08L1/284C08L1/286C08L83/12C08K3/36C08K5/132C08G18/3231
Inventor 周建石张道远何培武王光战王院荣
Owner JIANGSU HUAXIN NEW MATERIAL
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