Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

High-temperature-resistant mica plate adhesive and preparation method thereof

A mica board and adhesive technology, applied in the directions of non-polymer adhesive additives, adhesives, adhesive additives, etc., can solve the problems of unsatisfactory heat resistance, and achieve excellent electrical insulation performance, good insulation performance, resistance to high temperature effect

Inactive Publication Date: 2020-04-21
湖北新四海化工股份有限公司
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

But its heat resistance is not ideal enough

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] Embodiment 1. A high-temperature-resistant mica board adhesive, including component A and component B, wherein component A consists of the following raw materials in parts by weight: 5-60 parts of silicone resin, 1-10 parts of dispersion liquid, coupling 0.1-5 parts of the agent, 20-70 parts of the organic solvent; the following components by weight of component B: 40-90 parts of the organic solvent, 10-60 parts of the curing agent.

Embodiment 2

[0026] Embodiment 2, a kind of heat-resistant mica plate adhesive, comprises A component and B component, wherein the raw material composition of A component is the following parts by weight: 30-40 parts of ladder-type structure silicone resin, 5-40 parts of MQ silicone resin 19 parts, 1-5 parts of nano-silica dispersion liquid, 0.1-2 parts of coupling agent and 40-60 parts of organic solvent; the raw material composition of the following parts by weight of component B: 20-50 parts of curing agent and 50-50 parts of organic solvent 80 servings.

Embodiment 3

[0027] Embodiment 3, a kind of preparation method of heat-resistant mica plate adhesive, step (1): 30-40 parts of ladder-type structure silicone resin, 5-19 parts of MQ silicone resin, nano-silica dispersion liquid 1- Add 5 parts, 0.1-2 parts of coupling agent and 40-60 parts of organic solvent into the reaction vessel, raise the temperature to 80-120 degrees, and reflux for 2-6 hours to obtain component A;

[0028] Step (2): Add 20-50 parts of curing agent and 50-80 parts of organic solvent into the reaction container, mix well, and obtain component B;

[0029] Step (3): Mix components A and B in a ratio of 100:1-3 to obtain a high temperature resistant mica board adhesive.

[0030] In the present invention, wherein the structure of ladder structure silicone resin is: (R 1 SiO 1.5 ) m (R 2 SiO 1.5 ) n ;

[0031] In the formula, m and n are the degree of polymerization, R 1 and R 2 For the same or different H, C 1 -C 4 An alkyl group or an alkoxy group thereof is pr...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Particle sizeaaaaaaaaaa
Shear strengthaaaaaaaaaa
Login to View More

Abstract

The invention discloses a high-temperature-resistant mica plate adhesive which comprises a component A and a component B. The component A is prepared from the following raw materials in parts by weight: 30-40 parts of organic silicon resin with a trapezoidal structure, 5-19 parts of MQ silicon resin, 1-5 parts of a nano silicon dioxide dispersion liquid, 0.1-2 parts of a coupling agent and 40-60 parts of an organic solvent. The component B is prepared from the following raw materials in parts by weight: 20-50 parts of a curing agent and 50-80 parts of an organic solvent. Organic silicon resinis used as matrix resin of the mica plate adhesive, so that compared with epoxy matrix resin used in the prior art, the mica plate adhesive has the advantage that the temperature resistance is higher.The carbon content in the resin structure is low, the smoking phenomenon cannot occur under the high-temperature condition, the insulating property is good, and the strength is high.

Description

technical field [0001] The invention relates to the technical field of composite materials, in particular to a high-temperature-resistant mica board adhesive and a preparation method thereof. Background technique [0002] The high temperature resistant mica board is made by bonding mica paper with glue, heating and pressing. The mica content is about 90%, and the organic silica gel water content is 10%. The high temperature resistant mica board material is mainly used in electric irons, hair dryers, toasters, coffee pots, microwave ovens, electric heaters and other household appliances, as well as industrial frequency furnaces, intermediate frequency furnaces, electric arc furnaces, steelmaking furnaces, mines, etc. Heat furnace, ferroalloy furnace, electrolytic aluminum electrolytic cell, injection molding machine motor insulation, etc. This requires that the mica board material has excellent heat resistance and can work normally at high temperature for a long time. Theref...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C09J183/04C09J183/05C09J183/06C09J11/04
CPCC08K2201/011C08L2201/08C08L2205/025C09J11/04C09J183/04C08L83/04C08K3/36
Inventor 龚家全邵玲陈华玲姚虎杨帆杨开柱
Owner 湖北新四海化工股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com