High-precision and high-reliability composite film electrode thermosensitive chip

Abstract

The invention relates to a high-precision and high-reliability composite film electrode thermosensitive chip. The thermosensitive chip comprises a thermosensitive ceramic substrate and two composite film electrodes which are respectively arranged on two surfaces of the thermosensitive ceramic substrate, and each composite film electrode is formed by sequentially laminating a stainless steel layer,a copper layer and a gold layer on the surface of the thermosensitive ceramic substrate from inside to outside. The invention also relates to a preparation method of the thermosensitive chip. The thermosensitive chip has the advantages of being good in stability, high in reliability, not prone to aging, resistant to cold and hot impact and the like.

Description

technical field [0001] The invention relates to the technical field of thermistors, in particular to a high-precision and high-reliability composite film electrode thermal chip. Background technique [0002] Thermistor chips, referred to as thermal chips, are widely used in various temperature detection, temperature compensation, and temperature control circuits. They play a central role in converting temperature variables into required electronic signals in the circuit. [0003] like figure 1 As shown, the existing thermosensitive chip includes a thermosensitive ceramic substrate 1' and two metal electrodes 2' respectively arranged on the two surfaces of the thermosensitive ceramic substrate 1', and the metal electrodes 2' are usually silver electrode. The existing heat-sensitive chip preparation process is: heat-sensitive ceramic powder batching→ball milling→isostatic pressing molding→sintering ceramic ingots→slicing→printing silver paste by screen printing→drying→sinter...

AI Technical Summary

Problems solved by technology

[0005] 1) The silver paste is easily polluted during the screen printing and drying process, and the obtained silver electrode itself is also easily oxidized, yellowed and blackened, resulting in poor stability and reliability of the product;

[0006] 2) The process of preparing silver paste in the early stage and drying the silver paste and sintering the silver electrode in the later stage is relatively cumbersome;

[0007] 3) The thickness of the printed silver electrode layer is relatively large and the surface of the heat-sensitive ceramic substrate is unevenly covered, and it is easy to peel and generate burrs during the scribing process, and the loss of silver paste material is large;

[0008] 4) The silver layer will recrystallize during high-temperature sintering, and the crystal form will change, resulting in a change in performance, resulting in a decline in the electrical performance of the product;

[0009] 5) The gas emitted during the high-temperature silver burning process pollutes the environment

Images