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PTFE substrate material for high-frequency copper-clad plate and preparation method of PTFE substrate material

A technology of PTFE and copper clad laminates, which is applied in the field of material science and engineering, can solve the problems of high water absorption, neglect of the importance of thermal expansion coefficient, high dielectric loss, etc., and achieve low water absorption, good industrialization foundation and application prospects, low dielectric The effect of electrical loss

Inactive Publication Date: 2020-01-31
ZHEJIANG UNIV
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  • Application Information

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Problems solved by technology

In the current BMT / PTFE (ε r =6.7, tanδ=0.003), BNT / PTFE (ε r =10.56, tanδ=0.004) and TeO 2 / PTFE(ε r =5.4, tanδ=0.006) system, higher dielectric loss (≧0.003) is its obvious disadvantage, recently published LMT / PTFE (ε r =6.17, tanδ=0.0019,τ ε =123ppm / ℃) and NLNT / PTFE (ε r = 10.4, tanδ = 0.0026, τ ε =-0.9ppm / ℃) research, the substrate material has excellent dielectric properties, but its water absorption rate (>0.1%) is relatively large, and the importance of thermal expansion coefficient is ignored

Method used

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  • PTFE substrate material for high-frequency copper-clad plate and preparation method of PTFE substrate material
  • PTFE substrate material for high-frequency copper-clad plate and preparation method of PTFE substrate material

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Embodiment Construction

[0027] The present invention will be further described in detail with reference to the following examples, but these examples are not intended to limit the scope of the present invention.

[0028] In the present invention, the method for preparing a substrate material for a high-frequency copper-clad laminate comprises the following steps:

[0029] (1) According to the molar ratio of 3: a: (1-a): 2, take the powdered raw material BaCO 3 , CoO, ZnO and Nb 2 o 5 , wherein 0.2≤a≤0.7; ball milled for 24 hours and then sintered at 1200°C for 4 hours; further ground to a particle size of 0.2-1 μm to obtain a ceramic filler;

[0030] (2) According to the mass ratio of 50:1, take ceramic filler and coupling agent; disperse ceramic filler in ethanol, control the mass ratio of ethanol and ceramic filler to 6:1; add coupling agent, stir at 60°C for 4h, After drying at 120°C, the ceramic filler modified by the coupling agent is obtained; the coupling agent is any one of the following: ...

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Abstract

The invention relates to the field of material science and engineering, and aims to provide a PTFE substrate material for a high-frequency copper-clad plate and a preparation method of the PTFE substrate material. The substrate material comprises polytetrafluoroethylene with a volume ratio of (100-x)% and modified ceramic powder with a volume ratio of x%, wherein x is greater than or equal to 20 and less than or equal to 60. The chemical formula of the modified ceramic powder is aBa (Co1 / 3Nb2 / 3) O3-(1-a) Ba (Zn1 / 3Nb2 / 3) O3, wherein 0.2 < = a < = 0.7. The substrate material provided by the invention has the advantages of high dielectric constant, low dielectric loss, proper dielectric constant temperature coefficient and resonant frequency temperature coefficient; meanwhile, the thermal expansion coefficient is low, the water absorption rate is low, and the heat conductivity is proper. The preparation method disclosed by the invention is simple to operate, does not need special equipment and complicated experimental processes, is high in universality, and has a very good industrial basis and a very good application prospect.

Description

technical field [0001] The invention relates to a polytetrafluoroethylene substrate material applied to a high-frequency copper-clad laminate and a preparation method thereof, belonging to the field of material science and engineering. Background technique [0002] In recent years, with the continuous development of 5G communication technology, satellite communication, radar system, automobile anti-collision system, electronic navigation and high integrated circuit technology, electronic products continue to develop in the direction of high-frequency and high-speed signal transmission. Printed circuit board (PCB) is an important part of electronic equipment and plays a huge role in mounting, fixing components, circuit connection, signal transmission and heat conduction. In order to ensure high-frequency and high-speed data transmission, the development of high-performance circuit substrates is crucial. At present, polymer-based composite substrate materials have increasingl...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L27/18C08K9/06C08K3/22C04B26/08H05K1/03
CPCC04B26/08C04B2111/00844C04B2201/50C08K3/22C08K9/06H05K1/0306H05K1/0373C08L27/18C04B18/023
Inventor 张启龙王浩杨辉周富明
Owner ZHEJIANG UNIV
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