Method for preparing metal and ceramic composite workpiece

Abstract

The invention relates to a method for preparing a metal and ceramic composite workpiece. The method comprises the following steps that S1, metal or ceramic is machined into a specific shape to serve as an insert; S2, the insert is pretreated; S3, ceramic powder or metal powder and a binder are mixed to form ceramic feed or metal feed; S4, the metal serves as the insert, the ceramic feed is injected into a mold cavity, and a composite material green body is obtained; or the ceramic serves as the insert, the metal feed is injected into the mold cavity, and a composite material green body is obtained; S5, the composite material green body is subjected to solvent degreasing in a solvent, and a degreased blank is obtained; and S6, the degreased blank is sintered in a reducing atmosphere under the temperature of 1250-1400 DEG C for 2-5h, and finally the metal and ceramic composite workpiece is obtained. According to the method, pressure does not need to be applied from the outside, the composite material green body is prepared through metal injection molding, the wettability between the metal and the ceramic is utilized, the combination of the metal and the ceramic is achieved, the requirement for sintering equipment is not high, and batch production can be achieved.

Description

technical field [0001] The invention relates to a method for preparing metal and ceramic composite workpieces. Background technique [0002] With the development of the electronics industry, the application of metal-ceramic composite materials in electric vacuum technology, semiconductor and integrated circuit industries continues to expand. At present, there are two widely used technologies. One is to coat a layer between metal and ceramics. Solder, and then apply pressure and sinter to achieve the combination of ceramic and metal, so that it has a certain mechanical strength, air tightness and heat resistance. However, due to the need to apply pressure during the sintering process, this technology has high requirements for equipment, low production efficiency, and high production costs, so it cannot be applied on a large scale. The second is mechanical connection. This process requires the design of some riveting structures on the metal and ceramic substrates. It is diffi...

AI Technical Summary

Problems solved by technology

However, due to the need to apply pressure during the sintering process, this technology has high requirements for equipment, and the production efficiency is low and the production cost is high, so it cannot be applied on a large scale

The second is mechanical connection. This process needs to design some riveting structures on the metal and ceramic substrates. The forming is difficult, and the riveting position is prone to stress, which is difficult to meet the long-term use requirements.