Cleaning method for effectively removing particle agglomeration on front and back sides of wafer

Abstract

The invention relates to a semiconductor cleaning technology, in particular to a cleaning method for effectively removing particle agglomeration on the front and back sides of a wafer. The cleaning method comprises the following steps: brushing the front and back sides of the wafer with a sponge brush respectively for 1min-5min at a distance of 5cm-20cm from a pure water outlet at the flow rate of0.1 ml / min-0.8 ml / min; acetone exceeds the wafer and is put into the ultrasonic instrument for ultrasonic cleaning for 1min-8min; pouring out acetone, adding pure water and pouring it out after exceeding the wafer; repeating the step of "adding pure water and pouring it out after exceeding the wafer" for 3 times; pure water exceeds the wafer and the wafer to be put into an ultrasonic instrument for ultrasonic cleaning for 1min-8min; and the wafer is put into a spin dryer for spin drying. A single-chip fluid scouring cleaning method is adopted to quickly and effectively remove particle agglomeration on the front and back sides of the SiC wafer so as to improve the cleaning efficiency and the cleaning quality of the SiC wafer.

Description

technical field [0001] The invention relates to semiconductor cleaning technology, in particular to a cleaning method for effectively removing particle agglomeration on the front and back surfaces of a wafer. Background technique [0002] With the continuous development of the third-generation semiconductor manufacturing process, SiC wafer cleaning technology is gradually improving. During the process of grinding, polishing, epitaxy, etc., wafers are inevitably affected by the environment, personnel, equipment, tools, etc. to introduce pollutants. Among them, pollutants can be roughly classified into particles, organic matter, metal pollutants, and oxide layers. [0003] In the manufacturing process of semiconductor wafers, especially before and after the epitaxial growth process, if there are pollutants remaining on the wafer surface, it will directly cause the failure of the epitaxial wafer or the failure of the device processing. Therefore, before the wafer is epitaxy, i...

AI Technical Summary

Problems solved by technology

Most of the agglomerated particles are due to the van der Waals force, which has a strong force. The traditional RCA cleaning method and the dilution chemical method need to use a large amount of chemical agents for long-term soaking. , and the agglomerated particles on the front and back of the wafer after cleaning are usually difficult to be effectively removed

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