Sticky controllable adhesive tape and application method thereof

Abstract

The invention provides sticky controllable adhesive tape and an application method thereof. The sticky controllable adhesive tape at least comprises a base film and an adhesive layer, wherein the surface of the base film at least comprises the adhesive layer, the adhesive layer initially has no adhesive force at room temperature, when the temperature is raised to 70-95 DEG C, the adhesive layer produces a matching adhesive force, and when the temperature is adjusted to a specific temperature in a temperature range other than 70-95 DEG C, the adhesive force is reduced. The adhesive layer initially does not need to cover a release film at room temperature. When heated to 70-90 DEG C, the adhesive layer produces the matching adhesive force, so that the processing accuracy of ceramic lamination and cutting process is ensured. The lamination is completed and cooled to the room temperature, the adhesive tape still has sufficient adhesive force for ceramic lamination, so as to ensure that multi-layer ceramic lamination and the adhesive tape cannot be subjected to displacement and detachment in the process of transfer and transportation, after cutting is completed, heating is carried out to a specific temperature, the adhesive force between the adhesive tape and ceramic pieces is greatly reduced, and the ceramic pieces can be easily picked up from the adhesive tape. The temperature sensitive adhesive is very suitable for lamination and cutting of ceramic capacitors.

Description

technical field [0001] The invention relates to the field of adhesives, in particular to an adhesive tape with controllable viscosity and an application method thereof. Background technique [0002] MLCC (chip multilayer ceramic capacitors, as well as inductors, resistors, filters, etc.) industry casts ceramic slurry on the release film to form a thin layer of ceramic film, cuts the film into small pieces, and then prints the circuit , and then stack these ceramic films layer by layer, and then cut them into small pieces. In the lamination process, in order to ensure that the ceramic films can be firmly bonded, each layer needs to be laminated with a lot of pressure when superimposed, and it needs Apply on a heated platform to soften the ceramic film. When superimposing each layer of ceramic capacitors, it is necessary to ensure that the overlapping alignment of each piece is accurate, so there must be an adhesive tape on the heating platform to fix the ceramic film. At pre...

AI Technical Summary

Problems solved by technology

After the cutting is completed, the fixing tape needs to be removed. Ordinary high-viscosity tape can ensure that it will not shift during cutting, but it is difficult to remove when removing. At present, many manufacturers use thermal debonding tape-high viscosity at room temperature, After heating to a specific temperature, the expansion particles contained in the tape will expand, reducing the bonding area between the adhesive and the object to be pasted, so that the viscosity will be reduced rapidly, thereby achieving the effect of easy removal. Reasons: ① High viscosity at room temperature, so it is necessary to protect the rubber surface with a release film, which is inconvenient for the robot to operate, because it needs to increase the action of removing the release film; ② The adhesive layer is too soft, and the pressure during lamination Very large, it will cause glue overflow

If the above-mentioned low-temperature debonding type is used, because the lamination and cutting processes are different, the requirements for the adhesive change of the tape are also different: ①The peeling force of the tape at high temperature is lower during lamination, and the removal is due to the sheet shifting. In addition, the requirements for the reduction of the peeling force after low temperature detackification are not very high, but cutting is different. During cutting, the friction force of the blade on the small ceramic block is very large, and the process (at high temperature) requires higher peeling force. After cutting, Because the volume of the finished product after cutting is very small, the requirements for the reduction of the peeling force are very high. Because the peeling force is slightly larger, it is difficult to pick up small ceramic pieces (the volume is too small, a few millimeters or a few tenths of a millimeter); ②Low temperature debonding type It is difficult to reduce the peeling force of the tape to a very low level, so it is not suitable to use low-temperature debonding type during the cutting process, and it often fails to pick up

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