Thermosetting hydrocarbon polymer composition, and prepreg and thermosetting copper-clad plate prepared therefrom

Abstract

The invention belongs to the field of communication materials, and particularly relates to a thermosetting hydrocarbon polymer composition, and a prepreg and a thermosetting copper-clad plate preparedtherefrom. The preparation method comprises the following steps: preparing a polyarylether-polyolefin block copolymer; preparing a thermosetting hydrocarbon polymer composition with adjustable dielectric property, flame retardant property and the like; impregnating the homogeneous dispersion of the composition with a fiber cloth; impregnating the fiber cloth in the uniform dispersant of the composition, and baking the fiber cloth to obtain the prepreg with homogeneous glue distribution, strong resin adhesive force, smooth surface and proper toughness and viscosity; and finally, preparing thethermosetting copper-clad plate by using the prepreg, the film and the copper foil. The thermosetting hydrocarbon polymer composition has excellent dielectric property, high mechanical strength, highglass-transition temperature and heat resistance, low thermal expansion coefficient, high copper foil peel strength, good performance uniformity and obvious cost advantage, and is suitable for manufacturing a multi-layer copper-clad plate. Therefore, the method has a good industrial production basis and a wide application prospect.

Description

technical field [0001] The invention belongs to the technical field of communication materials, and in particular relates to a thermosetting hydrocarbon polymer composition and a prepreg and a thermosetting copper clad laminate prepared therefrom. Background technique [0002] Copper clad laminates are widely used in mobile phones, computers, wearable devices, communication base stations, satellites, unmanned vehicles, drones and intelligent robots, and are one of the key materials in the electronic communication and information industries. Traditional thermosetting resins represented by epoxy resin, phenolic resin and cyanate resin have high thermo-mechanical properties, low thermal expansion coefficient, high quality and low price, convenient processing and strong versatility. They are commonly used in the production of copper clad laminate substrates. Material. After continuously exploring and optimizing the formula and process parameters, researchers have prepared vario...

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Problems solved by technology

However, in addition to polystyrene, polyarylethers generally have poor compatibility with other resins, resulting in serious phase separation of the resin in the composite prepreg matrix, and the bonding between the matrix resin and fillers and fiber cloth and other reinforcing materials. The strength is not good, the thermal-mechanical performance stability of the copper-clad laminate prepared by this is average, the dielectric properties of different parts and the uniformity of the thermal expansion coefficient are poor, it is not suitable for making multi-layer copper-clad laminates, and it is difficult to meet the current high frequency, In the field of high-speed communication, there are various requirements for functional diversification and complexity of CCL materials, high-density circuit layout, etc.

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