Thermosetting hydrocarbon polymer composition, and prepreg and thermosetting copper-clad plate prepared therefrom

A hydrocarbon polymer and prepreg technology, applied in the field of communication materials, can solve the problems of poor uniformity of thermal expansion coefficient of dielectric properties, poor compatibility, difficulty in satisfying functional diversification and complexity, etc.

Active Publication Date: 2019-12-24
CHANGZHOU ZHONGYING SCI & TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in addition to polystyrene, polyarylethers generally have poor compatibility with other resins, resulting in serious phase separation of the resin in the composite prepreg matrix, and the bonding between the matrix resin and fillers and fiber cloth and other reinforcing materials. The strength is not good, the thermal-mechanical performance stability of the copper-clad laminate prepared by this is average, the dielectric properties of different parts and the uniformity of the thermal expansion coefficient are poor, it is not suitable for making multi-layer copper-clad laminates, and it is difficult to meet the current high frequency, In the field of high-speed communication, there are various requirements for functional diversification and complexity of CCL materials, high-density circuit layout, etc.

Method used

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  • Thermosetting hydrocarbon polymer composition, and prepreg and thermosetting copper-clad plate prepared therefrom
  • Thermosetting hydrocarbon polymer composition, and prepreg and thermosetting copper-clad plate prepared therefrom
  • Thermosetting hydrocarbon polymer composition, and prepreg and thermosetting copper-clad plate prepared therefrom

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0047] Dissolve 16 parts of hydroxyl-terminated polyphenylene ether resin (Sabic SA90) and 4 parts of hydrogenated hydroxyl-terminated polyolefin resin (Krasol HLBH-P2000) in 100 parts of methyl ethyl ketone, then add 2.7 parts of 3-bromopropene and 2.5 parts Potassium tert-butoxide was stirred for 2 h under condensing reflux; then 0.03 initiator dibenzoyl peroxide (Qinfeng Chemical Industry) was added, and stirring was continued for 5 h under condensing reflux to obtain a reactive resin A solution; then, to Continue to add 65 parts of vinyl-terminated polyphenylene ether (Sabic SA9000), 35 parts of polybutadiene (Kray Willy Ricon130), 8 parts of polybutadiene-maleic anhydride copolymer ( Crayville Ricon130MA8), 12 parts polystyrene-maleic anhydride copolymer (Crayville SMA1000), 22 parts TiO 2 (Tianjin Zhongzheng Huamei Technology), 50 parts of flame retardant magnesium hydroxide (USA Yabao MAGNIFIN H-5), 20 parts of sub-flame retardant decabromodiphenylethane (Shandong Haiwa...

Embodiment 2

[0049] Dissolve 13 parts of hydroxyl-terminated polyphenylene ether resin (Sabic SA90), 4 parts of hydrogenated hydroxyl-terminated polyolefin resin (KrasolHLBH-P2000) and 3 parts of monohydroxy polyphenylene ether resin (Mn=13000) in 50 parts of methyl ethyl ketone And in the mixed solvent of 50 parts of DMF, add 2.3 parts of 3-bromopropene and 2.14 parts of potassium tert-butoxide again, at 80 o Stir at C for 2 hours; then add 0.03 initiator dibenzoyl peroxide (Qinfeng Chemical Industry), and continue stirring at 80°C for 5 hours to obtain a reactive resin A solution; then, continue to add 35 Parts of vinyl-terminated polyphenylene ether (Sabic SA9000), 30 parts of vinyl-terminated polyphenylene ether (OPE-2St, Mn=1200), 41 parts of polybutadiene (Craigville Ricon130), 8 parts Polybutadiene-maleic anhydride copolymer (Cray Willy Ricon130MA8), 6 parts polystyrene-maleic anhydride copolymer (Cray Willy SMA1000), 22 parts TiO 2 (Tianjin Zhongzheng Huamei Technology), 50 parts ...

Embodiment 3

[0051] Dissolve 16 parts of hydroxyl-terminated polyphenylene ether resin (Sabic SA90) and 4 parts of hydrogenated hydroxyl-terminated polyolefin resin (Krasol HLBH-P2000) in 100 parts of methyl ethyl ketone, then add 2.7 parts of 3-bromopropene and 2.5 parts Potassium tert-butoxide was stirred for 2 h under condensing reflux; then 0.03 initiator dibenzoyl peroxide (Qinfeng Chemical Industry) was added, and stirring was continued for 5 h under condensing reflux to obtain a reactive resin A solution; then, to Continue to add 60 parts of vinyl-terminated polyphenylene ether (Sabic SA9000), 30 parts of polybutadiene (Kray Willy Ricon130), 2.5 parts of polydiene-styrene-divinylbenzene to the reactive resin A solution Terpolymer (Crayville Ricon257), 4 parts polybutadiene-maleic anhydride copolymer (Crayville Ricon130MA8), 6 parts polystyrene-maleic anhydride copolymer (Crayville SMA1000) , 35 parts of PTFE pre-sintered material (Shandong Dongyue), 8 parts of SiO 2(Xinyi Hongrun),...

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Abstract

The invention belongs to the field of communication materials, and particularly relates to a thermosetting hydrocarbon polymer composition, and a prepreg and a thermosetting copper-clad plate preparedtherefrom. The preparation method comprises the following steps: preparing a polyarylether-polyolefin block copolymer; preparing a thermosetting hydrocarbon polymer composition with adjustable dielectric property, flame retardant property and the like; impregnating the homogeneous dispersion of the composition with a fiber cloth; impregnating the fiber cloth in the uniform dispersant of the composition, and baking the fiber cloth to obtain the prepreg with homogeneous glue distribution, strong resin adhesive force, smooth surface and proper toughness and viscosity; and finally, preparing thethermosetting copper-clad plate by using the prepreg, the film and the copper foil. The thermosetting hydrocarbon polymer composition has excellent dielectric property, high mechanical strength, highglass-transition temperature and heat resistance, low thermal expansion coefficient, high copper foil peel strength, good performance uniformity and obvious cost advantage, and is suitable for manufacturing a multi-layer copper-clad plate. Therefore, the method has a good industrial production basis and a wide application prospect.

Description

technical field [0001] The invention belongs to the technical field of communication materials, and in particular relates to a thermosetting hydrocarbon polymer composition and a prepreg and a thermosetting copper clad laminate prepared therefrom. Background technique [0002] Copper clad laminates are widely used in mobile phones, computers, wearable devices, communication base stations, satellites, unmanned vehicles, drones and intelligent robots, and are one of the key materials in the electronic communication and information industries. Traditional thermosetting resins represented by epoxy resin, phenolic resin and cyanate resin have high thermo-mechanical properties, low thermal expansion coefficient, high quality and low price, convenient processing and strong versatility. They are commonly used in the production of copper clad laminate substrates. Material. After continuously exploring and optimizing the formula and process parameters, researchers have prepared vario...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08B32B15/085B32B27/28B32B27/04B32B37/06B32B37/10C08L71/12C08L87/00C08L47/00C08L35/06C08L27/18
CPCB32B15/08B32B15/085B32B27/285B32B37/06B32B37/10B32B2260/021B32B2260/046B32B2307/204B32B2307/306B32B2457/08C08L47/00C08L71/126C08L2201/08C08L2203/20C08L2205/025C08L2205/035C08L87/005C08L35/06C08L27/18
Inventor 俞卫忠俞丞顾书春冯凯
Owner CHANGZHOU ZHONGYING SCI & TECH CO LTD
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