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Low-density dual-phase high-entropy alloy material and preparing method thereof

A high-entropy alloy and low-density technology, applied in the field of new metal materials, can solve problems such as limiting practicability, achieve the effects of improving density and mechanics, good promotion and application prospects, and process stability

Active Publication Date: 2019-12-06
SOUTH CHINA UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the form of compression failure is basically brittle fracture, which greatly limits its practicability

Method used

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  • Low-density dual-phase high-entropy alloy material and preparing method thereof
  • Low-density dual-phase high-entropy alloy material and preparing method thereof
  • Low-density dual-phase high-entropy alloy material and preparing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] Step 1: Composition Design of High Entropy Alloy

[0040] AlTiCrNiCu high-entropy alloy was designed with a theoretical density of 6.44g / cm 3 , according to the molar atomic ratio of the main elements in the high-entropy alloy AlTiCrNiCu 1:1:1:1:1, the mass of each component is calculated as Al powder 43.33g, Ti powder 76.87g, Cr powder 83.50g, Ni powder 94.25 g. Cu powder 102.05g, weigh the corresponding mass with an electronic balance, put the powder into a container, and pass through the argon gas protection, and then mix the powder on a V-type mixer for 48h until uniform.

[0041] Step 2: Preparation of high-entropy alloy AlTiCrNiCu powder by mechanical alloying

[0042]Put the uniformly mixed powder in step 1 into a stainless steel ball mill tank, vacuumize and fill it with argon as a protective atmosphere, and carry out mechanical alloying on a planetary ball mill with a ball-to-material ratio of 10:1 and a rotational speed of 200r / min. The ball milling process ...

Embodiment 2

[0048] Step 1: Composition Design of High Entropy Alloy

[0049] Al designed 2 Ti 2 CrNiCu high-entropy alloy with a theoretical density of 5.63 / cm 3 , according to the high-entropy alloy Al 2 Ti 2 The molar atomic ratio of the main elements in CrNiCu is 2:2:1:1:1, and the mass of each component is calculated as Al powder 66.63g, Ti powder 118.22g, Cr powder 64.21g, Ni powder 72.47g, Cu powder 78.47g g. Weigh the corresponding mass with an electronic balance, put the powder into a container, and pass through argon protection, and then mix the powder on a V-type mixer for 36 hours until uniform.

[0050] Step 2: Preparation of high-entropy alloy Al by mechanical alloying 2 Ti 2 CrNiCu powder

[0051] Put the uniformly mixed powder in step 1 into a stainless steel ball mill tank, vacuumize and fill it with argon as a protective atmosphere, and perform mechanical alloying on a planetary ball mill with a ball-to-material ratio of 9:1 and a speed of 300r / min. The ball milli...

Embodiment 3

[0056] Step 1: Composition Design of High Entropy Alloy

[0057] AlTi 3 CrNiCu high-entropy alloy with a theoretical density of 5.88g / cm 3 , according to the high-entropy alloy AlTi 3 The molar atomic ratio of the main elements in CrNiCu is 1:3:1:1:1, and the mass of each component is calculated as Al powder 31.30g, Ti powder 166.59g, Cr powder 60.32g, Ni powder 68.08g, Cu powder 73.72 g. Weigh the corresponding mass with an electronic balance, put the powder into a container, and pass through argon protection, and then mix the powder on a V-type mixer for 24 hours until uniform.

[0058] Step 2: Preparation of high-entropy alloy AlTi by mechanical alloying 3 CrNiCu powder

[0059] Put the uniformly mixed powder in step 1 into a stainless steel ball mill tank, vacuumize it and fill it with argon as a protective atmosphere, and perform mechanical alloying on a planetary ball mill with a ball-to-material ratio of 9:1 and a speed of 350r / min. The ball milling process is carr...

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Abstract

The invention discloses a low-density dual-phase high-entropy alloy material and a preparing method thereof. The elemental composition of the low-density dual-phase high-entropy alloy material is AlxTiyCrNiCu, wherein x is 0.5-3, y is 0.5-3, the crystal structure of the alloy material is FCC+BCC dual-phase structure, and the density is 5.18-7.14 g / cm<3>. The method is a solid-state forming methodfor combining a mechanical alloying technology and a spark plasma sintering technology, the required temperature of the solid-state forming method is low, the sintering time is short, a bulk materialwhich is uniform in compositions and has near full density can be obtained through once sintering, and a near net forming can be realized; and the prepared low-density dual-phase high-entropy alloy material is fine in grain, uniform in structure, and high in strength, hardness, wear resistance, and has excellent comprehensive mechanical properties such as plasticity.

Description

technical field [0001] The invention belongs to the technical field of new metal materials, and in particular relates to a low-density dual-phase high-entropy alloy material and a preparation method thereof. Background technique [0002] High-entropy alloys have a series of excellent properties different from traditional alloys, such as high hardness, wear resistance, high-temperature strength, corrosion resistance, etc., which have very important research value and broad application prospects. The microstructure of high-entropy alloys is mainly composed of simple solid solution phases. Generally, high-entropy alloy solid solutions with FCC structure have good plasticity, but their strength and hardness are relatively low; high-entropy alloys with BCC structure have higher strength and hardness, but Poor plasticity. Dual-phase (FCC+BCC) high-entropy alloys can simultaneously obtain good comprehensive mechanical properties of high strength, high hardness and certain plastici...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C30/02C22C1/04B22F3/105B22F9/04
CPCB22F3/105B22F9/04B22F2003/1051B22F2009/041B22F2009/043B22F2998/10C22C1/04C22C30/02
Inventor 朱德智吴吉鹏郑振兴刘一雄刘是文
Owner SOUTH CHINA UNIV OF TECH
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