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Ultrathin flexible flat-plate heat pipe

A flat heat pipe, ultra-thin and flexible technology, applied in the field of heat transfer, can solve the problems of complex manufacturing process, poor heat pipe flexibility, poor surface adaptability, etc., and achieve the effect of uniform temperature distribution, reduced temperature gradient, and good contact

Pending Publication Date: 2019-11-08
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although these have certain thermal conductivity, the flexibility of the heat pipe itself is very poor, and the surface adaptability is poor.
Moreover, for flat heat pipes, there are still problems such as large volume, heavy weight, and complicated manufacturing process.

Method used

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  • Ultrathin flexible flat-plate heat pipe
  • Ultrathin flexible flat-plate heat pipe
  • Ultrathin flexible flat-plate heat pipe

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] The present invention will be further explained below in conjunction with the accompanying drawings.

[0025] An ultra-thin flexible flat heat pipe comprises an upper flexible cover plate 1 and a lower flexible cover plate 2 . The micro-columns 3 are evenly spaced in the lower flexible cover plate 2. The micro-columns 3 are formed by electrodeposition, 3D printing or high-temperature mold extrusion. The cross-section of the micro-columns is circular and the diameter is 1mm. , the distance between the centers of adjacent microcolumns is 3 mm. The microcolumn 3 forms a guide column and a supporting column of the steam chamber inside the heat pipe.

[0026] A flexible red copper wire mesh 4 is formed on the inside of the upper flexible cover plate 1 by thermal sintering and pressing. The flexible red copper wire mesh 4 is a 200-mesh red copper wire mesh. The area and position of the flexible red copper wire mesh correspond to the area and position of the micro-pillars. T...

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Abstract

The invention discloses an ultrathin flexible flat-plate heat pipe. The flat-plate heat pipe comprises an upper flexible composite cover plate, a lower flexible composite cover plate, a flexible red copper wire mesh and a supporting column structure growing on the lower flexible cover plate; each of the upper cover plate and the lower cover plate is formed by three layers of materials, the middlelayer is provided with a high-thermal-conductivity flexible graphite film, and ultra-thin copper foil layers are obtained on the two sides of the flexible graphite film through physical vapor deposition / electrolytic deposition; a closed cavity is formed between the cover plates through edge sealing, and the sealed cavity after vacuumizing is filled with working liquid; and circular micro-columnsformed on the inner side of the lower flexible cover plate through electrolytic deposition / 3D printing / mold extrusion form flexible flat-plate heat pipe supporting columns. The flexible red copper wire mesh subjected to hot pressing sintering on the upper flexible cover plate serves as a capillary core structure of the heat pipe. The ultrathin flexible flat-plate heat pipe has the advantages ofbeing small in size, light in weight, high in heat conductivity and good in flexibility, so that the surface adaptability is strong.

Description

technical field [0001] The invention relates to an ultra-thin flexible flat heat pipe, which belongs to the technical field of heat transfer. Background technique [0002] The rapid development of electronic industry technology has made electronic components gradually develop in the direction of miniaturization, high integration, and high performance, making the heat flux density of electronic devices during the operation process higher and higher, effective heat dissipation has become more difficult, and heat dissipation has gradually become a constraint Bottleneck problem in the development of highly integrated electronic components. Flat heat pipe is a phase change cooling form of latent heat exchange, with high heat transfer efficiency and strong thermal conductivity. It can efficiently absorb the heat emitted by high heat flux heating devices through a small cross-sectional area, and effectively transfer the absorbed heat It is transported to the heat sink, and finally...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): F28D15/04
CPCF28D15/043
Inventor 史波许乐
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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