Conductive particles, method for producing same, and anisotropic conductive film

A technology of conductive particles and acid solution, which is applied in the field of conductive adhesives, can solve problems such as poor compatibility of organic matter, high material cost, and large filling amount, and achieve low cost, stable chemical properties, and good compatibility.

Inactive Publication Date: 2019-10-25
BEIHAI HKC OPTOELECTRONICS TECH CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The main purpose of the present invention is to provide a conductive particle and its preparation method, and an anisotropic conductive film, aiming to solve the problems of high cost, poor compatibility with organic matter, particle The larger the diameter, the more filling required, resulting in higher material costs

Method used

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  • Conductive particles, method for producing same, and anisotropic conductive film
  • Conductive particles, method for producing same, and anisotropic conductive film
  • Conductive particles, method for producing same, and anisotropic conductive film

Examples

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preparation example Construction

[0040] The present invention provides a method for preparing conductive particles. The method for preparing conductive particles includes the following steps:

[0041] Using a silicon-containing precursor as a silicon source, water and alcohol as a mixed solvent, adding a surfactant, stirring, centrifuging and drying to obtain mesoporous silica balls;

[0042] Using mesoporous silica spheres as a template, a resin solution as a carbon source, and water and alcohol as a mixed solvent, after stirring, curing and calcination, porous carbon spheres are obtained;

[0043] The aniline and the porous carbon ball are dissolved in an acidic solution, and an initiator is added. After washing and drying, a porous carbon ball polyaniline nanowire composite is obtained, and the porous carbon ball polyaniline nanowire composite is a conductive particle.

[0044] The present invention firstly adopts the sol-gel method to prepare mesoporous silica spheres. The silicon-containing precursor is used as t...

Embodiment 1

[0080] In this embodiment, the conductive particles are prepared by the following steps:

[0081] (1) Preparation of mesoporous silica spheres: mix 10 mL of absolute ethanol and 20 mL of deionized water to obtain a mixed solvent, and add 0.05 g of cetyltrimethylammonium bromide to the mixed solvent at 15°C , Stir uniformly at a speed of 100 rpm, then add 0.5 mL of ethyl orthosilicate and 0.2 mL of ammonia, continue to stir at a speed of 300 rpm for 3 hours, and centrifuge and dry to obtain hollow mesoporous silica balls.

[0082] (2) Preparation of porous carbon balls: Add 0.05g of mesoporous silica balls to 40mL of mixed solvent. The ratio of organic alcohol to water in the mixed solvent is 0.5:1. The organic alcohol is absolute ethanol, and then 0.2g is added. The phenolic resin solution with a mass concentration of 10% was stirred at 300 rpm for 5 hours, then poured into a petri dish, placed in an oven and cured at 80°C for 30 hours to obtain a yellow powder. Then the yellow pow...

Embodiment 2

[0085] In this embodiment, the conductive particles are prepared by the following steps:

[0086] (1) Preparation of mesoporous silica balls: Mix 30 mL of ethylene glycol and 30 mL of deionized water to obtain a mixed solvent, add 0.1 g of cetyltrimethylammonium bromide to the mixed solvent, and at a temperature of 25°C, Stir uniformly at a speed of 200 rpm, then add 1.5 mL of ethyl orthosilicate and 1.5 mL of ammonia water, continue to stir at a speed of 600 rpm for 10 hours, and centrifuge and dry to obtain hollow mesoporous silica balls.

[0087] (2) Preparation of porous carbon balls: Add 0.15g of mesoporous silica balls to 100mL of mixed solvent, where the ratio of organic alcohol to water in the mixed solvent is 1:1, organic alcohol is ethylene glycol, and then 1g mass is added The phenolic resin solution with a concentration of 30% was stirred at 500 rpm for 8 hours, then poured into a petri dish and placed in an oven at 100 ℃ for curing for 20 hours to obtain a yellow powde...

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Abstract

The invention discloses a conductive particle and a preparation method thereof, and an anisotropic conductive film. The preparation method of the conductive particles comprises the following steps: bytaking a silicon-containing precursor as a silicon source and water and alcohol as a mixed solvent, performng stirring, centrifuging and drying to obtain mesoporous silica spheres; performing stirring, curing and calcining by taking the mesoporous silica spheres as a template, a resin solution as a carbon source and water and alcohol as a mixed solvent to obtain porous carbon spheres; dissolvinganiline and the porous carbon spheres in an acidic solution, adding an initiator, performing washing and drying to obtain a porous carbon sphere polyaniline nanowire compound which is conductive particles. According to the technical scheme, the problems that existing conductive particles are higher in cost, poorer in compatibility with organic matter, larger in particle size and higher in materialcost due to the fact that the needed filling amount is large in the actual application process can be solved.

Description

Technical field [0001] The invention relates to the technical field of conductive adhesives, in particular to a conductive particle and a preparation method thereof, and an anisotropic conductive film using the conductive particle. Background technique [0002] Anisotropic Conductive Film (ACF) is a transparent polymer connecting material that has the three characteristics of bonding, conductivity and insulation at the same time. ACF has the remarkable characteristics of vertical conductivity and horizontal insulation. ACF can provide fine-pitch, high-reliability cold interconnection, and has been widely used to connect liquid crystal panels and driving chips in liquid crystal displays. The ACF layer includes conductive particles that play a role of conduction and fillers that play a role of filling. Among them, the conductive particles have a variety of structures according to the different conditions of use. The commonly used conductive fillers include carbon, metal and metal o...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/04H01B1/12H01B5/00H01B5/14H01B13/00C08G73/02C01B32/15C01B33/12
CPCC01B32/15C01B33/12C08G73/0266H01B1/04H01B1/128H01B5/00H01B5/14H01B13/00
Inventor 夏玉明
Owner BEIHAI HKC OPTOELECTRONICS TECH CO LTD
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