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A kind of low-temperature fast-curing RFID electronic paste and preparation method thereof

An electronic paste, fast curing technology, applied in the field of radio frequency identification, can solve the problems of reduced silver content, long curing time, warpage of coated paper, etc. Effect

Active Publication Date: 2021-02-12
湖南省国银新材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The invention provides a low-temperature fast-curing RFID electronic paste and a preparation method thereof, which are used to overcome the high curing temperature, long curing time, easy warping of coated paper, and high cost caused by high silver content in the electronic paste in the prior art. defects, achieve low curing temperature, short curing time, avoid warping coated paper, and reduce silver content in electronic paste

Method used

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  • A kind of low-temperature fast-curing RFID electronic paste and preparation method thereof
  • A kind of low-temperature fast-curing RFID electronic paste and preparation method thereof

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preparation example Construction

[0021] The present invention also proposes a method for preparing a low-temperature fast-curing RFID electronic paste, comprising the following steps:

[0022] (1) Take by weight (35~45): (3~5): (7~10): (40~50) take flake silver powder, nickel powder, polymer resin and organic solvent;

[0023] Preferably, the average particle size of the flaky silver powder is 5-7 μm; the average particle size of the nickel powder is 0.5-1 μm, and the micron-sized nickel powder can fill the gaps of the flaky silver powder when they are overlapped, thereby increasing Conductive pathways between large powders.

[0024] Preferably, the polymer resin is at least one of polyester resin, polyurethane resin, and polyethylene-vinyl alcohol resin. The polymer resin is dissolved in an organic solvent to form a jelly, which is used to overlap the flake silver powder to form a conductive path.

[0025] Preferably, the organic solvent is dimethyl malonate, dimethyl succinate, dimethyl glutarate, ethylen...

Embodiment 1

[0036] The present embodiment provides a kind of RFID electronic paste of low temperature rapid solidification, comprises each component of following weight: 43.3% flaky silver powder, 3.8% nickel powder, 9.6% polyester resin, 43.3% dimethyl malonate and N - Methylpyrrolidone.

[0037] This embodiment also provides a method for preparing a low-temperature fast-curing RFID electronic paste, comprising the following steps:

[0038] (1) Take by weighing 45g average particle diameter of flaky silver powder, 4g average particle diameter of 0.5~1 μm nickel powder, 10g polyester resin, 40g dimethyl malonate, 5g N-methylpyrrolidone;

[0039] (2) Add the polyester resin weighed in step (1) into the mixed solvent of dimethyl malonate and N-methylpyrrolidone, heat and stir at 90°C for 3h until the polyester resin is completely dissolved, and use a 300-mesh filter to remove the insolubles to obtain the organic carrier;

[0040] (3) Place the flake silver powder and nickel powder weighed...

Embodiment 2

[0044] The present embodiment provides a kind of RFID electronic paste of low temperature fast solidification, comprises each component of following weight: 43.5% flaky silver powder, 4.3% nickel powder, 8.7% acrylic resin, 43.5% dimethyl succinate and dipropylene glycol n-propyl ether.

[0045] This embodiment also provides a method for preparing a low-temperature fast-curing RFID electronic paste, comprising the following steps:

[0046](1) Take by weighing 50g average particle diameter be the flaky silver powder of 5~7 μm, 5g average particle diameter be the nickel powder of 0.5~1 μm, 10g acrylic resin and 45g dimethyl succinate, 5g dipropylene glycol n-propyl ether;

[0047] (2) Add the acrylic resin weighed in step (1) into the mixed solvent of dimethyl succinate and dipropylene glycol n-propyl ether, heat and stir at 95°C for 2.8h until the acrylic resin is completely dissolved, and filter through 250 mesh Net filtration removes insoluble matter, obtains organic carrier...

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Abstract

The invention discloses a low-temperature rapidly-curable RFID electronic paste and a preparation method thereof. The electronic paste comprises the following components in percentage by weight: 35-45% of flake silver powder, 3-5% of nickel powder, 7-10% of macromolecule resin and 40-50% of an organic solvent. The preparation method comprises the following steps: weighing raw materials according to a weight ratio, preparing an organic carrier, carrying out heat treatment on raw materials of the sheet-shaped silver powder and of the nickel powder, preparing mixed slurry, rolling the mixed slurry, and finally preparing the low-temperature rapidly-curable RFID electronic paste. The electronic paste provided by the invention is low in curing temperature and short in curing time, and warping ofcoated paper can be avoided and silver content in the electronic paste can be reduced. The preparation method provided by the invention is simple in process, the cost is obviously reduced, and the prepared paste has low-temperature rapidly-curable performance.

Description

technical field [0001] The invention relates to the technical field of radio frequency identification, in particular to a low-temperature fast-curing RFID electronic paste and a preparation method thereof. Background technique [0002] Radio Frequency Identification (RFID) technology is a non-contact automatic identification technology realized by radio frequency communication. RFID tags have the characteristics of small size, large capacity, long life and reusability, and can support rapid identification, mobile Identification, multi-target identification, positioning and long-term tracking management, etc., RFID technology is used in logistics, manufacturing, anti-counterfeiting, public information services and other industries, which can greatly improve management and operational efficiency. The base materials of RFID tags are generally coated paper and PET film. Coated paper is easily warped and deformed at a temperature exceeding 110°C, which directly affects the yield ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/22H01B13/00G06K19/02
CPCG06K19/02H01B1/22H01B13/00
Inventor 肖新明杨华荣李杰严红革李蓉朱彪陈吉华
Owner 湖南省国银新材料有限公司
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