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A three-dimensional composite material and its preparation method, application, substrate and electronic device

A composite material and three-dimensional technology, which is applied in the fields of three-dimensional composite materials and their preparation, substrates and electronic devices, can solve the problems of not effectively increasing the thermal conductivity of composite materials, increasing the dielectric constant of composite materials, and deteriorating the mechanical properties of materials. Achieve the effect of facilitating large-scale production, enhancing mutual contact, and requiring less production equipment

Active Publication Date: 2022-07-05
SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, due to the high interfacial thermal resistance between the polymer matrix and the thermally conductive filler, simple filling cannot effectively increase the thermal conductivity of the composite
In this case, the ideal thermal conductivity can only be obtained by continuously increasing the volume fraction of the filler, but an excessively high filler ratio will increase the dielectric constant of the composite material and deteriorate the mechanical properties of the material

Method used

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  • A three-dimensional composite material and its preparation method, application, substrate and electronic device
  • A three-dimensional composite material and its preparation method, application, substrate and electronic device
  • A three-dimensional composite material and its preparation method, application, substrate and electronic device

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Experimental program
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Effect test

Embodiment 1

[0037] figure 1 It is a schematic structural diagram of a three-dimensional composite material according to an embodiment of the present invention. like figure 1 As shown, the three-dimensional composite material includes a thermally conductive filler BN as the three-dimensional network skeleton 1 and a polymer 2 filled in the three-dimensional network skeleton 1. In this embodiment, the polymer 2 is epoxy resin.

[0038] The preparation method of the three-dimensional composite material is as follows:

[0039] 1) Mix BN powder with an average particle size of 3 μm and PVA with an average particle size of 160 μm at room temperature according to the required volume fraction;

[0040] 2) Press the uniformly mixed PVA and BN powders into a tablet under 300MPa for 5min in a tablet press;

[0041] 3) heat treatment of the sheet material obtained in step 2) at 700° C. for 10 h to decompose the PVA to obtain a three-dimensional network skeleton of BN, which can be self-supporting ...

Embodiment 2

[0044] A three-dimensional composite material, the thermally conductive filler is diamond, and the filled polymer is PDMS silicone rubber.

[0045] The preparation method of the three-dimensional composite material is as follows:

[0046] 1) Mix the diamond powder with an average particle size of 3 μm and the camphor with an average particle size of 500 μm at room temperature according to the required volume fraction;

[0047] 2) Press the uniformly mixed camphor and diamond powder into a tablet shape under 10MPa pressure for 30min in a tablet press;

[0048] 3) heat treatment of the sheet material obtained in step 2) at 200° C. for 12 hours to decompose the camphor to obtain a three-dimensional network skeleton of diamond;

[0049] 4) The three-dimensional network skeleton obtained in step 3) is placed in a polytetrafluoroethylene mold and filled with PDMS silicone rubber, placed in a vacuum oven to remove air bubbles for 0.5h and then cured. The curing program is 60°C / 4h. ...

Embodiment 3

[0051] A three-dimensional composite material such as figure 1 As shown, the thermally conductive filler is AlN, and the filled polymer is epoxy resin.

[0052] The preparation method of the three-dimensional composite material is as follows:

[0053] 1) Mix AlN powder with an average particle size of 50 μm and PC with an average particle size of 500 μm at room temperature according to the required volume fraction;

[0054] 2) Press the uniformly mixed PC and AlN powder into a tablet shape under 500MPa for 3min in a tablet press;

[0055] 3) heat treatment of the sheet material obtained in step 2) at 1000° C. for 7 h to decompose PC to obtain a three-dimensional network skeleton of AlN;

[0056] 4) The three-dimensional network skeleton obtained in step 3) is placed in a polytetrafluoroethylene mold and filled with bisphenol A epoxy resin, methyl hexahydrophthalic anhydride is selected as a curing agent, and imidazole is used as an accelerator. Placed in a vacuum oven to re...

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Abstract

The invention discloses a three-dimensional composite material with both high thermal conductivity and low dielectric constant, its preparation method, application, substrate and electronic device. The preparation method of the three-dimensional composite material comprises the following steps: mixing a thermally conductive filler and a pyrolysis material and then pressurizing to obtain a pressed product; heat-treating the pressed product to remove the pyrolysis material to obtain a three-dimensional network skeleton; filling the three-dimensional network skeleton with a polymer material, cured; wherein the particle size of the pyrolyzed material is at least 8 times the particle size of the thermally conductive filler. The construction and effective regulation of the three-dimensional network skeleton can be achieved by selecting the particle size of thermally conductive fillers and pyrolysis materials. The pressure enhances the mutual contact between the fillers as the three-dimensional skeleton and reduces the thermal resistance of the interface. The three-dimensional structure composite material can make the heat conduct rapidly in the thermal conduction path of the three-dimensional skeleton formed by the thermal conductive filler to achieve the effect of greatly improving the thermal conductivity. . At the same time, the method is simple to operate, requires low production equipment, and is beneficial to large-scale production.

Description

technical field [0001] The present invention relates to the technical field of thermally conductive materials, in particular to a three-dimensional composite material, a preparation method, application thereof, a substrate and an electronic device. Background technique [0002] With the development trend of light, thin, short, small, high-performance, and low-cost electronic devices, the expansion of high-density integrated circuits to the three-dimensional direction will produce a series of thermal, electrical, mechanical, energy supply and other problems. In particular, the heat generated by electronic components has become a key factor affecting the performance and service life of electronic components. In 5G mobile communication technology, the integration level is further improved, and the component density is further increased. Especially in order to ensure a large amount of data exchange, MIMO technology is widely used, so many antennas will bring serious heating pro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L83/04C08L9/02C08K3/38C08K3/28C08K3/04C08K3/22
CPCC08K3/38C08K3/28C08K3/04C08K3/22C08K2003/2296C08K2003/282C08K2003/385C08K2201/003C08L63/00C08L83/04C08L9/02
Inventor 汪宏徐信未
Owner SOUTH UNIVERSITY OF SCIENCE AND TECHNOLOGY OF CHINA
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