Electronic chip 80-120 degree oxygen control type pipeline corrosion resistance liquid metal and process thereof

An electronic chip and liquid metal technology, applied in the field of gallium alloy, can solve problems such as heat dissipation system failure, circuit board short circuit, pipeline cracking, etc., achieve high heat transfer coefficient, low repair cost, and solve industry problems

Inactive Publication Date: 2019-10-08
深圳市兴荣晟物业管理有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

That is to say, in the driving mode of the electromagnetic pump, the pipe material may crack due to the erosion of liquid metal after a period of use, and eventually cause the heat dissipation system to fail
Moreover, since liquid metal is a conductive material, the leaked liquid liquid metal will also cause a short circuit on the circuit board, resulting in a substantial failure

Method used

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  • Electronic chip 80-120 degree oxygen control type pipeline corrosion resistance liquid metal and process thereof

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Embodiment 1

[0019] An oxygen-controlling pipeline corrosion-resistant liquid metal for an electronic chip at 80-120 degrees Celsius and its technology. In terms of weight percentage, the alloy composition is Ag: 0.3wt.%, Ni: 0.1wt.%, Sb: 4.2wt.%, Zn: 8.5wt.%, In: 16.0wt.%, Bi: 3.2wt.% , Pb: 1.5wt.%, the balance is gallium; the oxide composition to control the oxygen activity is PbO: 12.0wt.%, SnO 2 :5.0wt.%,TaO:1.4wt.%,MnO 2 :6.0wt.%, CoO: 2.5wt.%, the balance is Fe 2 o 3 .

[0020] The above-mentioned oxygen-controlled pipe corrosion-resistant liquid metal for 80-120 degrees Celsius and its process includes the following processing and use steps: (a) After the alloy is configured according to the required components, it is put into an induction furnace for melting , and use graphite crucible for smelting under the protection of argon; heat the alloy at 200 degrees for 10 minutes and use electromagnetic stirring to fully stir the alloy melt evenly. After cooling, remove the scum on th...

Embodiment 2

[0023] An oxygen-controlling pipeline corrosion-resistant liquid metal for an electronic chip at 80-120 degrees Celsius and its technology. In terms of weight percentage, the alloy composition is Ag: 0.4wt.%, Ni: 0.3wt.%, Sb: 5.0wt.%, Zn: 9.0wt.%, In: 18.0wt.%, Bi: 4.5wt.% , Pb: 2.0wt.%, the balance is gallium; the oxide composition to control the oxygen activity is PbO: 15.0wt.%, SnO 2 :5.0wt.%,TaO:1.4wt.%,MnO 2 :6.2wt.%, CoO: 2.5wt.%, the balance is Fe 2 o 3 .

[0024] The above-mentioned oxygen-controlled pipe corrosion-resistant liquid metal for 80-120 degrees Celsius and its process includes the following processing and use steps: (a) After the alloy is configured according to the required components, it is put into an induction furnace for melting , and use a graphite crucible for smelting under the protection of argon; heat the alloy melt at 250 degrees for 10 minutes and use electromagnetic stirring to fully stir the alloy melt evenly. After cooling, remove the scu...

Embodiment 3

[0027] An oxygen-controlling pipeline corrosion-resistant liquid metal for an electronic chip at 80-120 degrees Celsius and its technology. In terms of weight percentage, the alloy composition is Ag: 0.3wt.%, Ni: 0.1wt.%, Sb: 4.8wt.%, Zn: 8.5wt.%, In: 17.5wt.%, Bi: 3.2wt.%. , Pb: 1.4wt.%, the balance is gallium; the oxide composition to control the oxygen activity is PbO: 14.0wt.%, SnO 2 :6.5wt.%,TaO:1.2wt.%,MnO 2 :5.4wt.%, CoO: 2.6wt.%, the balance is Fe 2 o 3 .

[0028] The above-mentioned oxygen-controlled pipe corrosion-resistant liquid metal for 80-120 degrees Celsius and its process includes the following processing and use steps: (a) After the alloy is configured according to the required components, it is put into an induction furnace for melting , and use a graphite crucible for smelting under the protection of argon; heat the alloy at 240 degrees for 10 minutes and use electromagnetic stirring to fully stir the alloy melt evenly. After cooling, remove the scum on...

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Abstract

The invention discloses electronic chip 80-120 degree oxygen control type pipeline corrosion resistance liquid metal and a process thereof. According to the weight percentage, an alloy comprises 0.2%-0.4% of Ag, 0.1%-0.3% of Ni, 4.0%-6.0% of Sb, 8.0%-10.0% of Zn, 15.0%-20.0% of In, 3.0%-5.0% of Bi, 1.0%-3.0% of Pb and the balance gallium; and oxide for controlling the oxygen activity comprises 10.0%-20.0% of PbO, 4.0%-8.0% of SnO2, 1.0%-2.0% of TaO, 5.0%-8.0% of MnO2, 2.0%-4.0% of CoO and the balance Fe2O3. The liquid metal is packaged in the pipeline, an oxygen control module is adopted for controlling the oxygen activity, a stable and dense oxide film can be effectively formed on the surface of the stainless steel pipeline, and the corrosion of the liquid metal to pipeline materials is inhibited. The liquid metal has the advantages that the technology process is simple, the implementation cost is low, the heat dissipation is efficient, and the service life of a heat dissipation component is obviously improved.

Description

technical field [0001] The invention relates to the technical field of alloys, in particular to a gallium alloy. Background technique [0002] The factors that determine heat dissipation and heat conduction in electronic chips mainly include: chip integration density, copper foil thickness, trace width, etc. In the actual use process, the application environment of the product, the manufacturing process of the circuit board and the quality of the board should also be considered. Due to the increase of chip integration density, the axis of the circuit board will generate heat after continuous current, which will cause the temperature of the chip to rise. What is more serious is that the rise in temperature not only causes the chip to activate the self-protection mechanism, but also the substrate will deform when the temperature rises to the allowable temperature of the substrate, which will affect the bonding force between the copper foil wire and the substrate, and eventual...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C28/00C22C1/02C22C32/00H01L23/373H01L23/473
CPCC22C1/02C22C28/00C22C32/001H01L23/3736H01L23/473
Inventor 王金辉
Owner 深圳市兴荣晟物业管理有限公司
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