Chemical plating protection method of copper back plate water path
An electroless plating, copper backplane technology, applied in liquid chemical plating, sputtering plating, ion implantation plating, etc., can solve the problems of reducing the thermal conductivity of copper backplane, polluting cooling water, clogging of circulating pipes, etc. Excellent anti-oxidation performance, improve cooling performance, reduce the effect of oxidation corrosion
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Embodiment 1
[0061] 1) First degreasing: use OY-27 type cold degreasing agent (6% by mass) and potassium sodium tartrate plus polyamine (10% by mass) mixed aqueous solution (the rest is water) to clean the copper backboard waterway Soak at room temperature for 15 minutes;
[0062] Second degreasing: use 305 alloy degreasing powder solution with a concentration of 120g / L, and soak the copper backplane waterway for 30 minutes at a high temperature of 90°C.
[0063] Use deionized water to clean the copper backplane waterway until there are no water drops on the surface of the copper backplane waterway.
[0064] 2) Pass the plating solution into the copper backboard water channel after degreasing, and the plating solution includes the following components: glyceryl ether 300g / L, silver sulfate 60g / L, sodium hypophosphite 50g / L, ammonium carbonate 300g / L , polydimethylsiloxane 1g / L, sodium benzoate 0.4g / L and the remainder of water;
[0065] Control the circulation flow rate of the plating so...
Embodiment 2
[0068] 1) First degreasing: use OY-27 type cold degreasing agent (4% by mass) and potassium sodium tartrate plus polyamine (8% by mass) mixed aqueous solution (the rest is water) to clean the copper backboard waterway Soak at room temperature for 15 minutes;
[0069] The second degreasing: use 305 alloy degreasing powder solution with a concentration of 80g / L, and soak the copper backboard waterway for 30min at a high temperature of 70°C.
[0070] Use deionized water to clean the copper backplane waterway until there are no water drops on the surface of the copper backplane waterway.
[0071] 2) Pass the plating solution to the water channel of the copper backboard after degreasing, and the plating solution includes the following components: 900g / L of glycerol ether, 80g / L of silver nitrate, 50g / L of sodium hypophosphite, and 300g / L of ammonium carbonate , polydimethylsiloxane 5g / L, sodium benzoate 0.4g / L and the rest of the water;
[0072] Control the circulation flow rate ...
Embodiment 3
[0075] 1) First degreasing: use OY-27 type cold degreasing agent (6% by mass) and potassium sodium tartrate plus polyamine (10% by mass) mixed aqueous solution (the rest is water) to clean the copper backboard waterway Soak at room temperature for 15 minutes;
[0076] The second degreasing: use 305 alloy degreasing powder solution with a concentration of 100g / L, and soak the copper backboard waterway for 30 minutes at a high temperature of 80°C.
[0077] Use deionized water to clean the copper backplane waterway until there are no water drops on the surface of the copper backplane waterway.
[0078] 2) Lead the plating solution to the copper backboard waterway after degreasing, and the plating solution includes the following components: ethylene glycol 800g / L silver nitrate 30g / L, potassium hypophosphite 50g / L, ammonium carbonate 100g / L , polydimethylsiloxane 3g / L, sodium benzoate 0.4g / L and the balance of water.
[0079] Control the circulation flow rate of the plating solu...
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