Evaporation-boiling capillary core and liquid-supplementing capillary core coupled combined structure

Abstract

The invention discloses an evaporation-boiling capillary core and liquid-supplementing capillary core coupled combined structure. The combined structure comprises a liquid-supplementing channel lower substrate; a first groove is formed in the middle of the liquid-supplementing channel lower substrate; a second groove is formed in the middle of the first groove; a groove channel is formed in the middle of the second groove; a substrate of an evaporation-boiling capillary core is arranged in the second groove; an ITO heating film is sputtered at the bottom of the evaporation-boiling capillary core; a heat insulation material is arranged at the bottom of the ITO heating film; the heat insulation material is arranged in the groove channel; a liquid-supplementing capillary core is arranged in the first groove; the liquid-supplementing capillary core is arranged at the periphery of the evaporation-boiling capillary core; a liquid-supplementing channel upper substrate is arranged on the upper side of the liquid-supplementing capillary core; a through groove is formed in the middle of the liquid-supplementing channel upper substrate; a nano evaporation film is arranged in the through groove; the nano evaporation film covers the upper side of the evaporation-boiling capillary core; a liquid-supplementing channel is formed between the liquid-supplementing channel lower substrate and the liquid-supplementing channel upper substrate; and the liquid-supplementing channel communicates with a channel of the liquid-supplementing capillary core.

Description

technical field [0001] The invention relates to the field of thin-film phase change heat transfer in tiny spaces in micro-nano heat transfer, in particular to an evaporation-boiling capillary core coupled liquid replenishment capillary core combined structure. Background technique [0002] With the rapid development of various electronic devices such as microprocessors, solar cells, laser diodes, and radio frequency power amplifiers, electronic devices are rapidly showing two trends: miniaturization and integration. Boiling heat transfer is a violent vaporization process that converts the working medium from liquid to vapor through the generation, growth and detachment of a large number of bubbles. Compared with traditional air cooling and convective heat transfer, the heat transfer coefficient has an order of magnitude difference , so it is a very effective way to dissipate heat. The basic research on the mechanism of phase transition shows that the main mechanism of nucle...

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Problems solved by technology

However, the transition mechanism between thin film evaporation and nucleate boiling is still unclear. How to extend the heat dissipation capability of ultra-high heat flux in a small area (millimeter level) to a larger area, and at the same time delay the dry burning of the center or local hot spot of the heating surface problems and challenges

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