Aluminum-silicon alloy binding agent diamond abrasive disc and manufacture method thereof
An aluminum-silicon alloy and manufacturing method technology, applied in the manufacture of tools, abrasives, metal processing equipment, etc., can solve the problems of diamond thermal damage, high melting point, etc., reduce the degree of thermal damage, expand the scope of application, improve service life and processing quality Effect
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Embodiment 1
[0019] A method for manufacturing an aluminum-silicon alloy bonded diamond grinding disc, comprising the steps of:
[0020] 1) The diamond powder with a particle size of W40 and the aluminum-silicon alloy bond are fully mixed in a mixer according to the diamond concentration of 100%. The aluminum-silicon alloy bond contains the following components by weight: Si30%, Ti6%, Mg0. 5%, Cu5%, Ga0.5%, Ce0.5%, Sr0.5%, Na0.5%, the balance is Al together with unavoidable impurities;
[0021] 2) After the above mixture is cold-pressed into a mold with the desired shape of the diamond grinding disc segment, it is kept at 150MPa, 750°C for 30 minutes, then at 90MPa, 650°C for 15 minutes, and cooled with the furnace to obtain a diamond grinding disc segment ;
[0022] 3) The sintered diamond grinding disc segment body is mounted on the grinding disc substrate to obtain the rough product of the diamond grinding disc of the present invention, and the diamond grinding disc obtained above is t...
Embodiment 2
[0025] A method for manufacturing an aluminum-silicon alloy bonded diamond grinding disc, comprising the steps of:
[0026] 1) Fully mix the diamond powder with a particle size of W5 and the aluminum-silicon alloy bond in a mixer at a diamond concentration of 75%. The aluminum-silicon alloy bond contains the following components by weight: Si20%, Ti3%, Cu5% , Ce0.5%, Sr0.5%, Na0.5%, the balance is Al together with unavoidable impurities;
[0027] 2) After the above mixture is cold-pressed into a mold with the desired shape of the diamond grinding disc segment, it is kept at 100 MPa and 700 ° C for 60 minutes, then at 50 MPa and 650 ° C for 30 minutes, and cooled with the furnace to obtain a diamond grinding disc segment ;
[0028] 3) The sintered diamond grinding disc segment body is mounted on the grinding disc substrate to obtain the rough product of the diamond grinding disc of the present invention, and the diamond grinding disc obtained above is trimmed with a diamond ro...
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