Resin matrix with strong microwave absorbability and preparation method thereof

Abstract

Aresin matrix with strong microwave absorbability and a preparation method thereof belong to the field of composite materials. In the invention, high-performance epoxy resin with strong polarity is selected as matrix resin, a microwave absorptioncomponent is added for adjusting microwaveresponsiveness and viscosity of a resin system to adapt to liquid molding by winding and the like, a curing agent is selected for adjusting themicrowaveresponse activity of the resin system, and the mechanical property, the heat resistance and thedimensional stability of the resin matrix are achieved; on the basis, an ionic liquid modified nanometer component is adopted for further enhancing the microwaveresponsiveness of the resin matrix. By adjusting the component structure and thematch ratio of the matrix resin, the microwave absorption component, the curing agent,theionic liquid modified nanometer componentand the like, a microwave curing resin system with good microwave absorbability, good dispersity of the nanometer component, proper viscosity, uniform curing, excellent comprehensive mechanical property, good heat resistance and high dimensional stability is developed. The resin matrix has great guiding significance for preparation of fiber composite materials and can be widely applied to the fields of aerospace and the like.

Description

technical field [0001] The invention belongs to the field of composite materials, and mainly relates to a resin matrix with strong microwave absorption and a preparation method thereof. Background technique [0002] Thermosetting resin-based composites have been widely used in advanced technologies due to their excellent physical and chemical properties, such as high tensile and compressive strength, good dielectric properties, thermal stability, and corrosion resistance. Specifically, the curing of thermosetting resins such as epoxy resins has become increasingly important, first from their use as matrix materials for aerospace and marine structural composite components, and more recently as adhesives and adhesives for the microelectronics and electronics industries. Package encapsulants. In traditional thermal curing, energy is transferred to the material through heat convection, conduction, and radiation on the mold surface, resulting in long curing time, high energy los...

AI Technical Summary

Problems solved by technology

Generally speaking, there are technical deficiencies in the microwave-curable resin matrix reported in the literature: one is that the resin matrix has a single component, the polarity of the resin matrix is ​​low, the microwave absorption capacity of the entire resin matrix is ​​poor and the final curing degree is not high; the other is to improve Resin polarity introduces nano-components, but the compatibility of nano-components with the resin matrix is ​​often poor, resulting in uneven dispersion and affecting its performance; the third is that the microwave curing process is too simple, continuous microwave, pulse microwave and staged according to power The traditional microwave curing method often ignores the change in the microwave absorption capacity of the resin system during the reaction process, resulting in large temperature fluctuations in the resin system, which ultimately affects the uniformity of curing.

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