Low-melting-point SnBi alloy-copper composite electronic slurry and preparing and printing methods
An electronic paste, low melting point technology, used in cable/conductor manufacturing, equipment for manufacturing conductive/semiconductor layers, conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problem of poor conductivity and high sintering temperature , copper powder is easily oxidized, etc., to achieve the effect of low production cost, simple process route, and easy availability of raw materials
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Embodiment 1
[0055] Step 1. Prepare a copper sulfate solution with a mass-to-volume ratio of 10 g / L at room temperature, add trisodium citrate, sodium tetraborate and EDTA to the copper sulfate solution for a total of 10 g / L, stir and mix to obtain a gel-like mixture A; Then add NaOH solution to the gel mixture A to adjust the pH to 10, stir to obtain the main salt mixed solution B; then add the catalyst nickel sulfate 0.8g / L to the main salt mixed solution B, and the reducing agent sodium hypophosphite 30g / L, buffering agent boric acid 30g / L, using NaOH solution to adjust the pH to 10, to obtain the plating solution mixed solution C;
[0056] Step 2: Put the graphene nanosheets into the prepared bath mixture solution C, and then add the additives polyethylene glycol 0.6g / L and potassium ferrocyanide 0.2g / L; the temperature is controlled at 40°C, pH Controlled to 10, magnetically stirred, ultrasonically dispersed, filtered to take out the graphene nanosheets; washed with deionized water for ...
Embodiment 2
[0062] Prepare a copper sulfate solution with a mass-volume ratio of 13g / L at room temperature, add trisodium citrate, sodium tetraborate and EDTA to the copper sulfate solution for a total of 13g / L, stir and mix to obtain a gel mixture A; Add NaOH solution to the colloidal mixture A to adjust the pH to 13, and stir to obtain the main salt mixed solution B; then add the catalyst nickel nitrate 1g / L, the reducing agent sodium hypophosphite 33g / L, and the buffer to the main salt mixed solution B. Boric acid is 33g / L, and the pH is adjusted to 13 with NaOH solution to obtain plating solution mixture C;
[0063] Step 2: Put the graphene nanosheets into the prepared bath mixture solution C, and then add the additives polyethylene glycol 0.8g / L and potassium ferrocyanide 0.4g / L; the temperature is controlled at 50°C, pH Controlled to 13, magnetic stirring, ultrasonic dispersion, filtering out the graphene nanosheets; using deionized water to wash repeatedly to neutral, and finally dryi...
Embodiment 3
[0069] Prepare a copper sulfate solution with a mass-volume ratio of 15g / L at room temperature, add trisodium citrate, sodium tetraborate and EDTA to the copper sulfate solution for a total of 15g / L, stir and mix to obtain a gel-like mixture A; Add NaOH solution to the colloidal mixture A to adjust the pH to 15, and stir to obtain the main salt mixed solution B; then add the catalyst nickel sulfate 1.2g / L to the main salt mixed solution B, the reducing agent sodium hypophosphite 35g / L, and buffer Boric acid is 35g / L, and the pH is adjusted to 15 with NaOH solution to obtain plating solution mixture C;
[0070] Step 2. Put the graphene nanosheets into the prepared bath mixture solution C, and then add the additives polyethylene glycol 1g / L and potassium ferrocyanide 0.6g / L; the temperature is controlled at 60°C, and the pH is controlled At 15, magnetic stirring, ultrasonic dispersion, filtering out the graphene nanosheets; using deionized water to wash to neutrality several times,...
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