Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

A wiring structure in the bending area of ​​a folding screen, a display device and a manufacturing method thereof

A manufacturing method and bending zone technology, which are applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., and can solve the problems of metal wiring disconnection and crack propagation.

Active Publication Date: 2021-03-16
WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] At present, the structure of the hinge region of the folding screen mainly adopts the metal wiring structure of Ti / Al / Ti or Mo / Al / Mo. The metal wiring is deposited on the surface of the base film layer through the process of plasma sputtering, and solidified under high temperature quenching state. Form a brittle amorphous structure, and then add organic polymer fillers around the metal traces to assist it in achieving better bending, but microcracks are inevitably formed on the surface of the metal traces during the bending process, these Micro-cracks propagate during the structure of the folding screen Hinge region, eventually causing the metal wiring to be disconnected

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A wiring structure in the bending area of ​​a folding screen, a display device and a manufacturing method thereof
  • A wiring structure in the bending area of ​​a folding screen, a display device and a manufacturing method thereof
  • A wiring structure in the bending area of ​​a folding screen, a display device and a manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0035] In order to make the purposes, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments These are some embodiments of the present invention, but not all embodiments. The components of the embodiments of the invention generally described and illustrated in the drawings herein may be arranged and designed in a variety of different configurations.

[0036] Thus, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the invention as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary ski...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
elastic modulusaaaaaaaaaa
electrical resistivityaaaaaaaaaa
Login to View More

Abstract

The invention provides a wiring structure in a bending area of ​​a folding screen, a display device and a manufacturing method thereof. The wiring structure in the bending area of ​​the folding screen includes a wiring substrate, a silicone packaging layer, a liquid wiring, and a metal wiring. The liquid wiring is encapsulated in the silicone packaging layer, and the silicone packaging layer can realize the shaping of the liquid wiring; the metal wiring is arranged at the end of the silicone packaging layer and extends into it to communicate with the liquid wiring electrical connection. The display device includes the above wiring structure in the bending area of ​​the folding screen. The manufacturing method of the routing structure in the bending area of ​​the folding screen includes the steps of etching the routing substrate, manufacturing a silicone packaging layer, manufacturing liquid routing, and electrical connection treatment. The bending area uses liquid wiring to avoid the defects that the metal wiring structure is not suitable for bending and is prone to cracks during the bending process. This structure can prevent the problem of line interruption during the bending process, improve product yield, and reduce the use of folding screens. risk of failure.

Description

technical field [0001] The invention relates to the field of display, in particular to a wiring structure in a bending area of ​​a folding screen, a display device and a manufacturing method thereof. Background technique [0002] Flexible displays are currently the mainstream of flexible organic light-emitting diode (Organic Light Emitting Display, OLED) technology. Flexible OLEDs do not use glass as a substrate. Among them, foldable active-matrix organic light-emitting diode (AMOLED) displays can be like wallets. folded up. When not in use, it is folded to make it smaller, and by unfolding it when in use, a large screen can be achieved. Displays are technically difficult to fold, and to achieve foldable, research is needed to minimize panel damage by using materials with low stress (tensile / compressive strength) in the folded portion. Among them, the structure of the Hinge (hinge) bending area in the AMOLED flexible folding screen is a key research problem for the current...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/32H01L51/52H01L51/56H01L23/29H01L23/498H01L23/552
CPCH01L23/498H01L23/29H01L23/552H10K59/00H10K50/80H10K71/00
Inventor 刘亚丽
Owner WUHAN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products