A precision machining method for ultra-thin quartz sheet

Abstract

The invention provides a precise processing method of an ultrathin quartz plate, and belongs to the field of optical processing. The processing method comprises following steps: at first, placing a quartz blank in an annealing furnace to carry out precise annealing; then, adhering the B side of the quartz blank on a support disc, thinning the A side of the quartz blank until a designated thicknessis reached, polishing the surface to remove a layer damaged by the grinding; trimming the shape of the A side until the surface quality and shape precision reach the final processing requirements; corroding the processed surface to remove the layer influenced by polishing; finally, removing the quartz blank from the support disc, adhering processed A side on an optical cement pad through opticalcement, and processing the B side by a same method. The provided processing method has the advantages of low cost, high efficiency, and high precision. The deformation, which is caused by the change of internal stress when a material is removed, of a finished product is avoided, the core problem namely stress induced deformation in fine processing of an ultrathin quartz material is solved, and furthermore, the processing method does not need any high precision machine tool and is suitable for batch production.

Description

technical field [0001] The invention belongs to the field of optical processing and relates to a precision processing method for ultra-thin quartz materials. Background technique [0002] With the rapid development of modern science and technology, ultra-thin quartz sheets are widely used in high-precision optical systems, photoelectric systems and precision mechanical systems, such as laser devices, photolithography masks, gyro vibrators, resonant accelerometer force-sensitive components, Planar optical elements and transmissive terahertz elements, etc. [0003] At present, the processing methods for high-precision optical parts mainly include asphalt ring polishing, double-sided polishing, ion beam modification, and magnetorheological polishing. The main difficulty in the processing of ultra-thin optical parts lies in various deformations, including cementation deformation, thermal deformation, stress deformation, etc. The asphalt ring polishing method is generally combi...

AI Technical Summary

Problems solved by technology

However, the influence of stress and deformation is not considered in this process, so it is difficult to meet the index requirements of nanometer precision; and when the parts are thinned to a thickness of hundreds of microns, it is difficult to process them by double-sided polishing

[0005] In summary, the stress and deformation in the processing of ultra-thin quartz wafers have not been effectively resolved