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Heat-conducting electronic alloy material

An alloy material and electronic technology, applied in the field of heat-conducting electronic alloy materials, can solve the problems of material mechanical properties decline, poor chemical stability, poor corrosion resistance, etc., and achieve the effect of improving fatigue resistance, improving mechanical strength, and good corrosion resistance

Inactive Publication Date: 2019-05-28
贵州顽熊电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, graphite powder has poor compatibility with organic materials, and its use in organic modification often leads to defects such as a decrease in the mechanical properties of the material.
[0005] In the prior art, the products of heat-conducting electronic alloy materials also have the disadvantages of poor chemical stability, poor corrosion resistance and poor thermal conductivity.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0015] A heat-conducting electronic alloy material, which consists of 20-30 parts of copper, 10-15 parts of iron, 3-10 parts of silicon, 1-6 parts of nickel, 0.1-1 part of zinc, 0.5-1 part of phosphorus, and graphite powder by weight. 3-10 parts, 0.5-1 part of ytterbium fluoride, 0.5-1 part of titanium dioxide, 8-10 parts of epoxy resin and 4-6 parts of alicyclic epoxy resin.

[0016] The heat-conducting electronic alloy material, by weight, consists of 25 parts of copper, 13 parts of iron, 7 parts of silicon, 3 parts of nickel, 0.5 part of zinc, 0.7 part of phosphorus, 6 parts of graphite powder, 0.7 part of ytterbium fluoride, titanium dioxide 0.7 parts, 9 parts of epoxy resin and 5 parts of cycloaliphatic epoxy resin.

[0017] The weight ratio of ytterbium fluoride to titanium dioxide is 1:1.

[0018] The epoxy resin is a four-functional epoxy resin.

[0019] The cycloaliphatic epoxy resin is bis((3,4-epoxycyclohexyl)methyl)adipate.

Embodiment 2

[0021] A heat-conducting electronic alloy material, by weight, consists of 20 parts of copper, 10 parts of iron, 3 parts of silicon, 1 part of nickel, 0.1 part of zinc, 0.5 parts of phosphorus, 3 parts of graphite powder, 0.5 parts of ytterbium fluoride, and 0.5 parts of titanium dioxide 8 parts of epoxy resin and 4 parts of cycloaliphatic epoxy resin.

[0022] The weight ratio of ytterbium fluoride to titanium dioxide is 1:1.

[0023] The epoxy resin is a four-functional epoxy resin.

[0024] The cycloaliphatic epoxy resin is bis((3,4-epoxycyclohexyl)methyl)adipate.

Embodiment 3

[0026] A heat-conducting electronic alloy material, which consists of 30 parts of copper, 15 parts of iron, 10 parts of silicon, 6 parts of nickel, 1 part of zinc, 1 part of phosphorus, 10 parts of graphite powder, 1 part of ytterbium fluoride, and 1 part of titanium dioxide by weight. 10 parts of epoxy resin and 6 parts of cycloaliphatic epoxy resin.

[0027] The weight ratio of ytterbium fluoride to titanium dioxide is 1:1.

[0028] The epoxy resin is a four-functional epoxy resin.

[0029] The cycloaliphatic epoxy resin is bis((3,4-epoxycyclohexyl)methyl)adipate.

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PUM

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Abstract

The invention discloses a heat-conducting electronic alloy material. The heat-conducting electronic alloy material comprises the following components of, in parts by weight, 20-30 parts of copper, 10-15 parts of iron, 3-10 parts of silicon, 1-6 parts of nickel, 0.1-1 part of zinc, 0.5-1 parts of phosphorus, 3-10 parts of graphite powder, 0.5-1 parts of ytterbium fluoride, 0.5-1 parts of titanium dioxide, 8-10 parts of epoxy resin and 4-6 parts of alicyclic epoxy resin. The heat-conducting electronic alloy material has good heat-conducting property and mechanical property, and the development and application of the heat-conducting electronic material composition can be met. The electronic material is reasonable in formula design and simple in manufacturing method, the mechanical strength and the anti-corrosion effect of the material are improved while the conductive performance of the material is ensured, and meanwhile, the production cost is reduced, the anti-fatigue performance of theelectronic material is improved, so that the electronic alloy material with excellent bending processability is obtained; the electronic alloy material has the advantages of being high in stability,good in corrosion resistance and good in heat conductivity.

Description

technical field [0001] The invention relates to alloy materials, in particular to a heat-conducting electronic alloy material. Background technique [0002] Electronic materials refer to materials used in electronic technology and microelectronic technology, including dielectric materials, semiconductor materials, piezoelectric and ferroelectric materials, conductive metals and their alloy materials, magnetic materials, optoelectronic materials, electromagnetic wave shielding materials and other related materials. Material. Electronic materials are the material basis for the development of modern electronics industry and science and technology, and are also technology-intensive subjects in the field of science and technology. It involves multidisciplinary knowledge such as electronic technology, physical chemistry, solid state physics and process foundation. [0003] According to the chemical properties of the material, it can be divided into metal electronic materials, el...

Claims

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Application Information

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IPC IPC(8): C22C30/06C22C32/00
Inventor 熊仕刚
Owner 贵州顽熊电子科技有限公司
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