Heat-conducting electronic alloy material
An alloy material and electronic technology, applied in the field of heat-conducting electronic alloy materials, can solve the problems of material mechanical properties decline, poor chemical stability, poor corrosion resistance, etc., and achieve the effect of improving fatigue resistance, improving mechanical strength, and good corrosion resistance
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Embodiment 1
[0015] A heat-conducting electronic alloy material, which consists of 20-30 parts of copper, 10-15 parts of iron, 3-10 parts of silicon, 1-6 parts of nickel, 0.1-1 part of zinc, 0.5-1 part of phosphorus, and graphite powder by weight. 3-10 parts, 0.5-1 part of ytterbium fluoride, 0.5-1 part of titanium dioxide, 8-10 parts of epoxy resin and 4-6 parts of alicyclic epoxy resin.
[0016] The heat-conducting electronic alloy material, by weight, consists of 25 parts of copper, 13 parts of iron, 7 parts of silicon, 3 parts of nickel, 0.5 part of zinc, 0.7 part of phosphorus, 6 parts of graphite powder, 0.7 part of ytterbium fluoride, titanium dioxide 0.7 parts, 9 parts of epoxy resin and 5 parts of cycloaliphatic epoxy resin.
[0017] The weight ratio of ytterbium fluoride to titanium dioxide is 1:1.
[0018] The epoxy resin is a four-functional epoxy resin.
[0019] The cycloaliphatic epoxy resin is bis((3,4-epoxycyclohexyl)methyl)adipate.
Embodiment 2
[0021] A heat-conducting electronic alloy material, by weight, consists of 20 parts of copper, 10 parts of iron, 3 parts of silicon, 1 part of nickel, 0.1 part of zinc, 0.5 parts of phosphorus, 3 parts of graphite powder, 0.5 parts of ytterbium fluoride, and 0.5 parts of titanium dioxide 8 parts of epoxy resin and 4 parts of cycloaliphatic epoxy resin.
[0022] The weight ratio of ytterbium fluoride to titanium dioxide is 1:1.
[0023] The epoxy resin is a four-functional epoxy resin.
[0024] The cycloaliphatic epoxy resin is bis((3,4-epoxycyclohexyl)methyl)adipate.
Embodiment 3
[0026] A heat-conducting electronic alloy material, which consists of 30 parts of copper, 15 parts of iron, 10 parts of silicon, 6 parts of nickel, 1 part of zinc, 1 part of phosphorus, 10 parts of graphite powder, 1 part of ytterbium fluoride, and 1 part of titanium dioxide by weight. 10 parts of epoxy resin and 6 parts of cycloaliphatic epoxy resin.
[0027] The weight ratio of ytterbium fluoride to titanium dioxide is 1:1.
[0028] The epoxy resin is a four-functional epoxy resin.
[0029] The cycloaliphatic epoxy resin is bis((3,4-epoxycyclohexyl)methyl)adipate.
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