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Copper alloy sheet and process for producing same

A manufacturing method and technology of copper alloys, applied in the direction of metal/alloy conductors, conductive materials, conductive materials, etc., can solve the problems of reduced contact pressure of contact parts, increased contact resistance of contact parts, cracks in materials, etc., to achieve excellent bending workability , the effect of excellent strength

Active Publication Date: 2012-09-26
FURUKAWA ELECTRIC CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there arises the problem of cracks appearing on the material
[0008] Second, with the increase in strength of materials, there is a problem of cracks in materials
[0009] Third, if cracks appear in the bent part of the contact part and the spring part, the contact pressure of the contact part will decrease, so that the contact resistance of the contact part will increase, the electrical connection will be insulated, and the function as a connector will be lost. , become a major problem

Method used

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  • Copper alloy sheet and process for producing same
  • Copper alloy sheet and process for producing same
  • Copper alloy sheet and process for producing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0090] Using a high-frequency melting furnace, as shown in the composition of the alloy composition column in Table 1-1, Si containing at least one or both of Ni and Co in a total of 0.5 to 5.0 mass % and 0.1 to 1.5 mass % , an alloy whose balance is Cu and unavoidable impurities is melted, and cast to obtain an ingot. Using this state as a feedstock, test materials of the copper alloy sheet materials of Examples 1-1 to 1-19 of the present invention and Comparative Examples 1-1 to 1-9 were produced through any of the following steps A to F.

[0091] (Process A)

[0092] Homogenizing heat treatment for 10 minutes to 10 hours at 1020~700°C, three passes of hot rolling at a temperature range of 1020~(P+30)°C at a processing rate of more than 25%, air cooling, in (P-30) In the temperature range of ~4000C, three passes of hot rolling, water cooling, 50~99% cold rolling, heat treatment at 600~900°C for 10 seconds~5 minutes, 5~55% processing at a processing rate below 25% High-spee...

Embodiment 2

[0127] For a copper alloy having the composition shown in the column of the alloy composition of Table 2 and the balance being Cu and unavoidable impurities, Examples 2-1 to 2-17 of the present invention and Comparative Example 2-1 were produced in the same manner as in Example 1. The test materials of the copper alloy sheets of 1 to 2-3 were investigated in the same manner as in Example 1 for their characteristics. The results are shown in Table 2.

[0128]

[0129] As shown in Table 2, Invention Example 2-1 to Invention Example 2-17 were excellent in bending workability, yield strength, electrical conductivity, and stress relaxation resistance.

[0130] On the other hand, in the case where the stipulations of the present invention are not satisfied, the characteristics are inferior. That is, Comparative Examples 2-1, 2-2, and 2-3 (all of which are comparative examples of the invention of the above item (3)) have poor electrical conductivity due to the addition of a large...

Embodiment 3

[0132] For copper alloys with the composition shown in Table 3, and the balance is Cu and unavoidable impurities, after the ingot is subjected to a homogenization heat treatment at 1020~700°C for 10 minutes to 10 hours, the copper alloy shown in Table 4 After hot rolling, water cooling, face cutting, 50-99% cold rolling, heat treatment at 600-900°C for 10 seconds to 5 minutes, cold working at 5-55% processing rate, 50% at 750-1000°C Second ~ 1 hour final solution heat treatment. Then, carry out aging precipitation heat treatment at 350~600°C for 5 minutes~20 hours, finish rolling at 2~45% processing rate, and temper annealing at 300~700°C for 10 seconds~2 hours. test material. The characteristics were investigated in the same manner as in Example 1. The results are shown in Table 4.

[0133] [table 3]

[0134] Composition element

Ni

co

Si

sn

Zn

Mg

Cr

quality%

2.71

0.32

0.76

0.17

0.31

0.07

...

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Abstract

Provided is a copper alloy sheet which has excellent bendability and excellent strength and is suitable for use in lead frames, connectors, and terminal materials for electric / electronic appliances, connectors or terminal materials for vehicular mounting, relays, switches, and the like. Also provided is a process for producing the copper alloy sheet. The copper alloy sheet, when analyzed for crystal orientation by EBSD (electron back scatter diffraction), has a value of R defined by the equation of 1 or greater: R=([BR]+[RDW]+[W]) / ([C]+[S]+[B]) where [BR], [RDW], [W], [C], [S], and [B] respectively are the areal proportions of texture components respectively having BR orientation {362}<853>, RD-rotated-cube orientation {012}<100>, cube orientation {100}<001>, copper orientation {121}<111>, S orientation {231}<346>, and brass orientation {110}<112>. The sheet has a proof strength of 500 MPa or greater and a conductivity of 30% IACS or higher.

Description

technical field [0001] The present invention relates to a copper alloy sheet material and a manufacturing method thereof, and more specifically relates to a copper alloy sheet material suitable for automotive parts or lead frames for electric and electronic instruments, connectors, terminal materials, relays, switches, sockets, etc., and a manufacturing method thereof . Background technique [0002] The characteristic items required for copper alloy sheet materials used for automotive parts or lead frames for electrical and electronic instruments, connectors, terminal materials, relays, switches, sockets, etc., include, for example, electrical conductivity, yield strength (yield stress), Tensile strength, bending processability, stress relaxation resistance, etc. In recent years, along with miniaturization, weight reduction, higher functionality, higher-density mounting, and higher temperature of the use environment of electric and electronic equipment, the level of demand ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C9/06C22C9/00C22C9/02C22C9/04C22C9/05C22C9/10C22F1/08H01B1/02H01B5/02C22F1/00
CPCH01B1/026C22F1/08C22C9/06C22C9/00H01B1/02
Inventor 金子洋佐藤浩二江口立彦
Owner FURUKAWA ELECTRIC CO LTD
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