Method for preparing hollow microneedles by ultraviolet curing process with soluble fiber as core material

A soluble, hollow microtechnology, applied in the field of medical devices, can solve the problems of limiting the use range of hollow microneedle arrays, cumbersome operation steps, complex preparation processes, etc., and achieve the effects of shortening the preparation cycle, lowering the preparation environment requirements, and reducing the difficulty of forming.

Active Publication Date: 2021-03-26
BEIJING UNIV OF CHEM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

In addition, the preparation method of hollow microneedles usually uses multi-step ion etching and laser etching to form the hollow part of the microneedle, and the operation steps are relatively cumbersome.
The disadvantage of these methods is that they require complex preparation processes, and the preparation cycle is long, and the preparation cost is also high, which greatly limits the scope of use of hollow microneedle arrays.

Method used

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  • Method for preparing hollow microneedles by ultraviolet curing process with soluble fiber as core material
  • Method for preparing hollow microneedles by ultraviolet curing process with soluble fiber as core material
  • Method for preparing hollow microneedles by ultraviolet curing process with soluble fiber as core material

Examples

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Embodiment 1

[0028] This embodiment provides a method for preparing hollow microneedles with a photoresist of c-coating type and using soluble PVA fiber as a core material by an ultraviolet curing process. The main component of this type of photoresist is polyurethane acrylate. The preparation method includes the following steps: step:

[0029] The micro-needle mold is processed on the PDMS material by using micro-electro-mechanical system (MEMS). The 3 cavities of the PDMS micro-needle mold are cone arrays. The mold structure is as attached figure 1 shown. The microneedle array is arranged in 10×10, the spacing between each microneedle in the microneedle array is 1mm, and the size structure of each conical microneedle cavity of the fixed microneedle is: 500×250 μm (height × bottom diameter). In addition, a fiber fixing hole 4 is corresponding to the top of each microneedle cavity, and the fiber fixing hole 4 is a cylindrical through hole with a size of 200×20 μm.

[0030] The soluble ...

Embodiment 2

[0035] This embodiment provides a method for preparing hollow microneedles with a photoresist of GP756 type and using a soluble PVA fiber as a core material by an ultraviolet curing process. The main component of this type of photoresist is polymethyl methacrylate. The preparation method includes The following steps:

[0036] The micro-needle mold is processed on the PDMS material by using micro-electro-mechanical system (MEMS). The 3 cavities of the PDMS micro-needle mold are cone arrays. The mold structure is as attached figure 1 shown. The microneedle array is arranged in 10×10, the distance between each microneedle in the microneedle array is 1 mm, and the size structure of each conical microneedle cavity is: 500×250 μm (height×bottom diameter) . In addition, a fiber fixing hole 4 is corresponding to the top of each microneedle cavity, and the fiber fixing hole 4 is a cylindrical through hole with a size of 200x20 μm.

[0037] The soluble PVA fiber 1 is prepared by an ...

Embodiment 3

[0042] This embodiment provides a method for preparing hollow microneedles with a JZ-303 type photoresist using soluble PVA fiber as a core material by an ultraviolet curing process. The main component of this type of photoresist is polymethyl methacrylate. The method includes the following steps:

[0043] The micro-needle mold is processed on the PDMS material by using micro-electro-mechanical system (MEMS). The 3 cavities of the PDMS micro-needle mold are cone arrays. The mold structure is as attached figure 1shown. The microneedle array is arranged in 10×10, the distance between each microneedle in the microneedle array is 1 mm, and the size structure of each conical microneedle cavity is: 500×250 μm (height×bottom diameter) . In addition, a fiber fixing hole 4 is corresponding to the top of each microneedle cavity, and the fiber fixing hole 4 is a cylindrical through hole with a size of 200x20 μm.

[0044] The soluble PVA fiber 1 is prepared by an electrospinning proce...

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Abstract

The invention discloses a method for preparing a hollow microneedle through an ultraviolet-curing process using a soluble fiber as a core material. The method can be carried out at the room temperature, and the preparation time is short, which is advantageous for preparing a hollow microneedle array quickly and batchwise. Compared with an existing hollow microneedle preparation method, an ultraviolet-curing molding method is adopted to avoid a heating and melting process of a polymer material, a high temperature condition is not required, and requirements for a preparation environment are low;the ultraviolet-curing process has a short molding time, and the microneedle can be formed by 2-3 minute exposure of a photoresist in an ultraviolet light, which greatly shortens the preparation cycle; the hollow part of the microneedle adopts a molding method of using the soluble PVA fiber as the core material, due to the characteristic that the soluble PVA fiber can be dissolved in the water, so that the molding process of the hollow part becomes simple and fast, and the molding difficulty of the hollow microneedle is reduced.

Description

technical field [0001] The invention relates to a method for preparing hollow microneedles by using soluble fiber as a core material through an ultraviolet curing process, and belongs to the technical field of medical devices. Background technique [0002] In medicine, for some diseases, traditional oral administration and injection are usually used for treatment. However, the former will cause partial loss of drug effect after the drug is digested by the stomach, and even affect and destroy the function of liver organs; while the latter will cause skin tissue damage and infection. In order to avoid these disadvantages, transdermal drug delivery system has become a better treatment method. This method allows the drug to penetrate the skin at a certain rate, absorb into the blood circulation through capillaries, and achieve an effective blood drug concentration to produce curative effect. However, there are about 95% keratinocytes in the epidermis of the skin, which have a ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): A61M37/00
Inventor 庄俭饶峰杜唯佳吴大鸣许红孙靖尧黄尧刘颖
Owner BEIJING UNIV OF CHEM TECH
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