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Highly transparent and low-expansion polyimide film for flexible display and preparation method thereof

A polyimide film and flexible display technology, which is applied in the field of high-transparency and low-expansion polyimide film for flexible display and its preparation, can solve the problems of low light transmittance, achieve good film-forming performance and low production cost , Low expansion thermal stability effect

Active Publication Date: 2020-12-22
SHANDONG HUAXIA SHENZHOU NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Patent CN107698785A provides a low-expansion polyimide-based composite film. By introducing inorganic materials into the reaction system of aromatic dianhydride monomers and aromatic diamine monomers, the expansion coefficient can be as low as 3-5.5ppm / °C, but its light transmittance is not high

Method used

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  • Highly transparent and low-expansion polyimide film for flexible display and preparation method thereof
  • Highly transparent and low-expansion polyimide film for flexible display and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] (1) 0.143g (2wt%) β-eucryptite and 40.375g DMAc are added to a four-necked flask for ultrasonic dispersion, so that they are fully dispersed in an organic solvent to form a uniform dispersion;

[0037](2) Add 1.081g of PDA monomer into the β-eucryptite organic solvent dispersion four-necked flask with nitrogen gas, stir until it dissolves completely;

[0038] (3) Weigh 6.044g of 1,4-bis(3,4-dicarboxylic acid-5-trifluoromethylamidophenyl)cyclohexane dianhydride and add it to the above solution in batches under stirring conditions. In situ polymerization at ℃ for 4 hours to obtain a polyamic acid solution with a solid content of 15 wt %;

[0039] (4) Add 3.036g triethylamine and 3.063g acetic anhydride to the above polyamic acid solution for chemical imidization, and react at 30°C for 8 hours to obtain a polyimide solution;

[0040] (5) Cast the obtained polyimide solution on ultra-flat glass, and then place it in an oven at 80° C. to dry for 24 hours to obtain a highly ...

Embodiment 2

[0043] (1) 0.285g (4wt%) β-eucryptite and 40.375g DMAc were added to a four-necked flask, and ultrasonically dispersed at room temperature to fully disperse it in an organic solvent to form a uniform dispersion;

[0044] (2) Add 1.081g of PDA monomer into the β-eucryptite organic solvent dispersion four-necked flask with nitrogen gas, stir until it dissolves completely;

[0045] (3) Weigh 6.044g of 1,4-bis(3,4-dicarboxylic acid-5-trifluoromethylamidophenyl)cyclohexane dianhydride and add it to the above solution in batches under stirring conditions. In situ polymerization at ℃ for 4 hours to obtain a polyamic acid solution with a solid content of 15 wt %;

[0046] (4) Add 3.036g triethylamine and 3.063g acetic anhydride to the above polyamic acid solution for chemical imidization, and react at 30°C for 8 hours to obtain a polyimide solution;

[0047] (5) Cast the obtained polyimide solution on ultra-flat glass, and then place it in an oven at 80° C. to dry for 24 hours to obt...

Embodiment 3

[0050] (1) 0.428g (6wt%) β-eucryptite and 40.375g DMAc were added to a four-necked flask, and ultrasonically dispersed at room temperature to fully disperse it in an organic solvent to form a uniform dispersion;

[0051] (2) Add 1.081g of PDA monomer into the β-eucryptite organic solvent dispersion four-necked flask with nitrogen gas, stir until it dissolves completely;

[0052] (3) Weigh 6.044g of 1,4-bis(3,4-dicarboxylic acid-5-trifluoromethylamidophenyl)cyclohexane dianhydride and add it to the above solution in batches under stirring conditions. In situ polymerization at ℃ for 4 hours to obtain a polyamic acid solution with a solid content of 15 wt %;

[0053] (4) Add 3.036g triethylamine and 3.063g acetic anhydride to the above polyamic acid solution for chemical imidization, and react at 30°C for 8 hours to obtain a polyimide solution;

[0054] (5) Cast the obtained polyimide solution on ultra-flat glass, and then place it in an oven at 80° C. to dry for 24 hours to obt...

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Abstract

The invention belongs to the technical field of functional polymer materials, and particularly relates to a high-transparent low-expansion polyimide film for flexible display and a preparation methodof the high-transparent low-expansion polyimide film. The high-transparent low-expansion polyimide film for flexible display is prepared from a beta-lithium nepheline inorganic nanometer filler with anegative expansion coefficient adding into a polyimide matrix through an in-situ polymerization method, addition of the beta-lithium nepheline inorganic nanometer filler increases the glass-transition temperature, and meanwhile, can reduce a thermal expansion coefficient; the polyimide matrix is obtained by a polycondensation reaction of 1,4-bis(3,4-dicarboxylic acid-5-trifluoromethyl acylamino benzene)cyclohexane dianhydride and aromatic diamine monomers, since dianhydride monomers simultaneously have fluorine-contained groups and alicyclic structures, formation of intermolecular and intramolecular charge transfer complexes can be effectively inhibited, the transparency of polymers is greatly improved, and meanwhile, contained acylamino can also lower a thermal expansion coefficient of polyimide; and according to the preparation method of the high-transparent low-expansion polyimide film, the production cost is low, and film forming performance is good.

Description

technical field [0001] The invention belongs to the technical field of functional polymer materials, and in particular relates to a highly transparent and low-expansion polyimide film for flexible display and a preparation method thereof. Background technique [0002] With the rapid development of optoelectronic display technology, light weight, large size, ultra-thin and flexible displays have become an inevitable trend in future development. Replacing traditional hard glass with high-transparency and low-expansion polymer film as the substrate material is the technical key to realize the flexibility of display devices. Polyimide material has become the focus of attention due to its excellent heat resistance stability and can withstand high temperature processes such as electrode film deposition and annealing treatment in the process of optoelectronic device processing. However, due to the presence of conjugated aromatic ring structures on the main chain of traditional aro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/08C08K3/34C08J5/18C08G73/10
Inventor 王汉利王俊莉孟祥青杨振东张敬
Owner SHANDONG HUAXIA SHENZHOU NEW MATERIAL
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