Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Terahertz detector and method based on N*M dielectric resonant antenna array

A terahertz detector and dielectric resonant antenna technology, applied in the terahertz field, can solve the problems affecting the detection sensitivity of the terahertz detector, the impedance matching bandwidth of the terahertz antenna is narrow, and the loss of the terahertz antenna is large, so as to solve the problem of on-chip terahertz. The antenna impedance matching bandwidth is narrow, the low gain of the on-chip terahertz antenna is solved, and the detection sensitivity is improved

Active Publication Date: 2019-04-19
GUANGDONG UNIV OF TECH
View PDF8 Cites 6 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] At present, terahertz detection based on NMOSFET has been proved to be very feasible. However, due to the limitation of CMOS technology, the traditional on-chip dipole and patch terahertz antenna in the terahertz detector have a large loss, resulting in the traditional on-chip dipole The impedance matching bandwidth of terahertz antennas such as subs and patches is narrow, which greatly affects the detection sensitivity of terahertz detectors

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Terahertz detector and method based on N*M dielectric resonant antenna array
  • Terahertz detector and method based on N*M dielectric resonant antenna array
  • Terahertz detector and method based on N*M dielectric resonant antenna array

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0043] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0044] It should be noted that if there is a directional indication (such as up, down, left, right, front, back...) in the embodiment of the present invention, the directional indication is only used to explain the position in a certain posture (as shown in the accompanying drawing). If the specific posture changes, the directional indication will also change accordingly.

[0045] In addition, if there are descriptions involving "first", "second" and ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses a terahertz detector based on an N*M dielectric resonant antenna array. The N*M on-chip dielectric resonant terahertz antenna array is connected to a matching network, the matching network is connected to the source electrode of an NMOSFET, and the grid electrode of the NMOSFET is sequentially connected with a first bias resistor and first bias voltage. A third transmissionline is connected between the first bias resistor and the grid electrode. The drain electrode of the NMOSFET is connected to a first blocking capacitor. The other end of the first blocking capacitoris connected with a low noise pre-amplifier. A second bias resistor and a second bias voltage are connected between the first blocking capacitor and the low noise pre-amplifier. The low noise pre-amplifier is further provided with a voltage feedback loop. The invention also discloses a designing method of the N*M on-chip dielectric resonant terahertz antenna array. Compared with the prior art, loss of the on-chip terahertz antenna is effectively reduced and gain and radiation efficiency of the on-chip terahertz antenna are improved.

Description

technical field [0001] The invention relates to the technical field of terahertz, in particular to a terahertz detector and method based on an N×M dielectric resonant antenna array. Background technique [0002] THz radiation (T-ray) usually refers to electromagnetic waves with a frequency in the range of 0.1THz to 10THz (wavelength 30μm to 3mm), and its long-wave direction coincides with millimeter waves (submillimeter waves), and its short-wave direction coincides with infrared rays , so it belongs to the far-infrared band. [0003] Since THz waves are in a special position in the electromagnetic spectrum, they have many superior properties and are of great scientific significance. It is mainly manifested in the following aspects: First, the quantum energy and black body temperature are very low. Because the photon energy of terahertz wave is very low, it is not easy to ionize when it penetrates the material, so it can be used for safe and non-destructive testing. Secon...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01Q21/06H01Q23/00G01N21/3581
CPCG01N21/3581H01Q21/064H01Q23/00H01Q1/2283H01Q1/38H01Q9/0485H01Q21/0075H01Q21/061H01L23/66H01L2223/6655H01L2223/6677H01Q9/0407H01Q9/16H01Q21/065
Inventor 马建国周绍华
Owner GUANGDONG UNIV OF TECH
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products