Novel inorganic side high-resistance layer preparation process for increasing flow capacity of zinc oxide piezoresistor
A piezoresistor and preparation technology, which is applied in the direction of piezoresistor, piezoresistor core, coating resistance material, etc., to achieve the effect of reducing the fluctuation of glaze layer thickness and stabilizing the process
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[0039] Select the D5 specification resistor, and match the high resistance layer in the following way: 40% zinc oxide, 10% bismuth oxide, 5% cobalt oxide, 5% silicon oxide, 5% tin dioxide, 0.2% gallium oxide, PVA (polyethylene Alcohol) 2.5%, deionized water 32.3%. The prepared raw materials are mixed and heated to dissolve to make a uniform solution, and are directly coated on the side of the resistor sheet after the resistor sheet is formed.
[0040] The following is a detailed description of the specific formula-level production process.
[0041] After the zinc oxide valve plate is prepared by raw materials, mixed by ball milling, spray-dried and pressed into shape:
[0042] 1) Sintering
[0043] Use a high-temperature electric furnace to sinter the green body in a closed atmosphere. The specific temperature and control time are as follows:
[0044] From room temperature to 400°C, the heating time is 10-15 hours;
[0045]Keep low temperature debinding at 280°C for 5 hour...
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