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Adhesive for halogen-free high-Tg and low-dielectric type copper-clad plate, and preparation method thereof

A copper-clad laminate and adhesive technology, applied in the direction of polymer adhesive additives, non-polymer adhesive additives, adhesive types, etc., can solve the difficulties in production and processing of polyphenylene ether systems, high product costs, etc. problems, to achieve the effect of improving dielectric properties and reliability, low water absorption, and good machinability

Inactive Publication Date: 2019-03-29
NANYA NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This development route has good dielectric properties, but there are disadvantages such as high product cost and difficult production and processing of polyphenylene ether system

Method used

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  • Adhesive for halogen-free high-Tg and low-dielectric type copper-clad plate, and preparation method thereof
  • Adhesive for halogen-free high-Tg and low-dielectric type copper-clad plate, and preparation method thereof
  • Adhesive for halogen-free high-Tg and low-dielectric type copper-clad plate, and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0044] The preparation method of the adhesive of the halogen-free high Tg low dielectric copper clad laminate adopts the following steps:

[0045] (1) prepare materials according to the composition of raw materials;

[0046] (2) Add organic solvent, biphenyl phenol type modified epoxy resin, and phosphazene flame retardant, control the speed at 1000-1500 rpm, keep warm at 30-50°C, and stir for 30-180 minutes;

[0047] (3) Add isocyanate-modified epoxy resin, modified polymeric anhydride, and active ester curing agent in sequence, at a speed of 1000-1500 rpm, keep warm at 30-50°C, and continue stirring for 30-120 minutes after adding;

[0048] (4) Add silane, inorganic filler and toughening agent sequentially according to the formula quantity, stir at a speed of 1000-1500 rpm for 90-180 minutes, and keep warm at 30-50°C;

[0049] (5) Add metal-type catalysts and imidazole catalysts in sequence according to the formula amount, stir at a speed of 1000-1500 rpm for 90-180 minutes...

Embodiment 1

[0053] 1. Prepare materials according to the formula composition

[0054] material name

Example 1

Phosphazene flame retardant (%)

16.7

Isocyanate Modified Epoxy Resin

12.6

Modified polymeric anhydride

24.6

Active ester curing agent

10.5

Biphenyl phenol type modified epoxy resin

18.5

metal catalyst

0.005

2-Ethyl-4 methylimidazole

0.01

Spherical silica (%)

21.8

Silane (%)

0.11

Organic solvents(%)

20.6

Toughener (%)

3.58

[0055] 2. Glue adjustment

[0056] 2.1 Add organic solvent, biphenyl phenol-type modified epoxy resin, and phosphazene flame retardant sequentially into the stirring tank according to the formula quantity, rotate at 1200 rpm, keep the tank at 30-50°C, and stir for 60 minutes;

[0057] 2.2 Add isocyanate-modified epoxy resin, modified polymeric anhydride, and active ester curing agent in sequence in the tank at a speed of 1300 rpm, and ...

Embodiment 2

[0065] 1. Prepare materials according to the formula composition

[0066] material name

Example 2

Phosphazene flame retardant (%)

15.36

Isocyanate Modified Epoxy Resin

13.4

Modified polymeric anhydride

22.5

Active ester curing agent

11.5

Biphenyl phenol type modified epoxy resin

20.6

metal catalyst

0.005

2-Ethyl-4 methylimidazole

0.01

Spherical silica (%)

24.5

Silane (%)

0.12

Organic solvents(%)

21.6

Toughener (%)

3.51

[0067] 2. Glue adjustment

[0068] 2.1 Add organic solvent, biphenyl phenol type modified epoxy resin, phosphazene flame retardant sequentially into the stirring tank according to the formula quantity, rotate at 1100 rpm, keep the tank at 30-50°C, and stir for 110 minutes;

[0069] 2.2 Add isocyanate-modified epoxy resin, modified polymeric anhydride, and active ester curing agent in sequence in the tank at a speed of 1100 rpm, and co...

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Abstract

The invention relates to an adhesive for a halogen-free high-Tg and low-dielectric type copper-clad plate, and a preparation method thereof. The adhesive is prepared from, by weight, 2-80 parts of a phosphonitrile flame retardant, 5-80 parts of isocyanate modified epoxy resin, 20-70 parts of modified polymeric anhydride, 5-50 of an active ester curing agent, 5-80 parts of biphenylphenol modified epoxy resin, 0.005-1.0 part of a metal type catalyst, 0.005-1.0 part of an imidazole catalyst, 10-60 parts of an inorganic filler, 0.1-5.0 parts of silane, 1-10 parts of a toughener and 10-60 parts ofan organic solvent. The epoxy glass cloth-based copper-clad plate produced by using the adhesive prepared in the invention has a Tg value of 180 DEG C or above and a Z-axis CTE of 3.0%, or less has aTD of 360 DEG C or above and a T288 of 60 min or above in the heat resistance field, and has a copper foil peel strength (1 OZ) of 1.2 N / mm or above.

Description

technical field [0001] The invention relates to an adhesive, in particular to an adhesive for a halogen-free high Tg low dielectric copper clad board and a preparation method thereof. Background technique [0002] The 21st century has entered a highly informationized society. Computers, mobile communications, and networks have gradually penetrated into every corner of society and people's lives. Human life is steadily developing in the direction of high informationization. Information processing and information communication constitute Two technical pillars in the development of highly informationized science and technology. In order to meet the ultra-large-capacity information transmission brought about by the rapid development of information technology, as well as the rigid requirements of ultra-fast and ultra-high-density information processing, higher requirements are put forward for printed circuit boards and copper-clad laminates. The specific requirements of its produ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J173/02C09J11/04C09J11/06C09J11/08
CPCC08L2201/08C08L2205/035C09J11/04C09J11/06C09J11/08C09J173/02C08L63/00C08L75/04C08L85/02C08K7/18C08K5/52
Inventor 何川粟俊华席奎东
Owner NANYA NEW MATERIAL TECH CO LTD
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