Cutting method of chips at different sizes

Abstract

The invention discloses a cutting method of chips at different sizes. The cutting method comprises the steps of firstly, forming a mask of a target region on a wafer, wherein the target region can beat an arbitrary size and in an arbitrary shape; fixing the processed wafer on an operating table; performing dry etching to form a deep groove, and removing a part which is not covered with the mask;removing the mask; taking out the water with the deep groove, and filling the deep groove with a substitute material; grinding a back surface of the wafer until the substitute material of the groove is exposed; and removing the substitute material, and completing chip cutting. Cutting of the chips at different sizes and in different shapes is achieved on the same wafer, and the problems of chip edge breakage and the like are solved; the method is simple and efficient, separation of all chips in one time can be achieved, the wafer production number is reduced, the cost is reduced, the wafer manufacturing time is reduced, and the development progress is also accelerated; and meanwhile, the separation of the chips at the different sizes and in the different shapes is achieved, and the problemof wafer breakage probably occurring in the cutting process is prevented.

Description

technical field [0001] The invention belongs to the field of chip processing, and in particular relates to a method for cutting chips of different sizes. Background technique [0002] Wafer cutting is an essential process in the semiconductor chip manufacturing process. It is used to divide the finished chip wafer into individual chips (grains), which is a post-process in wafer manufacturing. In the development stage of the chip, in order to test the performance of chips of different sizes, it is often necessary to design chips of multiple sizes, or even chips of different shapes. However, in the traditional production method, a wafer only contains chips of one size. Wafers with chips of multiple sizes will obviously cause waste, and irregular shapes will also make cutting difficult. In addition, as the most economical and common cutting method, blade dicing still occupies a dominant position in the semiconductor chip market. Blade dicing breaks the wafer by impact, and the...

AI Technical Summary

Problems solved by technology

In the development stage of the chip, in order to test the performance of chips of different sizes, it is often necessary to design chips of multiple sizes, or even chips of different shapes. However, in the traditional production method, a wafer only contains chips of one size. Obtaining multiple sizes of chips from the wafer will obviously cause waste, and irregular shapes will also cause difficulties in cutting

In addition, as the most economical and common cutting method, blade dicing still occupies a dominant position in the semiconductor chip market. Blade dicing breaks the wafer by impact, and then uses the knife edge to remove the powder, which is prone to cracking and damage at the edge of the wafer. The cutting width It is wide, and requires frequent replacement of blades, high cost, only square wafers can be cut out, and chips of different sizes can only depend on the layout method

Stealth dicing is a non-contact process that directly vaporizes the silicon material and can cut thinner wafers. However, complete laser cutting takes a long time and is expensive. Although the cutting path can be designed to achieve cutting of various shapes, it needs programming to achieve it.