Heat exchange structure and preparation method thereof

Abstract

The invention discloses a heat exchange structure. The heat exchange structure comprises a metal substrate and rib plate arrays which are arranged on the substrate in parallel. The invention furthermore discloses a method for preparing the heat exchange structure. The method comprises the steps of: processing the parallel rib plate arrays on the metal substrate; and processing the rib plates downwards from the inner sides of the top edges of the rib plate by using a micro milling cutter through a numerical control milling method, and processing inner grooves on the side surfaces to obtain theheat exchange structure. According to the heat exchange structure and the preparation method, the heat exchange area and nucleate boiling can be effectively increased, a working medium is ensured to form a thin liquid film on the surface of the heat exchange structure, the immersion amount of the heat exchange structure in the working medium is controlled, and the nucleate boiling and thin film evaporation processes are strengthened; and the preparation method is simple, efficient and reliable in principle, and is capable of realizing low-cost and large-scale application in multiple two-phaseradiators.

Description

technical field [0001] The invention relates to the technical field of enhanced boiling heat transfer with ultra-high heat flux, in particular to a rib-plate composite inner groove channel enhanced boiling heat transfer structure suitable for high power density electronic devices and a preparation method thereof. Background technique [0002] With the development of microelectronics technology, the size of electronic components is constantly decreasing, and the operating frequency is getting higher and higher, which leads to the continuous increase of heat flux density of electronic devices. Traditional metal fin radiators can no longer meet the heat dissipation requirements of electronic devices. The problem of heat dissipation has become a key issue restricting the further integration and development of electronic devices. Therefore, solving the heat dissipation problem of electronic devices has become a key technology in the manufacture of electronic devices. [0003] At...

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Problems solved by technology

[0003] At present, with the joint efforts of domestic and foreign scholars, phase change heat transfer technology is widely used in the field of electronic heat dissipation. The main products include heat pipes, vapor chambers, etc., which have large load capacity, good isothermal performance, stable performance, low cost and long life. Long and other advantages can basically meet the heat dissipation requirements of some high-power electronic products, but it is still difficult to solve the thermal control problem of high-power density electronic products

In order to further enhance the heat transfer capability of phase-change cooling devices, researchers and related companies have focused on full-cavity phase-change heat sinks, which integrate heat transfer and heat dissipation. The perfusion volume of high-quality working fluid is larger than that of heat pipes and vapor chambers, and the heat exchange structures are all immersed in liquid working fluid. At the same time, under high-power and high-power-density heat flow, the temperature difference between the heat source and the internal steam is generally large, which becomes an influence The main factors of heat sink performance

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