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A modified hexagonal boron nitride powder and its preparation method and application

A hexagonal boron nitride, modified technology, used in chemical instruments and methods, inorganic pigment treatment, fibrous fillers, etc., can solve the problems of low thermal conductivity, high processing cost, large wear, etc., and achieve excellent bending strength and performance. boosted effect

Active Publication Date: 2021-02-09
HOHAI UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the hardness of silica filler is high, and the Mohs hardness is 6-7. During the drilling and milling process of PCB, the drilling and milling cutters are greatly worn, the processing cost is high, and the thermal conductivity is low, which cannot meet the needs of electronic equipment integration. High thermal conductivity requirements necessary for high-frequency and high-frequency

Method used

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  • A modified hexagonal boron nitride powder and its preparation method and application
  • A modified hexagonal boron nitride powder and its preparation method and application
  • A modified hexagonal boron nitride powder and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0037] (1) Measure 200ml of ethanol, weigh 4g of hexagonal boron nitride (HBN), mix the two and stir with a glass rod, seal with plastic wrap and perform ultrasonic dispersion for 20min;

[0038] (2) Ultrasonic dispersion is taken out and stirred to prevent the powder from sinking to the bottom, then transferred to a three-necked flask, 82ml of deionized water is added, and the mixed solution is heated and stirred with a magnetic stirrer with a water bath;

[0039] (3) When the temperature of the mixed solution rises to 40°C, titrate tetraethyl orthosilicate (TEOS) at a rate of 0.0025ml / s. After the titration, continue stirring and heating for a period of time (about 10 minutes); the amount of TEOS is 9ml.

[0040] (4) After the reaction, the mixture was suction filtered and the powder was collected, and dried in a blast oven at a temperature of 110°C.

[0041] The prepared powder is analyzed and observed by means of X-ray diffraction, scanning electron microscope, infrared s...

Embodiment 2

[0042] Embodiment 2 Preparation of modified hexagonal boron nitride powder

[0043] (1) Measure 400ml ethanol, 36mL TEOS, 15ml ammonia water, weigh 4g HBN, mix the two and stir with a glass rod, seal with plastic wrap and perform ultrasonic dispersion for 20min;

[0044] (2) Ultrasonic dispersion is taken out and stirred to prevent the powder from sinking to the bottom, then transferred to a three-necked flask, adding 75ml of deionized water and 15ml of ammonia water, and heating and stirring the mixed solution with a magnetic stirrer with a water bath;

[0045] (3) When the temperature of the mixed solution rises to 50°C, titrate tetraethyl orthosilicate at a rate of 0.0020ml / s, and continue stirring and heating for a period of time after the titration is completed;

[0046](4) After the reaction, the mixture was suction filtered and the powder was collected, and dried in a blast oven at 120°C.

[0047] The prepared powder is analyzed and observed by means of X-ray diffracti...

Embodiment 3

[0049] Embodiment 3 Preparation of modified hexagonal boron nitride powder

[0050] (1) Measure 400ml of ethanol, 36mL of TEOS, 30mL of ammonia water, weigh 4g of HBN, mix the ethanol and HBN and stir with a glass rod, seal with plastic wrap and perform ultrasonic dispersion for 20 minutes;

[0051] (2) Ultrasonic dispersion is taken out and stirred to prevent the powder from sinking to the bottom, then transferred to a three-necked flask, adding 62ml of deionized water and 30ml of ammonia water, and heating and stirring the mixed solution with a magnetic stirrer with a water bath;

[0052] (3) When the temperature of the mixture rises to 60°C, titrate TEOS at a rate of 0.0015ml / s. After the titration, continue to stir and heat for a period of time (about 10 minutes); TEOS36mL;

[0053] (4) After the reaction, the mixture was suction filtered and the powder was collected, and dried in a blast oven at a temperature of 130°C.

[0054] The prepared powder is analyzed and observe...

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Abstract

The invention discloses a sol-gel method, using tetraethyl orthosilicate (TEOS) as a precursor, ammonia as a catalyst, and coating SiO on HBN through a hydrolysis reaction. 2 Preparation of HBN@SiO 2 The core-shell filler is modified hexagonal boron nitride powder. The invention also discloses the application of the modified hexagonal boron nitride powder, the HBN@SiO 2 The core-shell type filler is dispersed in the resin matrix, and after steps such as cloth gluing, cutting and lamination with copper foil, etc., it is placed in a vacuum hot press and pressed to obtain a copper clad laminate. HBN@SiO prepared by the method of the present invention 2 The core-shell powder material has excellent performance and has a very good application prospect as a high-performance copper-clad laminate filler.

Description

technical field [0001] The invention belongs to the field of material processing engineering and relates to a modified hexagonal boron nitride and its preparation method and application. The application specifically relates to a modified hexagonal boron nitride powder used as a filler for copper clad laminates. Background technique [0002] Copper-clad laminates are generally made of reinforced materials impregnated with resin, one or both sides covered with copper foil, and hot-pressed as a plate-like material. It is the basic material for making printed circuit boards (Printed Circuit Board, PCB). It consists of an insulating layer in the middle and copper foil covering both sides of the insulating layer. In recent years, with the increasing integration and high frequency of printed circuits, the demand for copper clad laminates with high thermal conductivity and high stability and excellent comprehensive performance is increasing day by day. At present, the most effectiv...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08K3/38C09C1/00C09C3/06C08L71/12C08K9/10
CPCC08K3/38C08K9/10C08K2003/385C09C1/00C09C3/063C08L71/12
Inventor 张建峰张维维王笑影卜凡葛梦妮于浩
Owner HOHAI UNIV
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