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Resin-coated copper foil, and sprinted wiring board using resin-coated copper foil

A technology of resin copper foil and copper foil, applied in printed circuit, printed circuit, printed circuit manufacturing, etc., can solve the problems of toxic cyanide, difficulty in ensuring the adhesive strength of the resin layer, poor water resistance and heat resistance of the resin, etc.

Inactive Publication Date: 2007-10-24
MITSUI MINING & SMELTING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, when a printed circuit board is manufactured using a resin-attached copper foil with a resin layer formed from the resin composition, the peel strength between the cured resin layer and the copper foil may drop significantly, and it is difficult to secure the bond between the copper foil and the cured resin. Adhesion strength between layers
[0011] In the case of adding a phosphorus compound, it is pointed out that the water resistance and heat resistance of the resin will deteriorate, and there is a problem that the reliability of the printed circuit board will decrease
In the case of using a nitrogen-containing resin as a curing agent for epoxy resins, since a resin composition containing a large amount of nitrogen is used, there is the same problem as when using a halogen compound, that is, when the waste is incinerated, there will be Toxic cyanide or NO as the subject of restricted emissions x

Method used

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  • Resin-coated copper foil, and sprinted wiring board using resin-coated copper foil
  • Resin-coated copper foil, and sprinted wiring board using resin-coated copper foil
  • Resin-coated copper foil, and sprinted wiring board using resin-coated copper foil

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0032] Bisphenol A type epoxy resin (trade name EPOMIK R-140 (manufactured by Mitsui Chemicals Co., Ltd.)) as b. component epoxy resin described in the claims and as c. component described in claim 1 Epoxy resin (trade name: NC-3000P (manufactured by Nippon Kayaku Co., Ltd.)) in which R is a glycidyl group was mixed in a weight ratio of 40:60.

[0033] Then, add in above-mentioned epoxy resin with respect to above-mentioned epoxy resin be the dimethyl formamide solution of 25% dicyandiamide as epoxy resin curing agent of 6 parts by weight, 1 part by weight of dicyandiamide as epoxy resin hardening accelerator Curezol 2P4MZ (manufactured by Shikoku Chemical Industry Co., Ltd.) as an additive, and the mixture was dissolved in dimethylformamide to form a solution with a solid content of 50% by weight (the material obtained at this stage is called "epoxy resin compound") .).

[0034] Add therein the polyvinyl acetal resin (trade name Denka Butylal 5000A (electrical) that has cros...

Embodiment 2

[0039] A resin-coated copper foil, a cured resin film, and a multilayer printed circuit board were produced in the same manner as in Example 1 except that the epoxy resin compound and epoxy resin curing agent used in Example 1 were changed as follows.

[0040] Bisphenol A type epoxy resin (trade name EPOMIK R-140 (manufactured by Mitsui Chemicals)) and novolak type epoxy resin (trade name EPPN-201 (trade name) as b. component epoxy resin described in the claims Nippon Kayaku Co., Ltd.) were mixed in a weight ratio of 50:50.

[0041] Then, a phenolic compound (hereinafter referred to as "compound A") is used as an epoxy resin curing agent, that is, component c in which R is H in the claim. The above-mentioned epoxy resin is mixed with compound A to make epoxy resin weight: compound A weight=40:60.

[0042] Also add the epoxy resin hardening accelerator of the trade name Curezol 2P4MZ (manufactured by Shikoku Chemical Industry Co., Ltd.) of 1 weight part in epoxy resin, it is d...

Embodiment 3

[0044] Except that the R of c. component described in the claims is the phenolic compound (compound A) that H is used as the epoxy resin curing agent of embodiment 1, makes epoxy resin weight through mixing: compound A weight=50: Except 50, all the other are identical with embodiment 1.

[0045] That is, bisphenol A type epoxy resin (trade name EPOMIK R-140 (manufactured by Mitsui Chemicals Co., Ltd.)) as the b. component epoxy resin in the claims and the c. component in the claims Epoxy resin (trade name NC-3000P (manufactured by Nippon Kayaku Co., Ltd.)) in which R is a glycidyl group was mixed at a weight ratio of 40:60.

[0046] Add 50 parts by weight of Compound A as an epoxy resin curing agent to the above epoxy resin. Also add 1 weight part of Curezol 2P4MZ (manufactured by Shikoku Chemical Industry Co., Ltd.) as an epoxy resin curing accelerator to the above-mentioned epoxy resin, and they are dissolved in dimethylformamide to form a solution with a solid content of 5...

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Abstract

The invention provides a copper foil with resin for the production of printed wiring boards which is excellent in the balance among flame retardance, flowability of resin, water resistance and peel strength, specifically a copper foil having a resin layer on one surface of the copper foil, characterized in that the resin layer is made from a resin composition comprising (a) 5 to 30 parts by weight of a composition consisting of both a polymer having crosslinking functional groups in the molecule and a crosslinking agent therefor, (b) 5 to 30 parts by weight of an epoxy resin which is liquid at room temperature, and (c) 40 to 90 parts by weight of a compound having a structure represented by the general formula (I) wherein R is H or (II).

Description

[0001] Industrial application field [0002] The present invention relates to a resin-coated copper foil and a printed circuit board using the resin-coated copper foil. Background technique [0003] Copper foil with resin is widely used in the manufacture of printed circuit boards because its resin layer constitutes the insulating layer of printed circuit boards that do not contain skeleton materials such as glass cloth represented by glass-epoxy prepregs. The resin layer of the resin-attached copper foil used so far is mostly composed of a resin composition containing epoxy resin as the main component. [0004] The background of using this resin composition is that the resin composition has good electrical characteristics and insulation reliability. Moreover, since the insulating layer of the printed circuit board formed of resin-attached copper foil does not contain a skeleton material such as glass cloth, the hole finish is good when the through hole is formed by laser pro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/00C08L101/00H05K1/03B32B15/08C08G59/62C08L61/10C09D163/00H05K3/46
CPCH05K3/4626H05K3/4655H05K2201/0358H05K3/4652B32B15/08C09D163/00H05K2201/0133C08L63/00Y10T428/31529C08L2666/02
Inventor 佐藤哲朗浅井务松岛敏文
Owner MITSUI MINING & SMELTING CO LTD
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