Femtosecond laser direct writing method of copper antioxidant microstructure and copper ion ink

A technology of femtosecond laser and copper ions, which is applied in the fields of optics, ink, and optomechanical equipment, can solve the problems of cumbersome flexible electrode manufacturing technology, unsatisfactory conductivity of carbon nanomaterials, and high cost of precious metal inks, achieving small thermal effects, The preparation process is simple and the effect of improving conductivity

Active Publication Date: 2019-01-25
BEIHANG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, inkjet printing and printing of metal and carbon nanomaterial inks are the most common methods for conveniently manufacturing flexible electrodes. However, the cost of precious metal ink is high, and the conductivi

Method used

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  • Femtosecond laser direct writing method of copper antioxidant microstructure and copper ion ink
  • Femtosecond laser direct writing method of copper antioxidant microstructure and copper ion ink
  • Femtosecond laser direct writing method of copper antioxidant microstructure and copper ion ink

Examples

Experimental program
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preparation example Construction

[0035] (1) Preparation of copper ion ink: the main material components of copper ion ink are copper salt, polyvinylpyrrolidone (PVP), polyethylene glycol (PEG), etc., which are mixed and treated with an ultrasonic cell disruptor.

[0036] (2) Preparation of copper ion film: After the substrate to be used is cleaned with organic solvent and soaked in deionized water, copper ion ink is drip-coated or spin-coated on the cleaned substrate, and dried to obtain a copper film with a thickness of 100-500 μm. ion membrane.

[0037] (3) Femtosecond laser direct writing copper wire: build a femtosecond laser optical path, use femtosecond laser to directly write electrodes on the film, and use a computer-controlled high-precision two-dimensional mobile platform to obtain the expected circuit.

[0038] (4) Removing the area not irradiated by the femtosecond laser: washing the substrate with an organic solvent and water in sequence, and finally obtaining a substrate printed with a circuit. ...

example 1

[0050] Add 0.97g of copper nitrate, 0.1g of polyvinylpyrrolidone (PVP), and 0.2g of polyethylene glycol (PEG) into 10ml of deionized water, treat it with an ultrasonic cell breaker for 15min, and drop-coat it on the cleaned polycarbonate On the resin (PC) plastic substrate, after drying, a film with a thickness of about 150 μm is formed. see Figure 2-4 , using 800nm ​​femtosecond laser 3 for laser direct writing, the laser power is 1W, and the scanning speed is 25μm / s, and finally a conductive copper wire 4 with a resistivity of 1×10-5Ω·m is obtained. If the laser power is increased to 2.5W and the scanning speed remains unchanged, a conductive copper wire with a resistivity of 1×10-3Ω·m can be obtained.

example 2

[0052] Add 1.25g of copper nitrate, 0.1g of polyvinylpyrrolidone (PVP), and 0.2g of polyethylene glycol (PEG) into 10ml of deionized water, treat it with an ultrasonic cell breaker for 15min, and drop-coat it onto the cleaned glass substrate. On the chip, after drying, a film with a thickness of about 230 μm is formed. 800nm ​​femtosecond laser is used for laser direct writing, the laser power is 1W, and the scanning speed is 25μm / s, and finally a conductive copper wire with a resistivity of 5×10-6Ω·m is obtained.

[0053] In an embodiment, the resistivity of the obtained copper microstructure can be controlled by adjusting parameters such as the repetition frequency, power, and scanning speed of the femtosecond laser, and the width of the copper microstructure can be controlled by adjusting the spot size. The energy of the laser under different parameters With different densities, there will be differences in the amount and connection degree of the reduced copper nanoparticle...

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Abstract

The invention provides a femtosecond laser direct writing method of copper antioxidant microstructure and copper ion ink, A method for fabricate a microelectronic device by directly writing a cop microstructure on a copper ion thin film with a femtosecond laser includes that steps of: (a) providing a copper ion ink comprising a copper salt, a polyvinylpyrrolidone, and a long chain alcohol, whereinthe solvent is water; (b) preparing a copper ion film: aft that substrate to be washed by an organic solvent and soaked in deionized wat, the copper ion ink is dripped or spin-coated on the cleaned substrate, and the thickness is 100 DEG C after oven drying; 500 [mu]m copper ion film; (c) directly writing that copper wire using a femtosecond laser direct write device so as to direct write of thedesired electrode circuit on the thin film; (d) removing that area not irradiated by the femtosecond lase: cleaning the substrate with organic solvent and water in turn, and finally obtaining the substrate printed with the electrode circuit. The method of the invention and the copper ion ink can simplify the manufacturing process of the microelectronic device, reduce the manufacturing cost and improve the product performance.

Description

technical field [0001] The present invention relates to laser machining microelectronic devices and the ink used therefor. Background technique [0002] Laser direct writing is such a technology: using a variable intensity laser beam to implement variable dose exposure on the resist material on the surface of the substrate, and forming the required relief profile on the surface of the resist layer after development. The basic working principle of the laser direct writing system is that the computer controls the high-precision laser beam scanning, and directly exposes and writes any designed graphics on the photoresist, so that the designed graphics are directly transferred to the mask. Laser direct writing can directly write multi-step and continuous phase relief microstructures on the surface of the photoresist. Compared with the binary optical method, the process is simple, avoiding the overlay alignment between multiple sets of masks, and improving the Machining accuracy...

Claims

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Application Information

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IPC IPC(8): G03F7/20C09D11/52
CPCC09D11/52G03F7/2053G03F7/2055
Inventor 彭鹏李立航郭伟朱颖康慧曲平
Owner BEIHANG UNIV
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