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Thin-film capacitor encapsulating epoxy resin

A film capacitor and epoxy resin technology, applied in the direction of epoxy resin glue, adhesive type, adhesive additives, etc., can solve the problems of easy aging and cracking, affecting the service life of capacitors, etc., and achieve long service life, not easy to crack, The effect of improving product quality

Inactive Publication Date: 2019-01-08
安徽长容电子有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The existing capacitors are potted with epoxy resin, which is prone to aging and cracking during use, which affects the service life of the capacitor

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0013] An epoxy resin for potting film capacitors, comprising the following components in parts by weight: 35 parts of epoxy resin, 3 parts of glass fiber, 1 part of reactive diluent, 50 parts of fused silica powder, 3 parts of aluminum hydroxide, and 2 parts of white carbon black 2 parts, 2 parts of curing agent, 0.01 part of dimethylbenzylamine, 5 parts of high-performance filler, 0.3 part of aluminum hydroxide; the glass fiber is a 3-5mm long broken mat.

[0014] The preparation method of the potting epoxy resin of described a kind of film capacitor, comprises the following steps:

[0015] In the first step, add 35 parts of epoxy resin and 3 parts of glass fiber into the mixer and stir at a low speed for 2 minutes, then add 1 part of active diluent, 50 parts of fused silica powder, 3 parts of aluminum hydroxide and 2 parts of white carbon black into the mixer Stir at medium and low speed for 5 minutes. After the stirring is completed, an epoxy resin mixture is formed and st...

Embodiment 2

[0019] A potting epoxy resin for film capacitors, comprising the following components in parts by weight: 40 parts of epoxy resin, 4 parts of glass fiber, 2 parts of reactive diluent, 55 parts of fused silica powder, 4 parts of aluminum hydroxide, 3 parts of white carbon black 3 parts, 3 parts of curing agent, 0.02 part of dimethylbenzylamine, 6 parts of high-performance filler, 0.5 part of aluminum hydroxide; the glass fiber is a 3-5 mm long broken mat.

[0020] The preparation method of the potting epoxy resin of described a kind of film capacitor, comprises the following steps:

[0021] The first step is to add epoxy resin and glass fiber to the blender and stir at low speed for 2 minutes, then add active diluent, fused silica powder, aluminum hydroxide, and white carbon black into the blender and stir at low speed for 5 minutes. After the stirring is completed, a ring is formed. Storage of oxygen resin mixture;

[0022] Step 2: Add dimethylbenzylamine, high-performance fi...

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PUM

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Abstract

The invention discloses a thin-film capacitor encapsulating epoxy resin which is characterized by comprising the following components in parts by weight: 35-40 parts of epoxy resin, 3-4 parts of glassfiber, 1-2 parts of a reactive diluent, 50-55 parts of a fused silicon powder, 3-4 parts of aluminium hydroxide, 2-3 parts of white carbon black, 2-3 parts of a curing agent, 0.01-0.02 parts of dimethylbenzylamine, 5-6 parts of a high performance filler and 0.3-0.5 parts of the aluminium hydroxide. The invention has the advantages of low probability of cracking, long product service life and improved product quality.

Description

technical field [0001] The invention relates to the technical field of film capacitors, in particular to a potting epoxy resin for film capacitors. Background technique [0002] Film capacitors use metal foil as an electrode, which is overlapped with plastic films such as polyethylene, polypropylene, polystyrene or polycarbonate from both ends, and then wound into a cylindrical capacitor. The ends are sealed with epoxy resin. [0003] Epoxy resin potting glue is poured into the device manually or mechanized, and then cured at room temperature or heated to form it, so as to achieve waterproof, moisture-proof and dust-proof, insulation and confidentiality, and improve the resistance to external cold and heat shock and vibration. Purpose. Therefore, the epoxy resin potting compound needs to achieve excellent electrical properties, good mechanical properties, good heat resistance, low moisture absorption rate and thermal expansion coefficient, and sometimes needs to meet the r...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J163/00C09J11/04
CPCC08K2003/2227C09J11/04C09J163/00C08K7/14C08K3/22C08K3/36
Inventor 章阳华胡姗李伟
Owner 安徽长容电子有限公司
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