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Room temperature cured wave-absorbing adhesive and preparation method thereof

A room temperature curing, adhesive technology, applied in the direction of adhesives, adhesive additives, non-polymer organic compound adhesives, etc., can solve problems such as information leakage, improve adhesive strength, low production cost, excellent adhesion The effect of connection performance

Inactive Publication Date: 2019-01-08
DALIAN DONGSHIN MICROWAVE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The present invention mainly uses the addition of wave-absorbing materials in the adhesive, so as to not only bond electronic components, but also absorb and isolate electromagnetic interference between electronic components, electromagnetic pollution of electronic components to the outside world, and information generated by clicking on the original components. Leakage and other issues

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0052] 100 parts of the epoxy E51 resin, 100 parts of the carbonyl iron, 20 parts of allyl glycidyl ether and 2 parts of the KH-5602 are packed into component A after stirring and mixing with a kneader;

[0053] 10 parts of the diethylenetriamine and 2 parts of the 2, 4, 6 tris (dimethylaminomethyl) phenol are dispersed, stirred and mixed with a disperser, and then packaged into component B;

[0054] Among them, the viscosity of epoxy E51 resin is 11000mPa·s; the particle size of carbonyl iron powder is 3 microns, and the viscosity of diethylenetriamine is 1000mPa·s.

[0055] When using, fully mix the AB components and spread the glue evenly on the materials to be bonded during the operation period, and cure it at room temperature for 24 hours.

[0056] Using the adhesive obtained in this embodiment: the bonding effect is good, but the curing time is fast and the operation period is short.

Embodiment 2

[0058] 100 parts of the epoxy E51 resin, 100 parts of the barium titanate, 20 parts of allyl glycidyl ether and 2 parts of the KH-550 were mixed with a kneader and packaged into component A;

[0059] 50 parts of the polyamide 650 and 2 parts of the 2, 4, 6 tris(dimethylaminomethyl)phenol are dispersed, stirred and mixed with a disperser, and then packaged into component B;

[0060] Among them, the viscosity of epoxy E51 resin is 11000mPa·s; the particle size of barium titanate is 3 microns, and the viscosity of polyamide 650 is 50000mPa·s.

[0061] When using, fully mix the AB components and spread the glue evenly on the materials to be bonded during the operation period, and cure at room temperature for 24 hours.

[0062] Using the adhesive obtained in this example: the bonding effect is average, the replacement of the coupling agent leads to a decrease in the strength and adhesion of the colloid body, and the replacement of the wave-absorbing powder results in a decrease in ...

Embodiment 3

[0064] 100 parts of the epoxy E51 resin, 100 parts of the carbonyl iron, 20 parts of allyl glycidyl ether and 2 parts of the KH-560 are mixed with a kneader and then packaged into component A;

[0065] 50 parts of the polyamide 650 and 2 parts of the 2-methylimidazole are dispersed, stirred and mixed with a disperser, and then packaged into component B;

[0066] Among them, the viscosity of epoxy E51 resin is 11000mPa·s; the particle size of carbonyl iron powder is 3 microns, and the viscosity of polyamide 650 is 50000mPa·s.

[0067] When using, fully mix the AB components and spread the glue evenly on the materials to be bonded during the operation period, and cure at room temperature for 24 hours.

[0068] The adhesive obtained in this embodiment: the adhesive performance is good, but the curing time is prolonged after the catalyst is replaced.

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Abstract

The invention relates to the technical field of adhesion and electromagnetic wave absorption, specifically to adhesion of electron components, in particular to an adhesive with a wave absorbing function and a preparation method thereof. The adhesive is prepared by fully mixing 100 parts of a resin matrix, 50-400 parts of wave absorbing powder, 50-100 parts of a curing agent, 1-10 parts of a coupling agent, 0-60 parts of a diluent and 0.5-5 parts of a catalyst. The preparation method comprises the following steps: stirring and mixing the resin matrix, the wave absorbing powder, the coupling agent and the diluent in parts by weight with a kneading machine to form a component A; dispersing the curing agent and the catalyst in parts by weight with a dispersant to form a component B; fully mixing the component A with the component B during use, uniformly smearing the mixture to an adhesive face, and curing the adhesive face for 24 hours at room temperature. Therefore, the problem that in the prior art, a common adhesive does not have the function of absorbing electromagnetic waves is solved.

Description

technical field [0001] The invention relates to the technical field of bonding and electromagnetic wave absorption, in particular to the bonding of electronic components, in particular to an adhesive with a wave-absorbing function and a preparation method thereof. Background technique [0002] With the rapid development of information technology and the continuous improvement of electromagnetic theory, electromagnetic waves, as the carrier of information transmission, enrich all aspects of our production, life and society with its high speed and intelligence. However, the miniaturization and high integration of electronic components make the electromagnetic environment we live in more and more complex, causing electromagnetic interference, electromagnetic pollution and information leakage and other hazards. [0003] The use of electromagnetic wave absorbing materials can solve electromagnetic interference problems and reduce electromagnetic pollution. Adhesives for bonding a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J4/06C09J11/04C09J11/06C09J11/08
CPCC09J4/06C09J11/04C09J11/06C09J11/08
Inventor 陈坚曲景娟刘惠艳刘孟曦辛淑杰
Owner DALIAN DONGSHIN MICROWAVE TECH
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