Electrically conductive die bond adhesive applied to packaging large-size chips, method for preparing electrically conductive die bond adhesive and application thereof

A technology of chip packaging and bonding glue, which is applied in the direction of conductive adhesives, electric solid devices, semiconductor/solid device components, etc.

Active Publication Date: 2019-01-04
深圳广恒威科技有限公司
View PDF5 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The conductive adhesive film prepared by this patent is generally suitable for small-size chip packaging, but for large-size chip packaging...

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Electrically conductive die bond adhesive applied to packaging large-size chips, method for preparing electrically conductive die bond adhesive and application thereof
  • Electrically conductive die bond adhesive applied to packaging large-size chips, method for preparing electrically conductive die bond adhesive and application thereof
  • Electrically conductive die bond adhesive applied to packaging large-size chips, method for preparing electrically conductive die bond adhesive and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036] A method for preparing a conductive die-bonding adhesive applied to large-scale chip packaging, the specific steps are as follows: 8 parts of hydroxyl-terminated polybutadiene acrylonitrile HTBN, 6 parts of thermoplastic resin SG-600TEA, 0.5 part of conductive accelerator 8- Hydroxyquinoline, 4 parts of liquid phenolic resin MEH-8000H are mixed evenly, and then ground twice by a three-roller machine, and then 5 parts of closed latent curing agent SBN-70D are added, mixed evenly, vacuumed for 30 minutes, and 18.75 parts of silver powder SA are added -0201, 18.75 parts of silver powder EA-0001, mix well, vacuum 30min, then add 1.0 parts of coupling agent A-187, mix well, then add the remaining 18.75 parts of silver powder SA-0201, 18.75 parts of silver powder EA-0001, mix Evenly, vacuum for 30min.

[0037] The conductive crystal-bonding adhesive solution is prepared into a roll-shaped film through a coating device.

Embodiment 2

[0039]A method for preparing a conductive die-bonding adhesive applied to large-scale chip packaging, the specific steps are as follows: 2 parts of hydroxyl-terminated polybutadiene acrylonitrile HTBN, 20 parts of thermoplastic resin SG-600TEA, 0.5 parts of conductive accelerator 8- Hydroxyquinoline, 1 part of liquid phenolic resin MEH-8000H, mix well, then grind 2 times through a three-roll machine, then add 10 parts of closed latent curing agent SBN-70D, mix well, vacuum for 30 minutes, add 12.5 parts of silver powder SA-0201, 25.0 parts of silver powder EA-0001, mix well, vacuumize for 30min, then add 1.0 parts of coupling agent A-187, mix well, then add the remaining 12.5 parts of silver powder SA-0201, 25.0 parts of silver powder EA-0001, Mix well and vacuumize for 30min.

[0040] The conductive crystal-bonding adhesive solution is prepared into a roll-shaped film through a coating device.

Embodiment 3

[0042] A method for preparing conductive die-bonding adhesive applied to large-scale chip packaging, the specific steps are as follows: 10 parts of hydroxyl-terminated polybutadiene acrylonitrile HTBN, 5 parts of thermoplastic resin SG-600TEA, 0.5 parts of conductive accelerator 8- Hydroxyquinoline, mix well, then grind 2 times through a three-roller, then add 2 parts of closed latent curing agent SBN-70D, mix well, vacuumize for 30min, add 18.75 parts of silver powder SA-0201, 18.75 parts of silver powder EA- 0001, mix evenly, vacuumize for 30min, then add 0.5 parts of coupling agent A-187, mix well, then add the remaining 18.75 parts of silver powder SA-0201, 18.75 parts of silver powder EA-0001, mix well, vacuumize for 30min.

[0043] The conductive crystal-bonding adhesive solution is prepared into a roll-shaped film through a coating device.

[0044] Table 1 shows the main performance parameters of the conductive adhesive films made from the conductive die-bonding adhesiv...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses electrically conductive die bond adhesive applied to packaging large-size chips, a method for preparing the electrically conductive die bond adhesive and application thereof. The electrically conductive die bond adhesive is made from hydroxyl terminated polybutadiene acrylonitrile, thermoplastic resin, liquid phenolic resin, blocked isocyanate latent curing agents, couplingagents, electric conductivity accelerators and electrically conductive materials. The electrically conductive die bond adhesive, the method and the application have the advantages that electrically conductive adhesive films prepared from the electrically conductive die bond adhesive are excellent in toughness and flexibility, and the electrically conductive die bond adhesive can be applied to packaging the large chips (with the chip sizes larger than or equal to 10*10 mm) and packaging chips with high electric conductivity (the volume resistivity lower than or equal to 0.002 ohm-cm).

Description

technical field [0001] The invention relates to the technical field of conductive materials, in particular to a conductive die-bonding adhesive used in large-size chip packaging, and also to a preparation method and application of the adhesive. Background technique [0002] With the development of social science and technology, human beings' pursuit of high-tech products, smart phones, electronic products, etc. is becoming more and more intense. The requirements for product and technology development are getting higher and higher, and products are constantly required to achieve more functions in smaller and smaller dimensions, prompting semiconductor packaging experts to look for thinner, smaller, and higher packaging density reliability solutions solutions, and solving such solutions lies in providing the materials used in the fabrication of ultra-small semiconductor devices. [0003] Traditional chip packaging connections usually use materials such as lead-tin solder or c...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
IPC IPC(8): C09J175/14C09J9/02H01L23/488
CPCC08K2003/0806C09J9/02C09J175/14H01L23/488C08K3/08
Inventor 艾瑞克·王毛志平
Owner 深圳广恒威科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap