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Sn-Cu-Ni lead-free solder containing Ga and Nd

A sn-cu-ni, lead-free solder technology, applied in the direction of welding/cutting media/materials, metal processing equipment, welding equipment, etc., can solve the problems of short circuit of electronic components and reduce the reliability of brazed joints, etc. Achieve the effect of uniform structure, inhibiting the growth of tin whiskers, and good wetting performance

Active Publication Date: 2018-12-21
NANJING UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the process of use, it is found that with the prolongation of time, the thickness of the intermetallic compound at the brazing interface of the Sn-Cu-Ni solder with rare earth elements has a tendency to gradually increase and thicken, especially as the brazing joint increases. Over time, it is easy to sprout tin whiskers that can cause short circuits in electronic components, which will greatly reduce the "reliability" of soldered joints

Method used

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  • Sn-Cu-Ni lead-free solder containing Ga and Nd
  • Sn-Cu-Ni lead-free solder containing Ga and Nd
  • Sn-Cu-Ni lead-free solder containing Ga and Nd

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Sn-Cu-Ni lead-free solder containing Ga and Nd, including: 0.45% Cu, 0.5% Ni, 0.003% As, 0.020% Sb, 0.4% Ga, 0.04% Nd by mass percentage , the balance being Sn. The mass ratio of Ga and Nd satisfies Ga:Nd=10:1.

[0028] The solidus temperature of the "Sn-Cu-Ni lead-free solder containing Ga and Nd" obtained by the above-mentioned composition ratio is about 210°C, and the liquidus temperature is about 218°C (both taking into account experimental errors). Cooperating with commercially available RMA brazing flux, it has excellent wetting performance on the copper plate, and the tensile strength of the brazing seam reaches 45MPa±5MPa.

[0029] image 3 It shows that after aging for 720 hours (30 days), there is no obvious change in the intermetallic compound at the interface of the Sn-Cu-Ni lead-free solder brazing seam containing Ga and Nd, and there is no tin whisker initiation, indicating that the solder joint (brazing seam) is reliable. performance has been significant...

Embodiment 2

[0031] Sn-Cu-Ni lead-free solder containing Ga and Nd, including: 1.1% Cu, 0.05% Ni, 0.008% As, 0.014% Sb, 0.6% Ga, 0.06% Nd by mass percentage , the balance being Sn. The mass ratio of Ga and Nd satisfies Ga:Nd=10:1.

[0032] The solidus temperature of the "Sn-Cu-Ni lead-free solder containing Ga and Nd" obtained by the above-mentioned composition ratio is about 210°C, and the liquidus temperature is about 218°C (both taking into account experimental errors). Cooperating with commercially available RMA brazing flux, it has excellent wetting performance on the copper plate, and the tensile strength of the brazing seam reaches 45MPa±5MPa.

[0033] image 3 It shows that after aging for 720 hours (30 days), there is no obvious change in the intermetallic compound at the interface of the Sn-Cu-Ni lead-free solder brazing seam containing Ga and Nd, and there is no tin whisker initiation, indicating that the solder joint (brazing seam) is reliable. performance has been significa...

Embodiment 3

[0035] Sn-Cu-Ni lead-free solder containing Ga and Nd, including: 0.7% Cu, 0.15% Ni, 0.005% As, 0.016% Sb, 0.5% Ga, 0.05% Nd by mass percentage , the balance being Sn. The mass ratio of Ga and Nd satisfies Ga:Nd=10:1.

[0036] The solidus temperature of the "Sn-Cu-Ni lead-free solder containing Ga and Nd" obtained by the above-mentioned composition ratio is about 210°C, and the liquidus temperature is about 218°C (both taking into account experimental errors). Cooperating with commercially available RMA brazing flux, it has excellent wetting performance on the copper plate, and the tensile strength of the brazing seam reaches 45MPa±5MPa.

[0037] image 3 It shows that after aging for 720 hours (30 days), there is no obvious change in the intermetallic compound at the interface of the Sn-Cu-Ni lead-free solder brazing seam containing Ga and Nd, and there is no tin whisker initiation, indicating that the solder joint (brazing seam) is reliable. performance has been significa...

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Abstract

The invention discloses a Sn-Cu-Ni lead-free solder containing Ga and Nd, and belongs to the field of soldering materials of metal materials. The Sn-Cu-Ni lead-free solder comprises, by mass, 0.45-1.1% of Cu, 0.05-0.5% of Ni, 0.003-0.008% of As, 0.014-0.020% of Sb, 0.4-0.6% of Ga, 0.04-0.06% of Nd, and the balance Sn, wherein the mass ratio of Ga to Nd is 10:1. The solder has good wetting performance, growth of tin whiskers of a soldering joint can be effectively inhibited, the reliability of the soldering joint is greatly improved, and the Sn-Cu-Ni lead-free solder can be used for wave soldering and reflow soldering of components in the electronic industry.

Description

technical field [0001] The invention relates to a Sn-Cu-Ni lead-free solder containing Ga and Nd, which belongs to the technical field of brazing materials in the field of metal materials and metallurgy. Background technique [0002] The traditional Sn-Pb solder is widely used in the field of electronic assembly and packaging due to its good wettability, low cost, and low melting point. However, because Pb is harmful to the environment and the human body, the WEEE directive and RoHS Directive and the Chinese government's "Decree No. 39" under strict restrictions, many electronic products have to use lead-free solder. The Sn-based lead-free solders studied today mainly include Sn-Ag, Sn-Ag-Cu, Sn-Zn, Sn-Cu, Sn-Bi, etc. Sn-Cu alloy solder is widely used because of its low cost and good thermal fatigue resistance, especially in the case of wave soldering, its eutectic melting point reaches 227 ° C, but its wettability and mechanical properties are not as good as other lead-fre...

Claims

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Application Information

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IPC IPC(8): B23K35/26
CPCB23K35/262
Inventor 薛鹏邹阳王克鸿裴夤崟孙华为
Owner NANJING UNIV OF SCI & TECH
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