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Polyimide high-temperature dielectric composite film and preparation method thereof

A technology of polyimide and composite film, which is applied in the field of polyimide high-temperature dielectric composite film and its preparation, can solve problems such as insufficient high-temperature dielectric properties, and achieve excellent mechanical properties, low dielectric loss, high The effect of dielectric constant

Active Publication Date: 2018-12-14
WUHAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The purpose of the present invention is to solve the problem that the high-temperature dielectric properties of existing polyimide film materials are not good enough, and to provide a polyimide composite film filled with molybdenum disulfide nanosheets and hexagonal boron nitride nanosheets. material, the film material has excellent flexibility, high temperature dielectric properties and thermal stability

Method used

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  • Polyimide high-temperature dielectric composite film and preparation method thereof
  • Polyimide high-temperature dielectric composite film and preparation method thereof
  • Polyimide high-temperature dielectric composite film and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0033] Preparation of Hexagonal Boron Nitride Nanosheets / Polyimide Binary Composite Film

[0034] 1) Weigh h-BN and urea at a mass ratio of 1:100, disperse them in 100mL water and stir evenly. The resulting mixture was sonicated in a sonicator for 8 hours, and then centrifuged at 3000 rpm for 20 min. The supernatant was filtered with a 220 nm filter membrane, and the obtained solid matter was uniformly dispersed with deionized water, and then filtered again. After three times of dispersion (water dispersion) and filtration (same filter membrane), the few-layer BNNS on the filter paper was collected and dried in vacuum at 70 °C for 8 h.

[0035] 2) Feed according to the molar ratio of PMDA:ODA of 1.002:1, dissolve 10mmol ODA in NMP solvent, stir until ODA is completely dissolved, weigh 10.02mmol PMDA, add it in batches within 30min -in the four-necked flask of the NMP mixed solution, and then place the four-necked flask in an ice-water bath device to ensure a low temperature ...

Embodiment 2

[0039] Preparation of molybdenum disulfide nanosheet / hexagonal boron nitride nanosheet / polyimide ternary composite film

[0040] 1) Weigh molybdenum disulfide black powder and triethanolamine at a mass ratio of 1:100, mix and stir evenly. The resulting mixture was ultrasonically treated in an ultrasonic breaker for 8 hours, then centrifuged at 3000 rpm for 20 min, and the supernatant was filtered with a 220 nm filter membrane, and the obtained solid matter was uniformly dispersed with deionized water and filtered again. After three times of dispersion (water dispersion) and filtration (same filter membrane), the few-layer molybdenum disulfide nanosheets on the filter paper were collected and dried in vacuum at 70°C for 8h.

[0041] 2) According to the method of Example 1, hexagonal boron nitride nanosheets (BNNS) and polyamic acid were prepared respectively.

[0042] 3) Add a certain amount of BNNS and molybdenum disulfide nanosheets into the NMP solvent, ultrasonically dispe...

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Abstract

The invention provides a polyimide high-temperature dielectric composite film and a preparation method thereof. The composite film is formed by blending at least one of hexagonal boron nitride nanosheet and molybdenum disulfide nanosheet as well as polyimide. The mass fraction of the hexagonal boron nitride nanosheet is 6% to 12%, and the mass fraction of the molybdenum disulfide nanosheet is 1% to 2%. The introduction of a nanosheet filler not only improves the thermal properties of a polyimide film, but also improves the high temperature dielectric properties that a conventional PI film hasnot been involved. The composite film has the advantages of low dielectric loss, high breakdown strength, energy storage density and energy storage efficiency at normal temperature, and keeps low conductance loss and high breakdown field strength and energy storage density at the temperature of 150 DEG C.

Description

technical field [0001] The invention relates to the technical field of composite film materials, in particular to a polyimide high-temperature dielectric composite film and a preparation method thereof. Background technique [0002] The increasing interest in electric energy storage has also greatly aroused scientists' interest in the study of flexible dielectric materials. In order to meet the application of emerging high energy density (UE)-capacitors in hybrid electric vehicles, electronic weapon systems, etc., advanced dielectric materials include high energy, high power density, good processing performance, environmental protection, flexible energy storage, etc. Performance puts forward higher requirements, especially in terms of high temperature resistance, which poses greater challenges. [0003] Polyimide (PI) refers to a class of polymers containing imide rings (-CO-NH-CO-) on the main chain, among which polymers containing phthalimide structures are the most impor...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L79/08C08K7/00C08K3/38C08K3/30C08J5/18
CPCC08J5/18C08J2379/08C08K7/00C08K2003/3009C08K2003/385C08K2201/011
Inventor 胡国华吴丙钊王珊熊传溪
Owner WUHAN UNIV OF TECH
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