Tin, lead and indium-based solder alloy for photovoltaic solder strip and preparation method thereof
A photovoltaic ribbon and alloy technology, which is applied in welding equipment, metal processing equipment, welding/cutting media/materials, etc., can solve the problems of obvious stress concentration of cells, uneven temperature changes, influence of cell strength, etc., and achieve spreading Excellent performance, good oxidation resistance, excellent wetting performance
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[0022] The present invention also provides a method for preparing a tin-lead-indium-based solder alloy for photovoltaic ribbons, the specific steps are as follows:
[0023] Step 1, weighing each metal particle raw material: respectively weighing tin particles, lead particles, indium particles and gallium particles with a purity of 99.99%, so that each component in the alloy satisfies the following conditions by mass percentage: Sn58%-63%, Pb 33%-40%, In1%-3%, Ga 0.1%-1%, the sum of the mass percentages of the above components is 100%;
[0024] Step 2, performing ultrasonic cleaning on the metal particle raw materials weighed in step 1, the time of ultrasonic cleaning is 20min-40min;
[0025] Step 3, smelting the metal particle raw materials after ultrasonic cleaning in step 2, heating to melt, to obtain tin-lead-indium-gallium alloy, using KCl+LiCl molten salt with a mass ratio of 1.25:1 in the smelting process Protect;
[0026] Step 3.1, putting the tin particles, lead part...
Embodiment 1
[0035] A method for preparing a tin-lead-indium-based solder alloy for photovoltaic ribbons, the specific steps are as follows:
[0036] Step 1, weighing each metal particle raw material: Weighing tin particles, lead particles, indium particles and gallium particles with a purity of 99.99% respectively, so that each component in the alloy satisfies the following conditions by mass percentage: Sn58%, Pb 40% , In 1%, Ga1%, the sum of the mass percentages of the above components is 100%;
[0037] Step 2, performing ultrasonic cleaning on the metal particle raw materials weighed in step 1, and the ultrasonic cleaning time is 20 minutes;
[0038] Step 3, smelting the metal particle raw materials after ultrasonic cleaning in step 2, heating to melting, using KCl+LiCl molten salt with a mass ratio of 1.25:1 for protection during the smelting process;
[0039] Step 3.1, putting the tin particles, lead particles and indium particles after ultrasonic cleaning in step 2 into a ceramic c...
Embodiment 2
[0044] A method for preparing a tin-lead-indium-based solder alloy for photovoltaic ribbons, the specific steps are as follows:
[0045] Step 1, Weigh the raw materials of each metal particle: Weigh tin particles, lead particles, indium particles and gallium particles with a purity of 99.99% respectively, so that each component in the alloy satisfies the following conditions by mass percentage: Sn63%, Pb 33% , In 3%, Ga1%, the sum of the mass percentages of the above components is 100%;
[0046] Step 2, carrying out ultrasonic cleaning on each metal particle raw material weighed in step 1, the time of ultrasonic cleaning is 40min;
[0047] Step 3, smelting the metal particle raw materials after ultrasonic cleaning in step 2, heating to melting, using KCl+LiCl molten salt with a mass ratio of 1.25:1 for protection during the smelting process;
[0048] Step 3.1, putting the tin particles, lead particles and indium particles after ultrasonic cleaning in step 2 into a ceramic cru...
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