Silicon-aluminum-alloy-case-based three-dimensional assembling and packaging structure of microwave module

Abstract

The invention discloses a silicon-aluminum-alloy-case-based three-dimensional assembling and packaging structure of a microwave module. The assembling and packaging structure comprises a split type case body and one or more functional units. The case body includes an inner cavity type shell and one and more flat type cover plates; the shell includes one or more inner cavities. In packaging, the inner cavity is in sealed connection by the cover plate; the function units are assembled to the bottom of the inner cavity and the inner side of the cover plate; and the case body is formed by stackingof at least three different silicon-aluminum alloy material with different components. The assembling and packaging structure has the following beneficial effects: three-dimensional assembling and packaging inside the microwave module are realized; compared with the traditional microwave module only assembling components at the bottom of the inner cavity of the shell, the assembling and packagingstructure enables the integration rate to be improved by two for four times; and with the silicon aluminum alloy, the size and the mass are reduced, the thermal stress reliability is improved, and the heat dissipation performance is enhanced.

Description

technical field [0001] The invention relates to an electronic packaging technology, in particular to a three-dimensional assembly and packaging structure of a microwave module based on a silicon-aluminum alloy box. Background technique [0002] Modern airborne and spaceborne radar systems have multiple functions, light load, small space, and low power consumption, which is reflected in the urgent technical requirements for lightweight, integrated, and high reliability in radar system engineering research. T / R components and other microwave modules, which are important components of modern radars such as phased array radars and spaceborne SAR radar systems, can account for 60-70% of the cost of the entire radar, and are often the most integrated, lightweight components in radar systems. For components with the highest requirements for quantification and reliability, how to design microwave modules such as T / R components that meet the requirements of quality, volume, integrati...

AI Technical Summary

Problems solved by technology

[0004] However, the packaging design form of this microwave module is still limited in integration. It can only be two-dimensionally assembled or packaged in the single cavity of the housing, including electronic circuits such as heat sinks, bare chips, components, and substrates. Meet the urgent requirements of microwave multi-chip modules in phased array radar for high integration of three-dimensional and three-dimensional components

In addition, conventional three-dimensional stacked or three-dimensionally assembled microwave multi-chip modules are mostly simple and mechanically repetitive stacked, with low integration and cannot be directly hermetically packaged.

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