Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Water-soluble photosensitive resin composition, cover film and circuit board

A photosensitive resin, water-soluble technology, applied in the direction of circuit substrate materials, printed circuits, printed circuit manufacturing, etc., can solve problems such as easy pollution of the environment, hidden safety hazards, environmental pollution, etc., achieve strong adhesion, save resources, and reduce storage costs Effect

Active Publication Date: 2018-07-10
ZHEN DING TECH CO LTD
View PDF8 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the use of organic solvents is not only easy to pollute the environment, but also accumulates in the exhaust pipe of the oven for a long time after evaporation, which poses a safety hazard
In addition, in the process of using the above-mentioned solder resist green paint ink to make circuit boards, the developer that needs to be used in the development process is an alkaline aqueous solution or an organic developer, which will cause environmental pollution and waste of resources.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Water-soluble photosensitive resin composition, cover film and circuit board
  • Water-soluble photosensitive resin composition, cover film and circuit board
  • Water-soluble photosensitive resin composition, cover film and circuit board

Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0052] The preparation method of the water-soluble photosensitive resin composition can be as follows: adding polymers containing oxazoline groups, photosensitive monomers, photoinitiators, colorants and pure water into the reaction bottle according to a predetermined ratio, mixing and stirring, The polymer containing the oxazoline group, the photosensitive monomer, the photoinitiator and the colorant are mixed evenly to obtain the water-soluble photosensitive resin composition. The amount of pure water added can be changed as required, as long as the polymer containing oxazoline group, photosensitive monomer, photoinitiator, and colorant can be completely dissolved or dispersed.

[0053] see figure 1 , a cover film 100 comprising a photosensitive resin layer 20 and a release film 10 bonded to at least one surface of the photosensitive resin layer 20 . The photosensitive resin layer 20 is formed by coating the above water-soluble photosensitive resin composition on the surfac...

Embodiment 1

[0058] Add 100 g of oxazoline-based polymer, 40 g of ethoxylated trimethylolpropane tri(meth)acrylate, 8 g of phenyl bis(2,4,6-tri Toluyl)phosphine oxide, 2g of colorant, 100g of pure water, and 30g of barium sulfate were stirred and dissolved to obtain a water-soluble photosensitive resin composition.

[0059] Wherein, the molecular weight of the polymer containing oxazoline groups is 20000 g / mol.

Embodiment 2

[0061] To a reaction flask with a volume of 500ml, 100g of polymer containing oxazoline group, 20g of ethoxylated trimethylolpropane tri(meth)acrylate, 8g of phenylbis(2,4,6-tri Toluyl)phosphine oxide, 2g of colorant, 100g of pure water, and 15g of barium sulfate were stirred and dissolved to obtain a water-soluble photosensitive resin composition.

[0062] Wherein, the molecular weight of the polymer containing oxazoline groups is 20000 g / mol.

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Acid valueaaaaaaaaaa
Epoxy equivalentaaaaaaaaaa
Molecular weightaaaaaaaaaa
Login to View More

Abstract

A water-soluble photosensitive resin composition comprises a polymer containing oxazolinyl, a photosensitive monomer and a photoinitiator, wherein the polymer containing oxazolinyl, the photosensitivemonomer and the photoinitiator have water solubility or water dispersibility, the polymer containing oxazolinyl and the photosensitive monomer contain carbon-carbon double bonds, and under irradiation of ultraviolet light, the polymer containing oxazolinyl and the photosensitive monomer can be in cross-linking reaction under initiation of a photoinitiator and then are solidified to form a compactnet-shaped structure. The photosensitive resin layer prepared from the water-soluble photosensitive resin composition has waterborne developing property. Compared with an existing photosensitive resin composition which takes an organic solvent as a solvent and needs to develop under an alkaline condition, the water-soluble photosensitive resin composition has the advantages of environmental protection, safety and resource conservation. Furthermore, the invention provides a covering film prepared from the water-soluble photosensitive resin composition and a circuit board manufactured by use ofthe covering film.

Description

technical field [0001] The invention relates to a water-soluble photosensitive resin composition, a cover film made from the water-soluble photosensitive resin composition, and a circuit board made using the cover film. Background technique [0002] In recent years, printed circuit boards have been widely used in various electronic products. At present, the photosensitive materials used in printed circuit boards are mainly solder resist green paint inks, which can provide a heat-resistant, moisture-resistant, and chemical-resistant outer protective layer for exposed conductive lines to prevent soldering. Lead or solder can cause short circuit of the circuit, and at the same time, it can protect the metal conductive circuit from the corrosion of corrosive solutions such as acid and alkali. [0003] At present, the solder resist green paint inks on the market need to use a large amount of organic solvents such as monomethyl ether propylene glycol acetate (PGMEA), butanone (ME...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G03F7/027H05K1/03H05K3/28
CPCG03F7/027H05K1/0353H05K3/287
Inventor 颜振锋李昌鸿林义芳萧嬿芹向首睿徐茂峰
Owner ZHEN DING TECH CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com