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Ceramic component and molding process thereof, and electronic equipment

A molding process and technology of electronic equipment, applied in the direction of electrical equipment shell/cabinet/drawer, electrical components, rack/frame structure, etc., can solve the problems of waste of resources, low brittleness of ceramic parts, complicated processing procedures, etc., to avoid resource The effect of waste, simplifying the processing process, and improving the processing efficiency

Active Publication Date: 2018-06-26
BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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Problems solved by technology

[0004] However, compared with metal materials, ceramic parts have stronger hardness and are not easy to be machined or CNC formed, resulting in low machining accuracy of ceramic parts, complex and time-consuming processing procedures, and extremely low efficiency; at the same time, due to the The brittleness and poor ductility of the parts make it easy to break or crack the ceramic parts during processing. Therefore, the processing cost of the ceramic parts is high, the yield rate is low, and it is easy to generate a lot of waste of resources.

Method used

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  • Ceramic component and molding process thereof, and electronic equipment
  • Ceramic component and molding process thereof, and electronic equipment
  • Ceramic component and molding process thereof, and electronic equipment

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Embodiment Construction

[0032] Reference will now be made in detail to the exemplary embodiments, examples of which are illustrated in the accompanying drawings. When the following description refers to the accompanying drawings, the same numerals in different drawings refer to the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with aspects of the present application as recited in the appended claims.

[0033] The terminology used in this application is for the purpose of describing particular embodiments only, and is not intended to limit the application. As used in this application and the appended claims, the singular forms "a", "the", and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise. It should also be understood that the term...

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Abstract

The invention relates to a ceramic component and a molding process thereof, and electronic equipment. The molding process includes the steps that a ceramic part is obtained through sintering; the ceramic part is placed into a preset position in an injection mold; and preset injection molding materials are injected into the injection mold, and the ceramic component formed by combining the ceramic part and the preset injection molding materials is obtained through injection molding. Through the technical scheme of the invention, the processing process of the ceramic component can be simplified,production efficiency can be improved, processing precision can be improved, and the yield of the ceramic component is increased advantageously.

Description

technical field [0001] The present disclosure relates to the technical field of terminals, and in particular to a ceramic component, a molding process thereof, and electronic equipment. Background technique [0002] Ceramic materials have a smooth surface, excellent grip, and excellent hardness and wear resistance, so they are increasingly used in the structures and components of electronic devices such as mobile phones and tablets. [0003] The ceramic molding process in the related art completely refers to the processing process for metal materials such as aluminum alloy and stainless steel, that is, after the ceramic parts are sintered, the structure is formed by machining or CNC (numerical control machine tool), and then through subsequent dispensing, Gluing, welding, and more combine ceramic parts with other complex structures. [0004] However, compared with metal materials, ceramic parts have stronger hardness and are not easy to be machined or CNC formed, resulting ...

Claims

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Application Information

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IPC IPC(8): B29C45/14B22D19/00H05K5/00H05K7/18
CPCB22D19/00B29C45/14B29C45/1418B29C2045/14237H05K5/00H05K7/18
Inventor 王少杰冉建波李金超
Owner BEIJING XIAOMI MOBILE SOFTWARE CO LTD
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