Internally embedded component packaging method and the internally embedded component packaging structure

A technology of embedded components and packaging structures, which is applied in the direction of assembling printed circuits with electrical components, printed circuits connected with non-printed electrical components, and electrical components. It can solve the problems of complex substrate processing technology and low production efficiency, and achieve The effect of reducing the process of receiving tanks and drilling, improving production efficiency, and simplifying the processing process

Active Publication Date: 2016-12-07
SHENNAN CIRCUITS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, because the existing technology needs to provide accommodation grooves and drill holes on the substrate, the processing technology of the substrate is complicated and the production efficiency is low.

Method used

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  • Internally embedded component packaging method and the internally embedded component packaging structure
  • Internally embedded component packaging method and the internally embedded component packaging structure
  • Internally embedded component packaging method and the internally embedded component packaging structure

Examples

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Embodiment Construction

[0047]Embodiments of the present invention provide a method for packaging embedded components and a package structure for embedded components, which are used to simplify the processing flow and improve production efficiency.

[0048] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts fall within the protection scope of the present invention.

[0049] see figure 1 , an embodiment of an embedded component packaging method in an embodiment of the present invention includes:

[0050] 101. Provide embedded components and an L-shaped first metal frame.

[0051] Wherein, the embedded element includ...

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PUM

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Abstract

According to one embodiment of the invention, an internally embedded component packaging method is provided to simplify the processing procedures and increase production efficiency. The method comprises the following steps: providing an internally embedded component and an L-shaped first metal frame. The internally embedded component comprises a first welding plate and a second welding plate that are disposed symmetrically; the first L-shaped metal frame comprises a first metal section and a second metal section, both being perpendicular to each other. The length of the first metal section is greater than that of the internally embedded component and the length of the second metal section is equal to the thickness of the internally embedded component. The first welding plate is connected with the first metal section so that the projection zones of the internally embedded component and the second metal section in the horizontal direction are overlapped. According to the embodiment of the invention, an internally embedded component packaging structure is also provided to simplify the processing procedures and increase production efficiency.

Description

technical field [0001] The invention relates to the technical field of electronic components, in particular to a packaging method for embedded components and a packaging structure for embedded components. Background technique [0002] Embedded components, as basic elements in electronic circuits, are usually individually packaged and have metal contacts (pads) at the upper and lower ends respectively. The embedded components must be conducted through the upper and lower pads on the embedded component. , to realize the function of the embedded component. [0003] In the prior art, the common way to conduct the embedded element through the upper and lower pads on the embedded element is to package the embedded element in a printed circuit board (Printed Circuit Board, PCB), so as to realize the The conduction of embedded components, the specific process is: open a storage tank in the substrate, place the embedded components in the storage tank, then drill a hole on the substr...

Claims

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Application Information

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IPC IPC(8): H01L23/48H01L23/31H05K3/32H05K1/18H01L21/60
CPCH01L2224/40245
Inventor 丁鲲鹏黄达利邵冬冬
Owner SHENNAN CIRCUITS
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